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STW4810BHD/LF

STMicroelectronics

STW4810BHD/LF by STMicroelectronics

STW4810BHD/LF from STMicroelectronics is a power management IC with a supply voltage range of 2.7V to 5.5V and operates b/w -30 °C and 85°C. It features an adjustable threshold and comes in a thin profile, fine pitch grid array package with 84 terminals. Ideal for compact electronic applications requiring efficient power supply management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,631 parts In-Stock

1+ parts

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4,631

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Vyrian

USA . 4,379 parts In-Stock

1+ parts

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4,379

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Anansix

USA . 2,228 parts In-Stock

1+ parts

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2,228

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,574 parts In-Stock

1+ parts

$1.456

100+ parts

-

1k+ parts

$1.311

10k+ parts

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1,574

$1.456

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$1.311

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MKK Technologies

India . 367 parts In-Stock

1+ parts

$2.739

100+ parts

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367

$2.739

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DigiPath Technology Company

USA . 367 parts In-Stock

1+ parts

$2.739

100+ parts

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367

$2.739

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Corphita

USA . 1,409 parts In-Stock

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1,409

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Parana Technologies

USA . 46 parts In-Stock

1+ parts

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100+ parts

$1.741

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46

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$1.741

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Overview

Unlock the power of efficient energy management with the STW4810BHD/LF from STMicroelectronics. Renowned for their innovative solutions, STMicroelectronics delivers exceptional reliability and performance in power management ICs. This versatile component seamlessly adapts to a range of applications, ensuring optimal operation in various environments from -30 °C to 85°C. Experience reduced energy costs, enhanced system efficiency, and peace of mind, knowing your projects are powered by industry-leading technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and resistance to environmental factors, making this IC reliable for various applications.

Surface Mount: YES

Being surface mount compatible allows for easy integration into compact PCB layouts, improving space efficiency in electronic designs.

Package Shape: SQUARE

A square package shape facilitates easy alignment and mounting on PCBs, enhancing manufacturing efficiency.

Nominal Supply Voltage (Vsup): 3.6 V

A nominal supply voltage of 3.6 V strikes a balance between performance and efficiency, ideal for a range of power management applications.

No. of Terminals: 84

With 84 terminals, this IC provides extensive functionality and connectivity options, allowing for complex power management tasks.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The thin profile and fine pitch of the grid array package style enable higher component density and improved thermal performance in compact designs.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures suitability for diverse environments, maintaining reliability under heat exposure.

Minimum Operating Temperature: -30 °C

With a minimum operating temperature of -30 °C, this IC is versatile for applications in extreme cold environments, enhancing design flexibility.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient thermal management and space utilization on PCB, aiding in overall design performance.

Maximum Seated Height: 1.16 mm

A low seated height of 1.16 mm improves PCB profile and is ideal for slim electronic devices requiring compact components.

Width: 6 mm

At 6 mm in width, the component is optimal for small form-factor designs while preserving adequate functionality.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Designed specifically as a power supply management circuit, it is tailored for efficient energy distribution and management in systems.

Minimum Supply Voltage (Vsup): 2.7 V

A minimum supply voltage of 2.7 V allows for operation in lower voltage environments, accommodating a wider range of applications.

Length: 6 mm

The compact length of 6 mm is ideal for space-constrained applications where every millimeter counts.

Temperature Grade: COMMERCIAL EXTENDED

A commercial extended temperature grade means the IC can function reliably across a wider temperature range, enhancing performance stability.

Terminal Form: BALL

Ball form terminals facilitate efficient soldering and mechanical stability on PCBs, ensuring reliable electrical connections.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm enables high-density designs, supporting modern miniaturization trends in electronic products.

Maximum Supply Voltage (Vsup): 5.5 V

At a maximum supply voltage of 5.5 V, this IC can handle higher input levels, which is essential for versatile power supply requirements.

Adjustable Threshold: YES

The adjustable threshold feature provides flexibility in the design, allowing for tailored voltage settings to meet specific application requirements.

Technical Specifications

Power Management ICs STW4810BHD/LF attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PBGA-B84

Length:

6 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

84

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.16 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width (mm):

6 mm

Trade Compliance

STW4810BHD/LF Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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