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STW9NB90

STMicroelectronics

STW9NB90 by STMicroelectronics

STW9NB90 by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 900V breakdown voltage, 38A pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

$15.840

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 56 parts In-Stock

1+ parts

$29.000

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56

$29.000

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Digiode

USA . 3,370 parts In-Stock

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3,370

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Vyrian

USA . 2,313 parts In-Stock

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2,313

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Anansix

USA . 2,113 parts In-Stock

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2,113

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IBS Electronics

USA . 1,777 parts In-Stock

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$2.681

1,777

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-

$2.681

ComSIT Distribution GmbH

Germany . 16 parts In-Stock

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16

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LittleDiode

UK . 4 parts In-Stock

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4

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GES GmbH

Germany . 2 parts In-Stock

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2

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,594 parts In-Stock

1+ parts

$0.384

100+ parts

-

1k+ parts

$0.345

10k+ parts

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1,594

$0.384

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$0.345

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MKK Technologies

India . 2,236 parts In-Stock

1+ parts

$0.721

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2,236

$0.721

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DigiPath Technology Company

USA . 2,236 parts In-Stock

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$0.721

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2,236

$0.721

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Metaverse IC Inc.

Canada . 12,000 parts In-Stock

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12,000

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Kepictronics

USA . 10,000 parts In-Stock

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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6,500

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Corphita

USA . 4,688 parts In-Stock

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4,688

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Parana Technologies

USA . 1,265 parts In-Stock

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100+ parts

$0.459

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1,265

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$0.459

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Overview

Elevate your power management solutions with the STW9NB90 from STMicroelectronics—a leading name in semiconductor innovation. This robust N-channel FET is designed for high-efficiency switching applications, ensuring reliable performance in even the most demanding environments. With its built-in diode and exceptional voltage handling, it offers unparalleled quality and durability, making it perfect for industrial, automotive, and consumer electronics. Choose STMicroelectronics for cutting-edge technology that enhances your designs and drives value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides lightweight and durable construction, making the FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for better performance in high-speed and high-efficiency switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and improves protection against reverse current.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures efficient operation in power management.

Minimum DS Breakdown Voltage: 900 V

A high breakdown voltage makes this FET suitable for high-voltage applications, enhancing reliability.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient space utilization on PCBs.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides robust mechanical support in various environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower on-resistance and higher efficiency, particularly in digital circuits.

Maximum Pulsed Drain Current (IDM): 38 A

This specification enables handling of high transient currents, making it ideal for dynamic applications.

Avalanche Energy Rating (EAS): 600 mJ

A high avalanche energy rating indicates robustness against voltage spikes and improves reliability in harsh conditions.

Maximum Drain Current (Abs) (ID): 9.7 A

This FET can handle substantial current loads, making it versatile for various power applications.

No. of Terminals: 3

The 3-terminal configuration allows for simple connections in a variety of applications.

Maximum Power Dissipation (Abs): 190 W

High power dissipation capability means this FET can operate under considerable loads without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mounting ensures secure installation, offering excellent thermal conductivity and mechanical strength.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides higher efficiency and faster switching capabilities, crucial for modern electronic devices.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature enhances reliability in extreme environments.

Transistor Element Material: SILICON

Silicon is a highly reliable and commonly used material for FETs, ensuring availability and affordability.

Terminal Finish: TIN LEAD

Tin-lead finishes ensure good solderability and durability in connections.

Maximum Drain Current (ID): 9.7 A

This specification reaffirms the FET's ability to handle significant current, making it suitable for demanding applications.

Maximum Drain-Source On Resistance: 1 ohm

Low on-resistance minimizes power loss during operation, enhancing the overall efficiency of the circuit.

Terminal Position: SINGLE

Single terminal position simplifies installation and minimizes space requirements on PCB.

Technical Specifications

Power Field Effect Transistors (FET) STW9NB90 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

600 mJ

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

9.7 A

Maximum Drain Current (ID):

9.7 A

Maximum Drain-Source On Resistance:

1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

38 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW9NB90 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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