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T1010H-6G-TR

STMicroelectronics

T1010H-6G-TR by STMicroelectronics

T1010H-6G-TR by STMicroelectronics is a TRIAC designed for AC control applications. It features a max RMS on-state current of 10 A, operates b/w -40 °C to 150 °C, and supports surface mount with a compact SO package. Ideal for switching and dimming circuits.

Median Price

$0.445

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.445

10k+ parts

$0.425

4,000

-

-

$0.445

$0.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,712 parts In-Stock

1+ parts

$1.606

100+ parts

-

1k+ parts

-

10k+ parts

-

1,712

$1.606

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Vyrian

USA . 2,397 parts In-Stock

1+ parts

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2,397

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Anansix

USA . 121 parts In-Stock

1+ parts

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121

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,292 parts In-Stock

1+ parts

$0.357

100+ parts

-

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4,292

$0.357

-

-

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Corphita

USA . 2,836 parts In-Stock

1+ parts

$1.521

100+ parts

-

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2,836

$1.521

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IDEA Electronic Components Group

UK . 2,124 parts In-Stock

1+ parts

$2.601

100+ parts

-

1k+ parts

$2.341

10k+ parts

-

2,124

$2.601

-

$2.341

-

MKK Technologies

India . 1,561 parts In-Stock

1+ parts

$4.891

100+ parts

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1,561

$4.891

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DigiPath Technology Company

USA . 1,561 parts In-Stock

1+ parts

$4.891

100+ parts

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1,561

$4.891

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Perfect Parts

USA . 11,024 parts In-Stock

1+ parts

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11,024

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Microchip USA

USA . 5,617 parts In-Stock

1+ parts

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5,617

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Parana Technologies

USA . 1,702 parts In-Stock

1+ parts

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100+ parts

$3.110

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10k+ parts

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1,702

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$3.110

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Overview

Elevate your projects with the T1010H-6G-TR TRIAC from STMicroelectronics, a leader in high-quality semiconductor solutions. Designed for robust performance in diverse applications, this compact device ensures reliable control of AC loads while handling extreme temperatures with ease. Benefit from its efficient surface mount design and superior gate trigger capabilities, making it perfect for industrial automation, lighting control, and HVAC systems. Trust in STMicroelectronics to power your innovations!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making the TRIAC suitable for various applications.

Maximum DC Gate Trigger Current: 10 mA

A low maximum gate trigger current of 10 mA ensures efficient operation while minimizing power consumption.

Configuration: SINGLE

The single configuration makes this TRIAC compact and easy to integrate into circuit designs.

Surface Mount: YES

Being a surface mount device allows for easy PCB assembly and saves space in electronic designs.

Package Shape: RECTANGULAR

The rectangular package shape is ideal for efficient arrangement on PCBs, optimizing layout.

Terminal Form: GULL WING

Gull wing terminals provide stable connection points for reliable soldering in surface mount applications.

No. of Terminals: 3

Having three terminals allows for versatile connection options and simplifies circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space and allows for a higher density of components on the PCB.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures reliable performance in demanding environments.

Trigger Device Type: TRIAC

This TRIAC design is well-suited for AC control applications, providing efficient switching capabilities.

Minimum Operating Temperature: -40 °C

The wide temperature range makes this TRIAC suitable for applications in harsh conditions.

Terminal Position: DUAL

Dual terminal positioning enhances installation flexibility and layout design.

Maximum RMS On-state Current: 10 A

A maximum RMS on-state current of 10 A is ideal for controlling significant loads in various electrical circuits.

Maximum DC Gate Trigger Voltage: 1 V

A low maximum gate trigger voltage of 1 V translates to low power consumption for control signals.

Repetitive Peak Off-state Voltage: 600 V

The high repetitive peak off-state voltage allows this TRIAC to handle high-voltage applications safely.

Minimum Critical Rate of Rise of Commutation Voltage: 3.8 V/μs

A low critical rate of rise of commutation voltage enhances switching stability in dynamic environments.

Minimum Critical Rate of Rise of Off-state Voltage: 75 V/μs

This specification ensures quick response times, allowing for efficient operation in fast-switching applications.

Maximum Holding Current: 25 mA

A low maximum holding current leads to efficient operation with minimal power wastage in control circuits.

Technical Specifications

Triode For Alternating Current (TRIAC) T1010H-6G-TR attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

3.8 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

75 V/us

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

1 V

Maximum Holding Current:

25 mA

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum RMS On-state Current:

10 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

T1010H-6G-TR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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