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STW4511AH/HF

STMicroelectronics

STW4511AH/HF by STMicroelectronics

STW4511AH/HF by STMicroelectronics is a Power Management IC with 3/5V power supplies, 64 terminals in a grid array package. It operates b/w -30 °C to 85°C and is ideal for surface mount applications requiring fine pitch terminal style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,885 parts In-Stock

1+ parts

-

100+ parts

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4,885

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-

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Digiode

USA . 4,597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,597

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Anansix

USA . 1,530 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,530

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,498 parts In-Stock

1+ parts

$7.327

100+ parts

-

1k+ parts

$6.594

10k+ parts

-

1,498

$7.327

-

$6.594

-

MKK Technologies

India . 1,725 parts In-Stock

1+ parts

$13.778

100+ parts

-

1k+ parts

-

10k+ parts

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1,725

$13.778

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DigiPath Technology Company

USA . 1,725 parts In-Stock

1+ parts

$13.778

100+ parts

-

1k+ parts

-

10k+ parts

-

1,725

$13.778

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-

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Corphita

USA . 3,185 parts In-Stock

1+ parts

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3,185

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Parana Technologies

USA . 820 parts In-Stock

1+ parts

-

100+ parts

$8.760

1k+ parts

-

10k+ parts

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820

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$8.760

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-

Overview

Elevate your power management capabilities with the STW4511AH/HF by STMicroelectronics. Crafted with precision and expertise, this product offers unparalleled quality and reliability in the realm of Power Management ICs. Perfect for a range of applications, this innovative device provides seamless power supplies at 3/5 V, ensuring optimal performance in any setting. With 64 terminals and a grid array, fine pitch package style, the STW4511AH/HF is designed for efficiency and convenience. Experience the superior value and benefits of this product today, and elevate your power management solutions to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability of the Power Management IC.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration of the IC onto a circuit board, saving space and facilitating automated assembly.

Package Shape: SQUARE

The square package shape helps in uniform distribution of components on the circuit board, optimizing space utilization and overall design efficiency.

Power Supplies (V): 3/5

With support for both 3V and 5V power supplies, this IC offers flexibility in powering various types of devices or systems, enhancing compatibility.

No. of Terminals: 64

The high number of terminals allows for greater connectivity and functionality within the IC, enabling complex power management tasks to be performed effectively.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style offers high density mounting capability, enhancing performance in compact electronic designs by reducing signal interference and improving signal integrity.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures the IC can withstand elevated temperatures without compromising performance, making it suitable for a wide range of operating environments.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C allows the IC to function reliably in cold conditions, expanding its usability in diverse applications.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure connection to the circuit board, ensuring stable performance and reducing the risk of disconnection or signal interruption.

Terminal Form: BALL

The ball terminal form offers reliable electrical connections and mechanical strength, contributing to the overall durability and longevity of the IC in operation.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density mounting and precise connections, enhancing the overall performance and efficiency of the IC in compact electronic designs.

Technical Specifications

Power Management ICs STW4511AH/HF attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,10X10,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

STW4511AH/HF Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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