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STW30N20

STMicroelectronics

STW30N20 by STMicroelectronics

STW30N20 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 30 A, a breakdown voltage of 200 V, and low on-resistance of 0.075 Ω. Ideal for power management in various electronic devices.

Median Price

$7.168

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 45 parts In-Stock

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$7.168

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$3.345

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Digiode

USA . 4,536 parts In-Stock

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4,536

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Vyrian

USA . 4,044 parts In-Stock

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Anansix

USA . 1,479 parts In-Stock

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1,479

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Astute Electronics Inc

. 152 parts In-Stock

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152

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Microfarads

USA . 43 parts In-Stock

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SPM Sales

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IDEA Electronic Components Group

UK . 932 parts In-Stock

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$0.674

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$0.607

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932

$0.674

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$0.607

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MKK Technologies

India . 228 parts In-Stock

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$1.268

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DigiPath Technology Company

USA . 228 parts In-Stock

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$1.268

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228

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AZTECH Wire

Italy . 54 parts In-Stock

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$19.570

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QUARKTWIN TECHNOLOGY LTD

USA . 18,776 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,260 parts In-Stock

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Kepictronics

USA . 1,200 parts In-Stock

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Parana Technologies

USA . 637 parts In-Stock

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$0.806

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Corphita

USA . 260 parts In-Stock

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Overview

Elevate your designs with the STW30N20 from STMicroelectronics—a powerful N-channel FET that excels in switching applications. Renowned for their commitment to quality and innovation, STMicroelectronics ensures reliability and efficiency in every component. With a robust design capable of handling high currents and voltages, this transistor offers exceptional performance across various sectors, from industrial automation to renewable energy systems. Experience enhanced operational efficiency and durability, making it the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and resistance to moisture and chemicals, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel type is favored for high efficiency in on-resistance and switching speed, enhancing performance in power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection against reverse voltage, increasing reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is ideal for use in power regulation and motor control.

Minimum DS Breakdown Voltage: 200 V

A high breakdown voltage ensures reliable operation even in high-voltage applications, enhancing device longevity.

Package Shape: RECTANGULAR

Rectangular packaging optimizes space in circuit layouts, contributing to improved thermal management and performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals allow for robust mechanical connections, which are crucial in high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enables better control over device characteristics, leading to enhanced efficiency and performance.

Maximum Pulsed Drain Current (IDM): 120 A

A high maximum pulsed drain current enables the FET to handle significant loads, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 140 mJ

The avalanche energy capability indicates robustness against transient conditions, making this part suitable for harsh environments.

No. of Terminals: 3

Three terminals provide a compact design while allowing for flexible circuit configurations, simplifying integration into systems.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging allows for easy heat dissipation and stable mechanical mounting, essential for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances efficiency and switching speed, making this FET suitable for high-frequency applications.

Transistor Element Material: SILICON

Silicon as a material offers excellent electrical properties, making this FET reliable and efficient in performance.

Maximum Drain Current (ID): 30 A

A maximum drain current of 30 A allows for versatile applications in power electronics, catering to a wide range of uses.

Maximum Drain-Source On Resistance: 0.075 ohm

0.075 ohm on-resistance translates to lower power losses during operation, improving overall energy efficiency.

Terminal Position: SINGLE

Single terminal arrangement simplifies PCB design and layout, facilitating easier integration into various electronic devices.

Technical Specifications

Power Field Effect Transistors (FET) STW30N20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

140 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

120 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW30N20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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