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T1210SH

STMicroelectronics

T1210SH by STMicroelectronics

T1210SH by STMicroelectronics is a TRIAC designed for AC control applications. It features a max RMS on-state current of 12 A, a repetitive peak off-state voltage of 700 V, and operates b/w -40 °C to 125 °C. Ideal for switching and controlling loads in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,210 parts In-Stock

1+ parts

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4,210

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Anansix

USA . 2,374 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,374

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Vyrian

USA . 1,619 parts In-Stock

1+ parts

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100+ parts

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1,619

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,786 parts In-Stock

1+ parts

$3.060

100+ parts

-

1k+ parts

$2.754

10k+ parts

-

1,786

$3.060

-

$2.754

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MKK Technologies

India . 1,850 parts In-Stock

1+ parts

$5.754

100+ parts

-

1k+ parts

-

10k+ parts

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1,850

$5.754

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DigiPath Technology Company

USA . 1,850 parts In-Stock

1+ parts

$5.754

100+ parts

-

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10k+ parts

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1,850

$5.754

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Corphita

USA . 4,921 parts In-Stock

1+ parts

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4,921

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Parana Technologies

USA . 1,840 parts In-Stock

1+ parts

-

100+ parts

$3.659

1k+ parts

-

10k+ parts

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1,840

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$3.659

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Overview

Unlock unparalleled performance with the T1210SH TRIAC from STMicroelectronics, a trusted leader in semiconductor innovation. Designed for robust AC applications, this high-quality component offers impressive efficiency and reliability, ensuring optimal control and durability. Whether powering lighting systems or motor controls, its superior design delivers exceptional value, making it the go-to choice for engineers seeking quality and performance in every project. Elevate your solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this TRIAC suitable for various applications.

Maximum DC Gate Trigger Current: 25 mA

A relatively low gate trigger current allows for compatibility with low-power circuits, enhancing its versatility.

Configuration: SINGLE

The single configuration simplifies the design and integration process in electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy placement and assembly in PCB layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and better thermal dissipation, improving reliability.

Maximum Leakage Current: 2 mA

A low leakage current contributes to energy efficiency and minimizes unwanted power loss in applications.

No. of Terminals: 3

The three-terminal design allows for straightforward connection and integration into various electronic configurations.

Package Style (Meter): FLANGE MOUNT

Flange mount style supports secure installation, ensuring stability and preventing loosening in high-vibration environments.

Maximum Operating Temperature: 125 °C

A high operating temperature rating allows this TRIAC to function well in demanding environments.

Trigger Device Type: TRIAC

Being a TRIAC allows for efficient control of AC currents, making it ideal for use in light dimmers and motor controls.

Minimum Operating Temperature: -40 °C

This wide temperature range makes the TRIAC suitable for use in harsh climate conditions without performance issues.

Terminal Finish: Matte Tin (Sn)

The matte tin finish enhances solderability and protects against oxidation, ensuring reliable electrical connections.

Terminal Position: SINGLE

The single terminal position simplifies the layout, helping in space-constrained designs.

Maximum RMS On-state Current: 12 A

A maximum RMS on-state current of 12 A indicates strong performance capability for handling significant loads.

Maximum DC Gate Trigger Voltage: 2.5 V

With a low gate trigger voltage, the device is compatible with low-voltage control systems, enhancing usability.

Repetitive Peak Off-state Voltage: 700 V

A high off-state voltage rating means this TRIAC can easily manage high-voltage applications without failure.

Minimum Critical Rate of Rise of Off-state Voltage: 200 V/us

This characteristic allows the TRIAC to handle fast transients which is crucial for protecting sensitive components.

Maximum Holding Current: 50 mA

A low holding current ensures that the TRIAC can turn off effectively, enhancing switching efficiency in AC circuits.

Technical Specifications

Triode For Alternating Current (TRIAC) T1210SH attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

200 V/us

Maximum DC Gate Trigger Current:

25 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Maximum Holding Current:

50 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Maximum RMS On-state Current:

12 A

Repetitive Peak Off-state Voltage:

700 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T1210SH Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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