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STW4511AHT/HF

STMicroelectronics

STW4511AHT/HF by STMicroelectronics

STW4511AHT/HF by STMicroelectronics is a Power Management IC with 3/5V power supplies, 64 terminals in a square package. It operates b/w -30 to 85 °C and features a grid array, fine pitch style. Ideal for applications requiring precise power management in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,004

-

-

-

-

Vyrian

USA . 1,008 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,008

-

-

-

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Anansix

USA . 534 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

534

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,360 parts In-Stock

1+ parts

$14.261

100+ parts

-

1k+ parts

$12.835

10k+ parts

-

2,360

$14.261

-

$12.835

-

MKK Technologies

India . 1,524 parts In-Stock

1+ parts

$26.817

100+ parts

-

1k+ parts

-

10k+ parts

-

1,524

$26.817

-

-

-

DigiPath Technology Company

USA . 1,524 parts In-Stock

1+ parts

$26.817

100+ parts

-

1k+ parts

-

10k+ parts

-

1,524

$26.817

-

-

-

Corphita

USA . 3,374 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,374

-

-

-

-

Parana Technologies

USA . 2,200 parts In-Stock

1+ parts

-

100+ parts

$17.051

1k+ parts

-

10k+ parts

-

2,200

-

$17.051

-

-

Overview

Unleash the power of innovation with the STW4511AHT/HF by STMicroelectronics. This high-quality Power Management IC offers unparalleled performance and reliability, thanks to its renowned manufacturer. Ideal for a wide range of applications, this product provides customers with exceptional value and benefits. Experience seamless power management like never before with the STW4511AHT/HF.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for various industrial applications.

Surface Mount: YES

Surface mount capability makes it easy to integrate the IC into electronic circuit boards, saving space and simplifying assembly processes.

Package Shape: SQUARE

Square shape is compact and allows for efficient use of board space, especially in applications with limited area available.

Power Supplies (V): 3/5

Supports dual power supply voltages of 3V and 5V, making the IC versatile and compatible with a wide range of devices and systems.

No. of Terminals: 64

Having 64 terminals allows for multiple connections, enabling the IC to handle complex power management tasks effectively.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design ensures better signal integrity and thermal performance, enhancing overall reliability and efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the IC can withstand elevated temperatures, making it suitable for harsh operating environments.

Minimum Operating Temperature: -30 °C

The ability to operate at temperatures as low as -30 °C ensures reliable performance even in cold conditions, increasing the product's versatility.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and soldering, simplifying the assembly process and ensuring proper connection.

Terminal Form: BALL

Ball terminals provide reliable electrical connection and mechanical strength, enhancing the overall performance and durability of the IC.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density packaging of the IC, enabling space-saving and efficient design implementation in compact devices.

Technical Specifications

Power Management ICs STW4511AHT/HF attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,10X10,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

STW4511AHT/HF Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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