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STW90NF20

STMicroelectronics

STW90NF20 by STMicroelectronics

STW90NF20 by STMicroelectronics is a powerful N-channel FET designed for high-efficiency applications. It supports a max drain current of 83 A and power dissipation up to 300 W, making it ideal for power management in industrial systems. Its robust design operates effectively at temperatures up to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,066 parts In-Stock

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6,066

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Anansix

USA . 1,554 parts In-Stock

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1,554

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Digiode

USA . 353 parts In-Stock

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353

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IDEA Electronic Components Group

UK . 664 parts In-Stock

1+ parts

$1.432

100+ parts

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$1.288

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664

$1.432

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$1.288

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MKK Technologies

India . 878 parts In-Stock

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$2.692

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878

$2.692

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DigiPath Technology Company

USA . 878 parts In-Stock

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$2.692

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878

$2.692

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AZTECH Wire

Italy . 909 parts In-Stock

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$14.540

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909

$14.540

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Kepictronics

USA . 18,650 parts In-Stock

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18,650

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A-Z Elektronik GmbH

Germany . 5,814 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,633 parts In-Stock

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4,633

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 368 parts In-Stock

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368

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Corphita

USA . 84 parts In-Stock

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84

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Parana Technologies

USA . 7 parts In-Stock

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$1.712

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7

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$1.712

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Overview

Elevate your projects with the STW90NF20 from STMicroelectronics, a powerhouse in the world of power FETs. Renowned for their innovation and reliability, STMicroelectronics delivers unparalleled quality that meets the demands of various applications—from industrial automation to consumer electronics. Experience superior performance and efficiency with this N-channel transistor, designed to handle high currents and dissipate heat effectively. Unlock new possibilities and enhance your designs with the trusted expertise of STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides excellent durability and resistance to environmental factors, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have better electron mobility compared to P-channel transistors, leading to higher efficiency and performance in switching applications.

Configuration: SINGLE

A single configuration makes it easy to integrate the FET into various circuit designs without the complexity of multiple channels.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy mounting and compact circuit board layout, optimizing space utilization.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a strong physical connection to the PCB, enhancing the reliability of the FET in high-power applications.

Maximum Drain Current (Abs): 83 A

With a maximum drain current rating of 83 A, this FET can handle significant power requirements, making it suitable for heavy-duty applications.

No. of Terminals: 3

A three-terminal design provides a simple interface for electronic designs, allowing for efficient control and management of gate voltage.

Maximum Power Dissipation (Abs): 300 W

The high maximum power dissipation rating indicates that this FET can operate under heavy load conditions without overheating, ensuring long-term reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures secure attachment to heatsinks or other components, enhancing thermal management and stability during operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology allows for low on-resistance and high switching speeds, making it ideal for high-efficiency power management applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures that this FET can function effectively in high-temperature environments, increasing its application range.

Terminal Finish: Matte Tin (Sn)

The matte tin finish enhances solderability and provides good corrosion resistance, contributing to the longevity and reliability of the device.

Maximum Drain Current (ID): 83 A

Reiterating the maximum drain current capability of 83 A underscores the unit's robustness and suitability for demanding electrical applications.

Terminal Position: SINGLE

A single terminal position simplifies circuit integration and layout, which can be beneficial in compact electronic designs.

Technical Specifications

Power Field Effect Transistors (FET) STW90NF20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

83 A

Maximum Drain Current (ID):

83 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Trade Compliance

STW90NF20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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