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T1010MH

STMicroelectronics

T1010MH by STMicroelectronics

T1010MH by STMicroelectronics is a TRIAC with 10A RMS on-state current, 600V repetitive peak off-state voltage, and 25mA max DC gate trigger current. Ideal for applications requiring precise AC power control such as dimmers, motor speed controllers, and heating regulators.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,563 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,563

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Anansix

USA . 1,390 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,390

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-

-

-

Digiode

USA . 1,085 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,085

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-

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Lakeland Logistics Inc

USA . 33 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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33

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Bristol Electronics

USA . 33 parts In-Stock

1+ parts

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100+ parts

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33

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,837 parts In-Stock

1+ parts

$4.467

100+ parts

-

1k+ parts

$4.020

10k+ parts

-

1,837

$4.467

-

$4.020

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MKK Technologies

India . 681 parts In-Stock

1+ parts

$8.399

100+ parts

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681

$8.399

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DigiPath Technology Company

USA . 681 parts In-Stock

1+ parts

$8.399

100+ parts

-

1k+ parts

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681

$8.399

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Parana Technologies

USA . 1,683 parts In-Stock

1+ parts

-

100+ parts

$5.340

1k+ parts

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1,683

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$5.340

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Corphita

USA . 970 parts In-Stock

1+ parts

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970

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Overview

Discover the T1010MH by STMicroelectronics, a high-quality TRIAC designed to meet your alternating current needs. With a reputation for excellence, STMicroelectronics delivers reliable and innovative solutions for a wide range of applications. The T1010MH offers superior performance with its 10A maximum RMS on-state current and 600V repetitive peak off-state voltage. Whether you're looking for precision control or efficient power management, this product provides exceptional value and benefits to customers seeking top-notch TRIAC solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and makes the product durable and reliable.

Maximum DC Gate Trigger Current: 25 mA

Allows for precise triggering and control of the TRIAC, ensuring efficient operation.

Configuration: SINGLE

Simplified design with a single configuration makes installation and usage easier.

Package Shape: RECTANGULAR

Space-efficient design that can easily fit into various electronic setups.

Terminal Form: THROUGH-HOLE

Provides secure connections for stable performance in different application environments.

Maximum Leakage Current: 2 mA

Low leakage current helps in reducing power losses and improving overall efficiency.

No. of Terminals: 3

Simple three-terminal setup for straightforward installation and connectivity.

Package Style (Meter): FLANGE MOUNT

Secure mounting option for easy integration into equipment and systems.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliable performance even in harsh conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

Enhanced control and versatility in switching applications with the logic-level design.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in cold environments without compromising performance.

Terminal Finish: MATTE TIN

Corrosion-resistant finish for reliable connections and long-term use.

Terminal Position: SINGLE

Simplified terminal layout for easy connection and setup.

Maximum RMS On-state Current: 10 A

High current rating for handling heavy loads and current surges efficiently.

Maximum DC Gate Trigger Voltage: 2.5 V

Low trigger voltage for precise control and low power consumption.

Repetitive Peak Off-state Voltage: 600 V

High off-state voltage for reliable isolation and protection against voltage spikes.

Minimum Critical Rate of Rise of Off-state Voltage: 200 V/us

Fast response time to voltage changes ensures quick switching and protection.

Maximum Holding Current: 50 mA

Adequate holding current for stable operation and preventing false triggering.

Technical Specifications

Triode For Alternating Current (TRIAC) T1010MH attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

200 V/us

Maximum DC Gate Trigger Current:

25 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Maximum Holding Current:

50 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

10 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T1010MH Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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