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STW4510AET

STMicroelectronics

STW4510AET by STMicroelectronics

STW4510AET by STMicroelectronics is a versatile power management IC with a nominal voltage of 3.6V and supports up to 7 channels. It operates b/w -30 °C and 85 °C, housed in a thin-profile grid array package. Ideal for efficient power supply applications, it features adjustable thresholds and low current consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,193 parts In-Stock

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3,193

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Digiode

USA . 2,546 parts In-Stock

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2,546

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Anansix

USA . 1,211 parts In-Stock

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1,211

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,134 parts In-Stock

1+ parts

$9.991

100+ parts

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$8.992

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2,134

$9.991

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$8.992

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MKK Technologies

India . 1,640 parts In-Stock

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$18.788

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$18.788

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DigiPath Technology Company

USA . 1,640 parts In-Stock

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$18.788

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1,640

$18.788

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Parana Technologies

USA . 865 parts In-Stock

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$11.946

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865

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$11.946

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Corphita

USA . 508 parts In-Stock

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Overview

Unlock the potential of your designs with the STW4510AET from STMicroelectronics, a powerhouse in power management ICs. Renowned for their exceptional quality and reliability, STMicroelectronics delivers innovative solutions that enhance performance across various applications—from consumer electronics to industrial systems. With its compact design and versatility, the STW4510AET ensures efficient power supply management, providing you with unmatched value and confidence in every project. Elevate your innovations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient space utilization on PCBs and facilitates automated assembly processes.

Package Shape: SQUARE

A square package shape enables denser component placement on PCBs, optimizing layout and reducing overall board size.

Nominal Supply Voltage (Vsup): 3.6 V

The nominal supply voltage of 3.6 V is ideal for standard digital circuits, providing stable performance in typical operating conditions.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, offering versatility in a range of applications and compatibility with various systems.

No. of Terminals: 84

With 84 terminals, this IC provides ample connectivity for complex circuits, enabling extensive functionality in power management.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

A thin profile with fine pitch improves heat dissipation and allows for high-density PCB layouts, ideal for compact designs.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85 °C ensures reliable performance in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -30 °C

With a minimum operating temperature of -30 °C, this IC can function effectively in cold environments, broadening its application range.

Terminal Position: BOTTOM

Bottom terminal position enables efficient heat dissipation and promotes better electrical performance in layouts.

Maximum Seated Height: 1.16 mm

A maximum seated height of 1.16 mm contributes to a low-profile design, making it suitable for space-constrained applications.

Width: 6 mm

At 6 mm width, this component strikes a balance between providing an ample number of terminals while maintaining a compact footprint.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is essential for managing voltage levels and ensuring stability in electronic designs.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7 V allows for use in low-power applications, enhancing overall energy efficiency.

Length: 6 mm

A length of 6 mm maintains compact dimensions while providing enough area for a robust internal structure.

Maximum Supply Current (Isup): 0.25 mA

A maximum supply current of 0.25 mA ensures low power consumption, ideal for battery-powered and energy-sensitive applications.

No. of Channels: 7

With 7 channels, this IC offers flexibility and capability to handle multiple power management tasks simultaneously.

Terminal Form: BALL

Ball terminal form provides reliable connections and simplifies the soldering process, enhancing assembly efficiency.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm enables high pin density, facilitating compact designs without compromising connectivity.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V supports a wide range of applications, providing flexibility for circuit designs.

Adjustable Threshold: YES

The adjustable threshold feature adds versatility, allowing designers to tailor performance specifications to meet specific application needs.

Technical Specifications

Power Management ICs STW4510AET attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PBGA-B84

Length:

6 mm

No. of Channels:

7

No. of Functions:

1

No. of Terminals:

84

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA84,10X10,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.16 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.25 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width (mm):

6 mm

Trade Compliance

STW4510AET Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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