Loading...

T1012SH

STMicroelectronics

T1012SH by STMicroelectronics

STMicroelectronics T1012SH is a 4-quadrant logic level TRIAC with max. RMS on-state current of 10A and repetitive peak off-state voltage of 700V. It operates b/w -40 to 125 °C, ideal for AC power control applications requiring high reliability and low leakage current.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,883 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,883

-

-

-

-

Vyrian

USA . 2,009 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,009

-

-

-

-

Anansix

USA . 586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

586

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,178 parts In-Stock

1+ parts

$1.899

100+ parts

-

1k+ parts

$1.709

10k+ parts

-

2,178

$1.899

-

$1.709

-

MKK Technologies

India . 1,222 parts In-Stock

1+ parts

$3.571

100+ parts

-

1k+ parts

-

10k+ parts

-

1,222

$3.571

-

-

-

DigiPath Technology Company

USA . 1,222 parts In-Stock

1+ parts

$3.571

100+ parts

-

1k+ parts

-

10k+ parts

-

1,222

$3.571

-

-

-

Parana Technologies

USA . 1,439 parts In-Stock

1+ parts

-

100+ parts

$2.270

1k+ parts

-

10k+ parts

-

1,439

-

$2.270

-

-

Corphita

USA . 1,426 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,426

-

-

-

-

Overview

Upgrade your home automation system with the T1012SH by STMicroelectronics, a top-quality TRIAC that offers exceptional performance and reliability. Manufactured by industry leader STMicroelectronics, this device is designed for seamless integration into a variety of applications, providing customers with unparalleled value and peace of mind. With its impressive specifications and 4-quadrant logic level trigger device type, the T1012SH ensures smooth operation and superior functionality, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring long-term reliability and ease of handling.

Maximum DC Gate Trigger Current: 50 mA

The high DC gate trigger current allows for efficient and reliable switching of the TRIAC, making it suitable for various applications.

Configuration: SINGLE

The single configuration simplifies the design and installation process, making it easy to use and integrate into existing systems.

Package Shape: RECTANGULAR

The rectangular shape of the package provides versatility in mounting options and allows for efficient use of space in the application.

Terminal Form: THROUGH-HOLE

The through-hole terminal form enables secure and stable connection during installation, ensuring reliable operation of the TRIAC.

Maximum Leakage Current: 2 mA

The low maximum leakage current helps in conserving power and reducing heat dissipation, enhancing the efficiency of the TRIAC.

No. of Terminals: 3

Having 3 terminals provides flexibility in the wiring configuration and allows for easy connection to external circuits.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure and stable mounting on a surface, providing mechanical support and reliability.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the TRIAC can perform reliably in a wide range of environmental conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level TRIAC offers precise control and efficient switching, making it suitable for diverse applications requiring accurate performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the TRIAC to function effectively in cold environments without compromising performance.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good conductivity and corrosion resistance, ensuring long-term reliability and stable electrical connections.

Terminal Position: SINGLE

The single terminal position simplifies the wiring process and ensures easy connection to external circuits, enhancing usability.

Maximum RMS On-state Current: 10 A

The high maximum RMS on-state current capacity allows the TRIAC to handle high power loads efficiently and reliably.

Maximum DC Gate Trigger Voltage: 2.5 V

The low maximum DC gate trigger voltage ensures efficient and precise triggering of the TRIAC, enhancing overall performance.

Repetitive Peak Off-state Voltage: 700 V

The high repetitive peak off-state voltage rating makes the TRIAC suitable for applications requiring high voltage handling capability.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

The high minimum critical rate of rise of off-state voltage allows the TRIAC to respond quickly to voltage fluctuations, ensuring stability in operation.

Maximum Holding Current: 100 mA

The high maximum holding current ensures reliable latching of the TRIAC in the on-state, maintaining continuous conduction under load conditions.

Technical Specifications

Triode For Alternating Current (TRIAC) T1012SH attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Maximum Holding Current:

100 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

10 A

Repetitive Peak Off-state Voltage:

700 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T1012SH Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 15