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T1012NH

STMicroelectronics

T1012NH by STMicroelectronics

STMicroelectronics T1012NH is a TRIAC with 10A RMS on-state current, 800V repetitive peak off-state voltage, and 50mA max DC gate trigger current. It's a 4-quadrant logic level TRIAC ideal for AC applications like dimmers, motor speed control, and heating regulation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,988 parts In-Stock

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3,988

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Vyrian

USA . 1,853 parts In-Stock

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1,853

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Anansix

USA . 854 parts In-Stock

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854

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Fibra_Brandt Electronic GMBH

Germany . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,282 parts In-Stock

1+ parts

$2.572

100+ parts

-

1k+ parts

$2.315

10k+ parts

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2,282

$2.572

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$2.315

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MKK Technologies

India . 590 parts In-Stock

1+ parts

$4.837

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590

$4.837

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DigiPath Technology Company

USA . 590 parts In-Stock

1+ parts

$4.837

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590

$4.837

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Corphita

USA . 4,300 parts In-Stock

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4,300

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Parana Technologies

USA . 194 parts In-Stock

1+ parts

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$3.076

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194

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$3.076

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Assy Fe

Spain . 5 parts In-Stock

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5

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Overview

Unlock the power of efficient AC control with the T1012NH Triode For Alternating Current (TRIAC) by STMicroelectronics. Crafted with precision and quality, this single configuration TRIAC offers seamless performance in a wide range of applications. From lighting control to motor speed regulation, this device delivers reliable operation with a maximum RMS on-state current of 10A and repetitive peak off-state voltage of 800V. Trust in STMicroelectronics to provide cutting-edge technology that enhances your projects and brings value to your designs. Experience the difference with the T1012NH TRIAC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the TRIAC, ensuring a longer lifespan.

Maximum DC Gate Trigger Current: 50 mA

Allows for reliable and consistent triggering of the TRIAC, ensuring stable performance.

Configuration: SINGLE

Simplified design with single configuration makes installation and use easier.

Package Shape: RECTANGULAR

Space-efficient design allows for easy integration into various electronic circuits and systems.

Terminal Form: THROUGH-HOLE

Facilitates easy and secure connection of the TRIAC to circuit boards and other components.

Maximum Leakage Current: 2 mA

Low leakage current helps in conserving power and preventing unnecessary energy loss.

No. of Terminals: 3

Simplified terminal design makes connection and wiring straightforward.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows for easy installation and secure mounting in various applications.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliable performance in various environmental conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

Allows for precise and controlled triggering of the TRIAC, enhancing the efficiency of the device.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions without compromising performance.

Terminal Finish: MATTE TIN

Matte tin finish provides a stable and reliable connection for the terminals, enhancing overall reliability.

Terminal Position: SINGLE

Simplified terminal layout makes installation and connection easier and more efficient.

Maximum RMS On-state Current: 10 A

High on-state current handling capability allows for operation of heavy loads and high-power applications.

Maximum DC Gate Trigger Voltage: 2.5 V

Low gate trigger voltage ensures efficient and reliable triggering of the TRIAC.

Repetitive Peak Off-state Voltage: 800 V

High off-state voltage rating provides protection against voltage spikes and surges, ensuring device longevity.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

Fast rate of rise of off-state voltage helps in quick response to voltage changes, enhancing device protection.

Maximum Holding Current: 100 mA

Sufficient holding current ensures stable operation and prevents unintentional turn-off of the TRIAC.

Technical Specifications

Triode For Alternating Current (TRIAC) T1012NH attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Maximum Holding Current:

100 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

10 A

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T1012NH Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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