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STW34NB20

STMicroelectronics

STW34NB20 by STMicroelectronics

STW34NB20 by STMicroelectronics is a N-CHANNEL FET with 200V DS Breakdown Voltage, 34A ID, and 0.075 ohm RDS(on). Ideal for SWITCHING applications due to its 136A IDM and 650mJ EAS ratings. Operating in ENHANCEMENT MODE, it has a max power dissipation of 180W at 150 °C.

Median Price

$7.885

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 56 parts In-Stock

1+ parts

$7.885

100+ parts

$8.280

1k+ parts

$7.806

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56

$7.885

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$7.806

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Digiode

USA . 3,109 parts In-Stock

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Vyrian

USA . 2,503 parts In-Stock

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2,503

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Anansix

USA . 424 parts In-Stock

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424

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Semtec, LLC

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,177 parts In-Stock

1+ parts

$0.850

100+ parts

-

1k+ parts

$0.765

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1,177

$0.850

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$0.765

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MKK Technologies

India . 1,797 parts In-Stock

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$1.599

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1,797

$1.599

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DigiPath Technology Company

USA . 1,797 parts In-Stock

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$1.599

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$1.599

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Kepictronics

USA . 16,600 parts In-Stock

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16,600

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Corphita

USA . 4,583 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,357 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,945 parts In-Stock

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Parana Technologies

USA . 561 parts In-Stock

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$1.016

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Perfect Parts

USA . 114 parts In-Stock

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GreenTree Electronics

Israel . 90 parts In-Stock

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Overview

Experience the power and efficiency of the STW34NB20 by STMicroelectronics, a top-notch Power Field Effect Transistor designed for switching applications. With a high DS Breakdown Voltage of 200V and a maximum Drain Current of 34A, this N-CHANNEL transistor offers reliable performance and durability. Its SINGLE configuration with a built-in diode ensures seamless operation, while the METAL-OXIDE SEMICONDUCTOR technology guarantees optimal efficiency. Whether you're in need of a robust solution for your industrial or automotive projects, the STW34NB20 delivers exceptional value and performance that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides excellent durability and protection for the internal components of the FET, ensuring long-lasting performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient reverse voltage protection, adding an extra layer of safety to the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers reliable performance in controlling current flow.

Minimum DS Breakdown Voltage: 200 V

With a high breakdown voltage of 200V, this FET can handle high voltages with ease, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy installation and mounting, making it convenient for various electronic designs.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure connection to a circuit board, ensuring stable performance in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer fast switching speeds and low on-resistance, making them ideal for high-frequency applications.

Maximum Pulsed Drain Current (IDM): 136 A

The high pulsed drain current rating of 136A allows for reliable performance in high-power circuit designs.

Avalanche Energy Rating (EAS): 650 mJ

With a high avalanche energy rating of 650mJ, this FET can withstand sudden voltage spikes and surges without damage.

Maximum Drain Current (Abs) (ID): 34 A

The maximum drain current rating of 34A ensures reliable operation under heavy loads, making it suitable for power applications.

No. of Terminals: 3

The 3-terminal configuration simplifies the circuit design and integration process, making it user-friendly for engineers.

Maximum Power Dissipation (Abs): 180 W

The high power dissipation rating of 180W allows for reliable performance in high-power applications without overheating.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers mechanical stability and ease of mounting, making it suitable for rugged industrial environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology ensures high efficiency and reliability in the operation of the FET.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high temperatures without performance degradation.

Transistor Element Material: SILICON

Silicon-based FETs offer excellent performance and reliability, making them a preferred choice for various electronic applications.

Maximum Turn On Time (ton): 95 ns

The fast turn-on time of 95ns ensures quick response and high-speed switching, essential for time-sensitive applications.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring a reliable connection in assembly.

Maximum Drain-Source On Resistance: 0.075 ohm

The low on-resistance of 0.075 ohms minimizes power loss and improves efficiency in the FET's operation.

Terminal Position: SINGLE

The single terminal position simplifies the connectivity and installation process, making it easy to integrate into electronic designs.

Maximum Feedback Capacitance (Crss): 130 pF

The low feedback capacitance of 130pF minimizes signal distortion and improves high-frequency performance in the FET.

Technical Specifications

Power Field Effect Transistors (FET) STW34NB20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

650 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

34 A

Maximum Drain Current (ID):

34 A

Maximum Drain-Source On Resistance:

.075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

130 pF

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

180 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

136 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn On Time (ton):

95 ns

Trade Compliance

STW34NB20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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