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STW9NC80Z

STMicroelectronics

STW9NC80Z by STMicroelectronics

STW9NC80Z by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 9.4 A, a breakdown voltage of 800 V, and operates at up to 150 °C. Ideal for high-power circuits, it ensures reliable performance with built-in diode protection.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,436 parts In-Stock

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4,436

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Vyrian

USA . 4,093 parts In-Stock

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Anansix

USA . 1,278 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 26 parts In-Stock

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LittleDiode

UK . 1 parts In-Stock

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IDEA Electronic Components Group

UK . 2,112 parts In-Stock

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$1.218

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$1.096

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2,112

$1.218

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$1.096

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MKK Technologies

India . 451 parts In-Stock

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$2.291

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451

$2.291

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DigiPath Technology Company

USA . 451 parts In-Stock

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$2.291

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451

$2.291

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Semicontronic

India . 1,648 parts In-Stock

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$24.050

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$23.449

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$23.328

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1,648

$24.050

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$23.328

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Metaverse IC Inc.

Canada . 12,000 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,409 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Parana Technologies

USA . 1,591 parts In-Stock

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$1.456

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Corphita

USA . 749 parts In-Stock

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749

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Perfect Parts

USA . 66 parts In-Stock

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GreenTree Electronics

Israel . 59 parts In-Stock

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Overview

Unlock the power of innovation with the STW9NC80Z from STMicroelectronics—a leader in high-quality semiconductor solutions. This N-channel Power FET is designed for efficient switching applications, offering unparalleled reliability and performance. With its robust breakdown voltage and excellent thermal management, it’s perfect for demanding environments. Experience reduced energy loss and enhanced system efficiency, making your designs not only smarter but also cost-effective!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and helps in protecting the transistor from environmental factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are often more efficient for switching applications, allowing for faster operation and reduced power losses.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides enhanced protection against voltage spikes, making it suitable for applications requiring reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET delivers high-speed operation and improved efficiency in circuit designs.

Minimum DS Breakdown Voltage: 800 V

A high breakdown voltage indicates reliable performance in high-voltage applications, providing added safety margins.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space management in circuit boards, making it easier to design compact systems.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides robust mechanical support and reliable electrical connections, suitable for demanding conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enables the transistor to be switched on and off with minimal power loss, enhancing efficiency.

Maximum Pulsed Drain Current (IDM): 38 A

A high pulsed drain current rating allows for dynamic applications where transient loads are expected, ensuring reliable performance.

Avalanche Energy Rating (EAS): 350 mJ

The substantial avalanche energy rating ensures that the device can handle energy spikes without damage in real-world applications.

Maximum Drain Current (Abs) (ID): 9.3 A

This high maximum drain current allows the FET to power demanding loads effectively, making it suitable for various applications.

No. of Terminals: 3

The three-terminal configuration streamlines circuit integration and simplifies connections, enhancing usability.

Maximum Power Dissipation (Abs): 190 W

A high power dissipation rating means this FET can handle significant power without overheating, crucial for high-performance applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures secure attachment to heatsinks or circuit boards, promoting effective thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high speed and low power operation, making it ideal for modern electronic applications.

Maximum Operating Temperature: 150 °C

The ability to operate at elevated temperatures increases the reliability in harsh environments, expanding its application scope.

Transistor Element Material: SILICON

Silicon elements provide excellent electrical characteristics, contributing to the overall efficiency and performance of the FET.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and reduces oxidation, ensuring reliable long-term performance.

Maximum Drain Current (ID): 9.4 A

This slightly higher drain current rating enhances the versatility of the FET in various electrical applications.

Maximum Drain-Source On Resistance: 0.9 ohm

A low on-resistance value minimizes power losses during operation, increasing the overall efficiency of the power circuit.

Terminal Position: SINGLE

Single terminal position simplifies the integration process in circuit designs, improving assembly efficiency.

Technical Specifications

Power Field Effect Transistors (FET) STW9NC80Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

350 mJ

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

9.3 A

Maximum Drain Current (ID):

9.4 A

Maximum Drain-Source On Resistance:

.9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

38 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW9NC80Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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