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STW9NK70Z

STMicroelectronics

STW9NK70Z by STMicroelectronics

STW9NK70Z by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 700V breakdown voltage, 30A max pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,968 parts In-Stock

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6,968

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Zilex Electronics Inc.

Canada . 1,370 parts In-Stock

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1,370

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Digiode

USA . 721 parts In-Stock

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721

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Anansix

USA . 329 parts In-Stock

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329

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Distributors (Availability)

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$1.435

100+ parts

$1.306

1k+ parts

$1.177

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-

2,000

$1.435

$1.306

$1.177

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IDEA Electronic Components Group

UK . 2,337 parts In-Stock

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$1.642

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$1.478

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2,337

$1.642

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$1.478

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MKK Technologies

India . 1,339 parts In-Stock

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$3.088

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1,339

$3.088

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DigiPath Technology Company

USA . 1,339 parts In-Stock

1+ parts

$3.088

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1,339

$3.088

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AZTECH Wire

Italy . 749 parts In-Stock

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$18.950

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749

$18.950

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Component Stockers USA

USA . 780 parts In-Stock

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$99.990

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780

$99.990

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A-Z Elektronik GmbH

Germany . 7,373 parts In-Stock

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7,373

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Alle Elektronik GmbH

Germany . 3,710 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Corphita

USA . 2,824 parts In-Stock

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Assy Fe

Spain . 2,400 parts In-Stock

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Parana Technologies

USA . 2,221 parts In-Stock

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$1.964

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$1.964

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GreenTree Electronics

Israel . 2,100 parts In-Stock

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2,100

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Perfect Parts

USA . 1,789 parts In-Stock

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1,789

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Overview

Unlock unmatched performance with the STW9NK70Z from STMicroelectronics—a leader in innovative semiconductor solutions. This N-channel power FET is expertly designed for seamless switching applications, delivering exceptional reliability and efficiency. With a robust 700V breakdown voltage and integrated diode, it excels in demanding environments. Elevate your projects with a component that combines quality, durability, and cutting-edge technology, ensuring your systems run flawlessly while optimizing energy use.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers excellent insulation properties and thermal stability, making the transistor durable and reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically provide better performance for switching applications, allowing for higher efficiency and faster switching speeds.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and helps in preventing reverse polarity, enhancing system reliability.

Transistor Application: SWITCHING

Designed specifically for switching, this FET is ideal for applications requiring efficient power management and fast response times.

Minimum DS Breakdown Voltage: 700 V

A high breakdown voltage indicates that the transistor can handle high-voltage applications, providing versatility in various circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCB layouts, making it easier to integrate into compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal design enhances mechanical strength and stability when mounted on circuit boards, ensuring reliable connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enables the transistor to start from an 'off' state, providing better control over the circuit and reducing power consumption.

Maximum Pulsed Drain Current (IDM): 30 A

This high pulsed current rating allows the FET to handle significant spikes in current during operation, making it well-suited for demanding applications.

Avalanche Energy Rating (EAS): 230 mJ

A substantial avalanche energy rating indicates that the transistor can tolerate energy surges, which enhances its robustness in critical applications.

Maximum Drain Current (Abs) (ID): 7.5 A

This maximum current rating provides flexibility in design, allowing the FET to be used in a variety of circuits without concern for overheating.

No. of Terminals: 3

A three-terminal configuration simplifies circuit design, allowing for easier integration and implementation in various applications.

Maximum Power Dissipation (Abs): 156 W

This high power dissipation capability ensures that the FET can operate efficiently without overheating, enhancing performance in high-power applications.

Package Style (Meter): FLANGE MOUNT

The flange mount style provides an extra level of mechanical stability, making it ideal for robust applications where vibrations or stresses may occur.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, making this FET suitable for low-power applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating allows this FET to function reliably in harsh environments, expanding its applicability.

Transistor Element Material: SILICON

Silicon provides excellent electrical characteristics and thermal properties, ensuring good performance in a wide range of applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish on terminals enhances solderability and resistance to oxidation, contributing to the long-term reliability of connections.

Maximum Drain Current (ID): 7.5 A

A maximum drain current of 7.5 A emphasizes the device’s capability to handle substantial loads, making it suitable for various electronic applications.

Maximum Drain-Source On Resistance: 1.2 ohm

A low on-resistance minimizes power loss and heat generation during operation, thereby improving efficiency in applications.

Terminal Position: SINGLE

A single terminal position simplifies the mounting process and minimizes PCB space, an essential factor in compact design.

Technical Specifications

Power Field Effect Transistors (FET) STW9NK70Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

230 mJ

Minimum DS Breakdown Voltage:

700 V

Maximum Drain Current (Abs) (ID):

7.5 A

Maximum Drain Current (ID):

7.5 A

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW9NK70Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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