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STW9NA60

STMicroelectronics

STW9NA60 by STMicroelectronics

STW9NA60 by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a 600V breakdown voltage, 6.4A max drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,957 parts In-Stock

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3,957

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Anansix

USA . 2,132 parts In-Stock

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2,132

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Vyrian

USA . 53 parts In-Stock

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53

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GES GmbH

Germany . 2 parts In-Stock

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IDEA Electronic Components Group

UK . 32 parts In-Stock

1+ parts

$1.277

100+ parts

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$1.149

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32

$1.277

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$1.149

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MKK Technologies

India . 408 parts In-Stock

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$2.401

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DigiPath Technology Company

USA . 408 parts In-Stock

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$2.401

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 1,033 parts In-Stock

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$1.527

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Corphita

USA . 842 parts In-Stock

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Overview

Unlock the potential of your projects with the STW9NA60 from STMicroelectronics, a trusted leader in power technology. This robust N-channel FET delivers exceptional performance for switching applications, ensuring reliable operation even under demanding conditions. With its built-in diode and impressive voltage ratings, it’s perfect for energy-efficient designs across industries like automotive, industrial, and consumer electronics. Choose STMicroelectronics for quality you can count on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and effective protection against environmental factors, ensuring reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and performance, making them a preferred choice in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances versatility, allowing for easier integration into circuits as it can handle reverse voltage scenarios without additional components.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast operation, reducing energy loss and improving efficiency.

Minimum DS Breakdown Voltage: 600 V

A minimum breakdown voltage of 600 V provides excellent insulation, making this FET suitable for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on PCBs, facilitating compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical connections, ensuring stability and reliability in various mounting conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode provides better control of the FET, allowing for lower gate voltage operation and improved efficiency.

Maximum Pulsed Drain Current (IDM): 38 A

A high pulsed drain current capability supports demanding applications, enabling the handling of transient loads without failure.

Avalanche Energy Rating (EAS): 450 mJ

The high avalanche energy rating allows for resilience against voltage spikes, enhancing reliability in harsh environments.

Maximum Drain Current (Abs) (ID): 6.4 A

A maximum absolute drain current of 6.4 A makes this FET suitable for moderate load applications, ensuring it can handle typical operating conditions.

No. of Terminals: 3

The 3-terminal setup simplifies circuit design while maintaining functionality for common switching tasks.

Maximum Power Dissipation (Abs): 70 W

Maximum power dissipation of 70 W indicates robust thermal performance, allowing it to operate efficiently under high loads without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style enables secure mounting and provides excellent thermal dissipation, optimizing the performance of the device.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high switching speeds and low on-resistance, improving overall circuit efficiency.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature improves reliability in demanding applications, making it suitable for environments with varying conditions.

Transistor Element Material: SILICON

Silicon as a material provides excellent electrical properties, contributing to the effective performance of the FET across a broad range of applications.

Terminal Finish: MATTE TIN

MATTE TIN terminal finish ensures good conductivity and solderability, making assembly and integration easier.

Maximum Drain Current (ID): 6.4 A

The repeat specification of maximum drain current reinforces its capability to handle consistent loads, ensuring reliable operation in real-world applications.

Maximum Drain-Source On Resistance: 0.8 ohm

The low on-resistance enhances efficiency by minimizing conduction losses, which is crucial for energy-sensitive applications.

Terminal Position: SINGLE

Single terminal position simplifies the layout and increases design flexibility for PCB integration.

Case Connection: ISOLATED

Isolated case connection enhances safety by preventing any direct electrical contact with the mounting surface, reducing the risk of short circuits.

Technical Specifications

Power Field Effect Transistors (FET) STW9NA60 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

450 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

6.4 A

Maximum Drain Current (ID):

6.4 A

Maximum Drain-Source On Resistance:

.8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

38 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW9NA60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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