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STW32N65M5

STMicroelectronics

STW32N65M5 by STMicroelectronics

STW32N65M5 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 650V breakdown voltage, 24A max drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

$9.320

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 506 parts In-Stock

1+ parts

$9.320

100+ parts

$5.846

1k+ parts

$5.055

10k+ parts

-

506

$9.320

$5.846

$5.055

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,608 parts In-Stock

1+ parts

$8.854

100+ parts

-

1k+ parts

-

10k+ parts

-

4,608

$8.854

-

-

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Vyrian

USA . 5,313 parts In-Stock

1+ parts

-

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5,313

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Anansix

USA . 719 parts In-Stock

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719

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 772 parts In-Stock

1+ parts

$0.836

100+ parts

-

1k+ parts

$0.753

10k+ parts

-

772

$0.836

-

$0.753

-

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$0.915

100+ parts

$0.833

1k+ parts

$0.750

10k+ parts

-

10

$0.915

$0.833

$0.750

-

MKK Technologies

India . 54 parts In-Stock

1+ parts

$1.573

100+ parts

-

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-

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54

$1.573

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-

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DigiPath Technology Company

USA . 54 parts In-Stock

1+ parts

$1.573

100+ parts

-

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54

$1.573

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Corphita

USA . 992 parts In-Stock

1+ parts

$8.388

100+ parts

-

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-

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992

$8.388

-

-

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Microchip USA

USA . 133 parts In-Stock

1+ parts

$26.936

100+ parts

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133

$26.936

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Kepictronics

USA . 10,000 parts In-Stock

1+ parts

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10,000

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A-Z Elektronik GmbH

Germany . 4,584 parts In-Stock

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4,584

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,260 parts In-Stock

1+ parts

-

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$1.000

1k+ parts

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1,260

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$1.000

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Perfect Parts

USA . 1,236 parts In-Stock

1+ parts

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1,236

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Alle Elektronik GmbH

Germany . 506 parts In-Stock

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506

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Overview

Unlock unparalleled efficiency and reliability with the STW32N65M5 from STMicroelectronics. Renowned for their excellence, STMicroelectronics delivers a cutting-edge N-channel FET that excels in demanding switching applications. With robust performance and a remarkable 650V breakdown voltage, this transistor ensures seamless operation in diverse environments, optimizing energy use while reducing heat. Elevate your designs with proven quality and innovation that drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protects the transistor from environmental damage, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance in terms of conduction and switching speeds, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and enhances reliability by providing protection against voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers efficient operation and quick response times suitable for power management.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage allows this transistor to handle high-voltage applications without failure, enhancing versatility.

Package Shape: RECTANGULAR

The rectangular shape aids in easy integration into existing designs and offers good thermal performance.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides robust mechanical support and soldering ease, making it user-friendly for prototyping and assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement-mode FETs enable operation without a continuous gate voltage, leading to energy efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 96 A

A high pulsed drain current rating allows for brief current spikes, making it suitable for dynamic and demanding applications.

Avalanche Energy Rating (EAS): 650 mJ

This rating indicates the ability of the FET to handle energy spikes without damage, ensuring reliability in harsh conditions.

Maximum Drain Current (Abs) (ID): 24 A

The ability to handle up to 24 A of continuous drain current makes this FET suitable for high-power applications.

No. of Terminals: 3

A three-terminal configuration simplifies circuit design while providing sufficient functionality for most applications.

Maximum Power Dissipation (Abs): 150 W

High power dissipation capability ensures that the device can handle demanding power levels without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for secure attachment and improved thermal management, beneficial in high-power setups.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and lower power consumption, making this FET ideal for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures reliability in extreme conditions, broadening the range of applications.

Transistor Element Material: SILICON

Silicon is a well-established material in FETs, offering good performance and reliability for a wide range of applications.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides excellent solderability and corrosion resistance, enhancing the reliability of connections.

Maximum Drain Current (ID): 24 A

This rating indicates robust performance, allowing for efficient power delivery in demanding circuits.

Maximum Drain-Source On Resistance: 0.119 ohm

Low on-resistance reduces power losses during operation, contributing to overall system efficiency.

Terminal Position: SINGLE

A single terminal position simplifies the design and integration into various applications, making it easy to work with.

Technical Specifications

Power Field Effect Transistors (FET) STW32N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE ENERGY RATED

Avalanche Energy Rating (EAS):

650 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

24 A

Maximum Drain Current (ID):

24 A

Maximum Drain-Source On Resistance:

.119 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

96 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW32N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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