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STW32NM50N

STMicroelectronics

STW32NM50N by STMicroelectronics

STW32NM50N by STMicroelectronics is a N-CHANNEL Power FET with 500V DS Breakdown Voltage, 88A IDM, and 0.13 ohm RDS(on). Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE at up to 150°C temperature.

Median Price

$3.299

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 480 parts In-Stock

1+ parts

$7.400

100+ parts

$4.267

1k+ parts

$3.806

10k+ parts

-

480

$7.400

$4.267

$3.806

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Avnet

USA . 600 parts In-Stock

1+ parts

-

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600

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EBV Elektronik

Germany . 600 parts In-Stock

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600

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Verical

USA . 600 parts In-Stock

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$3.299

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600

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$3.299

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Arrow

USA . 390 parts In-Stock

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$3.067

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390

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$3.067

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$3.915

100+ parts

-

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50

$3.915

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Vyrian

USA . 6,354 parts In-Stock

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6,354

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Digiode

USA . 2,835 parts In-Stock

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2,835

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Anansix

USA . 1,917 parts In-Stock

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1,917

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Schukat

Germany . 560 parts In-Stock

1+ parts

-

100+ parts

$3.014

1k+ parts

$2.582

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560

-

$3.014

$2.582

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Chip Stock

USA . 145 parts In-Stock

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145

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Sensible Micro Corp

USA . 38 parts In-Stock

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38

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Bristol Electronics

USA . 10 parts In-Stock

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10

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Sunrise Surplus Inc.

USA . 3 parts In-Stock

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3

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,690 parts In-Stock

1+ parts

$1.694

100+ parts

-

1k+ parts

$1.524

10k+ parts

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1,690

$1.694

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$1.524

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MKK Technologies

India . 1,844 parts In-Stock

1+ parts

$3.185

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1,844

$3.185

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DigiPath Technology Company

USA . 1,844 parts In-Stock

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$3.185

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1,844

$3.185

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.915

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2,000

$3.915

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Microchip USA

USA . 584 parts In-Stock

1+ parts

$13.715

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584

$13.715

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Ampacity Inc.

Singapore . 111 parts In-Stock

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$31.050

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111

$31.050

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iodParts Technologies Inc.

India . 50,000 parts In-Stock

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Lixinc

USA . 12,766 parts In-Stock

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Kepictronics

USA . 2,400 parts In-Stock

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2,400

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Parana Technologies

USA . 1,667 parts In-Stock

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$2.025

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1,667

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$2.025

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Alle Elektronik GmbH

Germany . 1,600 parts In-Stock

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1,600

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 186 parts In-Stock

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186

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Overview

Unleash the power of innovation with the STW32NM50N by STMicroelectronics, a top-tier manufacturer known for superior quality and reliability. As a leading player in the Power Field Effect Transistors category, this N-CHANNEL transistor offers unmatched performance in switching applications. With a robust design and built-in diode, this product ensures maximum efficiency and durability. Experience the benefits of enhanced mode operation, high drain current capacity, and low on-resistance. Elevate your projects with the STW32NM50N and discover a new level of excellence in electronic components.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the transistor, ensuring a long lifespan.

Polarity or Channel Type

N-CHANNEL - N-channel FETs have lower resistance and are ideal for high-power applications.

Configuration

SINGLE WITH BUILT-IN DIODE - The built-in diode allows for efficient and reliable switching operations.

Transistor Application

SWITCHING - Designed specifically for switching applications, ensuring optimal performance.

Minimum DS Breakdown Voltage

500 V - With a high breakdown voltage, this FET can handle high voltages safely.

Package Shape

RECTANGULAR - The rectangular shape makes it easy to mount and secure in various electronic devices.

Terminal Form

THROUGH-HOLE - Through-hole terminals provide a stable connection for reliable performance.

Operating Mode

ENHANCEMENT MODE - This mode offers precise control over the transistor's switching behavior.

Maximum Pulsed Drain Current (IDM)

88 A - The high pulsed drain current rating allows for handling surge currents effectively.

Avalanche Energy Rating (EAS)

340 mJ - The high avalanche energy rating ensures protection against voltage spikes.

Maximum Drain Current (Abs) (ID)

22 A - The high drain current rating makes this FET suitable for high-power applications.

No. of Terminals

3 - 3 terminals provide a simple and efficient connection setup.

Maximum Power Dissipation (Abs)

190 W - With a high power dissipation rating, this FET can handle heat dissipation effectively.

Package Style (Meter)

FLANGE MOUNT - The flange mount design allows for easy installation and secure mounting.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR - MOSFET technology offers high efficiency and fast switching speeds.

Maximum Operating Temperature

150 °C - With a high operating temperature range, this FET can withstand heat without losing performance.

Transistor Element Material

SILICON - Silicon material provides reliability and stability for the transistor's operation.

Terminal Finish

Matte Tin (Sn) - Matte tin finish ensures good electrical conductivity and corrosion resistance for the terminals.

Maximum Drain Current (ID)

22 A - The high drain current rating allows for handling high currents efficiently.

Maximum Drain-Source On Resistance

0.13 ohm - The low on-resistance leads to reduced power losses and improved efficiency.

Terminal Position

SINGLE - Single terminal position simplifies connection and installation processes.

Technical Specifications

Power Field Effect Transistors (FET) STW32NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

340 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.13 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

88 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW32NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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