Loading...

STW451027T/HF

STMicroelectronics

STW451027T/HF by STMicroelectronics

STW451027T/HF from STMicroelectronics is a versatile power management IC with a nominal voltage of 3.6V, supporting up to 7 channels. It operates b/w -30 °C and 85 °C, housed in a compact square grid array package. Ideal for efficient power supply applications in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,800

-

-

-

-

Anansix

USA . 1,345 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,345

-

-

-

-

Digiode

USA . 1,295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,295

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 121 parts In-Stock

1+ parts

$8.876

100+ parts

-

1k+ parts

$7.989

10k+ parts

-

121

$8.876

-

$7.989

-

MKK Technologies

India . 824 parts In-Stock

1+ parts

$16.691

100+ parts

-

1k+ parts

-

10k+ parts

-

824

$16.691

-

-

-

DigiPath Technology Company

USA . 824 parts In-Stock

1+ parts

$16.691

100+ parts

-

1k+ parts

-

10k+ parts

-

824

$16.691

-

-

-

Corphita

USA . 4,791 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,791

-

-

-

-

Parana Technologies

USA . 2,179 parts In-Stock

1+ parts

-

100+ parts

$10.613

1k+ parts

-

10k+ parts

-

2,179

-

$10.613

-

-

Overview

Elevate your power management solutions with the STW451027T/HF from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a versatile IC that excels in efficiency and reliability across various applications—from consumer electronics to industrial systems. With its compact design and superior performance, this Power Management IC offers exceptional value, empowering customers to optimize power supply with confidence and ease. Choose STMicroelectronics for a future of seamless energy management!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides good thermal performance, ensuring reliable operation in diverse environments.

Surface Mount: YES

Surface mount technology allows for compact designs and is ideal for automated assembly processes, resulting in reduced manufacturing costs.

Package Shape: SQUARE

A square package shape optimizes space efficiency on printed circuit boards, making it suitable for high-density applications.

Nominal Supply Voltage (Vsup): 3.6 V

The nominal supply voltage of 3.6 V is appropriate for many modern electronic devices, ensuring compatibility and stable performance.

Power Supplies (V): 3/5

Dual power supply capability (3V and 5V) provides versatility in applications, allowing it to interface seamlessly with different systems.

No. of Terminals: 49

Having 49 terminals supports complex connectivity needs, making this IC suitable for advanced power management applications.

Package Style (Meter): GRID ARRAY

Grid array packaging facilitates high-density interconnections and efficient heat dissipation, enhancing performance under load.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature of 85 °C ensures reliable performance in challenging conditions, suitable for industrial applications.

Minimum Operating Temperature: -30 °C

The ability to operate at temperatures as low as -30 °C expands the product's usability in colder climates and rugged environments.

Terminal Position: BOTTOM

Bottom terminal positioning aids in better solder joint reliability and provides a lower profile for space-constrained designs.

Maximum Seated Height: 1.2 mm

A maximum seated height of 1.2 mm allows for slim designs and is ideal for compact electronic devices.

Width: 4 mm

The width of 4 mm contributes to a small footprint, making it advantageous for space-saving designs in various applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC plays a critical role in ensuring stable voltage and current regulation, enhancing overall device reliability.

Minimum Supply Voltage (Vsup): 2.7 V

A minimum supply voltage of 2.7 V enables operation in low-voltage applications, making it suitable for battery-powered devices.

Length: 4 mm

A length of 4 mm complements the compact design, allowing for efficient layout in both consumer and industrial electronics.

Maximum Supply Current (Isup): 0.25 mA

With a maximum supply current of 0.25 mA, this IC minimizes power consumption, making it a great choice for energy-sensitive applications.

No. of Channels: 7

Having 7 channels enables simultaneous management of multiple power paths, which is essential in complex electronic systems.

Terminal Form: BALL

Ball terminals provide a reliable solder joint and better mechanical stability, enhancing the longevity of the component.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for fine pitch designs, suitable for high-density applications where space is at a premium.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V provides flexibility for connections to a variety of power sources and adds versatility to its applications.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization in voltage levels, making it beneficial for diverse applications and fine-tuning performance.

Technical Specifications

Power Management ICs STW451027T/HF attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PBGA-B49

Length:

4 mm

No. of Channels:

7

No. of Functions:

1

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,20

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.25 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width (mm):

4 mm

Trade Compliance

STW451027T/HF Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20