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STW4810CHDT/LF

STMicroelectronics

STW4810CHDT/LF by STMicroelectronics

STW4810CHDT/LF from STMicroelectronics is a power management IC with a nominal voltage of 3.6V and operates b/w -30 °C to 85°C. It features a compact 84-terminal grid array design, ideal for space-constrained applications. This device supports efficient power supply circuits in commercial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 4,781 parts In-Stock

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4,781

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J2 Sourcing AB

Sweden . 3,716 parts In-Stock

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3,716

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Digiode

USA . 1,273 parts In-Stock

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1,273

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Anansix

USA . 942 parts In-Stock

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942

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Vyrian

USA . 706 parts In-Stock

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706

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,674 parts In-Stock

1+ parts

$20.864

100+ parts

-

1k+ parts

$18.777

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1,674

$20.864

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$18.777

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MKK Technologies

India . 2,190 parts In-Stock

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$39.233

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2,190

$39.233

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DigiPath Technology Company

USA . 2,190 parts In-Stock

1+ parts

$39.233

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2,190

$39.233

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Corphita

USA . 1,437 parts In-Stock

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1,437

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Parana Technologies

USA . 274 parts In-Stock

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$24.946

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274

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$24.946

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Overview

Unlock unparalleled efficiency with the STW4810CHDT/LF from STMicroelectronics, a leader in innovative power management solutions. Designed for versatility, this advanced IC excels in demanding applications, ensuring reliable performance under varying temperatures. Its compact, thin-profile design simplifies integration while delivering exceptional power supply support. Trust in STMicroelectronics' commitment to quality and innovation, and elevate your projects with unmatched reliability and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs, enabling compact and high-density designs.

Package Shape: SQUARE

The square shape optimizes layout and routing on PCBs, facilitating easier integration into designs.

Nominal Supply Voltage (Vsup): 3.6 V

A standard nominal supply voltage allows compatibility with many existing systems and reduces design complexity.

No. of Terminals: 84

With 84 terminals, the IC supports complex functions and connections, making it suitable for advanced power management applications.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This thin profile and fine pitch design maximizes thermal performance and minimizes power dissipation, ideal for high-performance applications.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures that the IC can function reliably in demanding environments.

Minimum Operating Temperature: -30 °C

Operating in low temperatures makes this IC suitable for a wide range of applications, including automotive and industrial uses.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper finish enhances solderability and reliability of connections, important for long-term performance.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB layout and improves thermal management, beneficial for heat-sensitive applications.

Maximum Seated Height: 1.16 mm

A low seated height supports low-profile designs, making this IC a good fit for compact electronic devices.

Width: 6 mm

A compact width allows for greater flexibility in PCB design and placement, accommodating various layouts.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit means this IC is specially designed for effective power management, ensuring efficient operation in your applications.

Minimum Supply Voltage (Vsup): 2.7 V

With a low minimum supply voltage, this IC is versatile and can be used in battery-powered and energy-efficient designs.

Length: 6 mm

A short length further emphasizes the compact design, enabling easy integration into space-constrained devices.

Temperature Grade: COMMERCIAL EXTENDED

This extended temperature grade indicates suitability for a broader range of operating conditions, enhancing product reliability.

Terminal Form: BALL

Ball terminal form provides excellent electrical performance and allows for reliable surface mounting, crucial for modern PCB designs.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables a higher number of connections in a smaller area, which is ideal for dense designs.

Maximum Supply Voltage (Vsup): 4.8 V

The ability to handle up to 4.8V provides flexibility in circuit design and allows for integration with various voltage supply systems.

Technical Specifications

Power Management ICs STW4810CHDT/LF attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PBGA-B84

JESD-609 Code:

e1

Length:

6 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

84

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.16 mm

Maximum Supply Voltage (Vsup):

4.8 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width (mm):

6 mm

Trade Compliance

STW4810CHDT/LF Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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