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STW9N80K5

STMicroelectronics

STW9N80K5 by STMicroelectronics

STW9N80K5 from STMicroelectronics is an N-channel FET designed for switching applications, featuring a max drain-source voltage of 800V and a pulsed drain current of 28A. It operates in enhancement mode with a power dissipation of up to 110W. Ideal for high-voltage circuits, it ensures reliable performance in demanding environments.

Median Price

$3.690

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 38 parts In-Stock

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$3.090

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38

$3.090

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Mouser Electronics

USA . 401 parts In-Stock

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$3.690

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$1.810

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$1.460

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$1.440

401

$3.690

$1.810

$1.460

$1.440

DigiKey

USA . 396 parts In-Stock

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Verical

USA . 36 parts In-Stock

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$3.800

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$3.800

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Digiode

USA . 1,982 parts In-Stock

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$2.802

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Vyrian

USA . 7,280 parts In-Stock

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Anansix

USA . 937 parts In-Stock

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Cyclops Electronics Ltd

UK . 930 parts In-Stock

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IDEA Electronic Components Group

UK . 1,190 parts In-Stock

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$0.408

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$0.368

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1,190

$0.408

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$0.368

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MKK Technologies

India . 521 parts In-Stock

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$0.768

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521

$0.768

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DigiPath Technology Company

USA . 521 parts In-Stock

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$0.768

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$0.768

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Corphita

USA . 2,224 parts In-Stock

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$2.655

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Microchip USA

USA . 2,988 parts In-Stock

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$20.930

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Kepictronics

USA . 6,340 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,351 parts In-Stock

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Authorized Procurement Solutions

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Epart123

USA . 930 parts In-Stock

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$1.500

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GreenTree Electronics

Israel . 930 parts In-Stock

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Parana Technologies

USA . 13 parts In-Stock

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$0.488

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$0.488

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Overview

Elevate your designs with the STW9N80K5 from STMicroelectronics, a powerhouse in power FET technology. Known for exceptional quality and reliability, STMicroelectronics delivers this N-channel transistor that excels in switching applications. With an impressive breakdown voltage of 800V and robust performance up to 150 °C, this versatile component is perfect for industrial, automotive, and energy-efficient systems. Experience the value of superior efficiency and durability—transform your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are often preferred for their higher efficiency and better switching capabilities, enhancing overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for convenient integration in designs, providing additional protection and simplifying usage.

Transistor Application: SWITCHING

Optimized for switching applications, this FET can handle fast switching operations, ideal for power management tasks.

Minimum DS Breakdown Voltage: 800 V

A high breakdown voltage ensures the FET can safely operate in high-voltage applications, enhancing reliability.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy mounting and integration into various circuit layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, making the FET robust against mechanical stress.

Operating Mode: ENHANCEMENT MODE

In enhancement mode, the FET requires a gate voltage to conduct, improving efficiency and control in switching operations.

Maximum Pulsed Drain Current (IDM): 28 A

With a high pulsed drain current rating, this FET can handle significant load currents, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 200 mJ

A robust avalanche energy rating indicates resilience against voltage spikes, enhancing reliability in harsh environments.

No. of Terminals: 3

The three-terminal design simplifies integration in circuits while maintaining functionality.

Maximum Power Dissipation (Abs): 110 W

High power dissipation capabilities ensure effective heat management, allowing for extended operation without failure.

Package Style (Meter): FLANGE MOUNT

Flange mount design simplifies installation and improves thermal performance in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers low on-resistance and fast switching speeds, making it ideal for power electronics.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows for use in environments with extreme thermal conditions.

Transistor Element Material: SILICON

Silicon provides excellent semiconductor properties and is widely used, ensuring reliability and availability.

Minimum Operating Temperature: -55 °C

The ability to operate at very low temperatures makes this FET suitable for extreme environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and corrosion resistance, enhancing the longevity of the connection.

Maximum Drain Current (ID): 7 A

The maximum continuous drain current supports a wide range of applications, from consumer electronics to industrial uses.

Maximum Drain-Source On Resistance: 0.9 ohm

0.9 ohm on-resistance ensures efficient power transfer with minimal loss, enhancing performance and energy efficiency.

Terminal Position: SINGLE

A single terminal position simplifies layout design and integration into various circuit designs.

Case Connection: DRAIN

Direct drain connection simplifies the design and improves the efficiency of power delivery in circuits.

Maximum Feedback Capacitance (Crss): 0.65 pF

Low feedback capacitance minimizes signal distortion, ensuring high-speed performance in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) STW9N80K5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.65 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW9N80K5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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