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STW30NF20

STMicroelectronics

STW30NF20 by STMicroelectronics

STW30NF20 by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 30 A, a breakdown voltage of 200 V, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,111 parts In-Stock

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Digiode

USA . 1,797 parts In-Stock

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Anansix

USA . 922 parts In-Stock

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922

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IDEA Electronic Components Group

UK . 2,306 parts In-Stock

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$1.397

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$1.258

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2,306

$1.397

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$1.258

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MKK Technologies

India . 891 parts In-Stock

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$2.628

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891

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DigiPath Technology Company

USA . 891 parts In-Stock

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$2.628

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891

$2.628

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AZTECH Wire

Italy . 1,072 parts In-Stock

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$12.620

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$12.620

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QUARKTWIN TECHNOLOGY LTD

USA . 12,563 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,748 parts In-Stock

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Corphita

USA . 4,484 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,278 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 2,887 parts In-Stock

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Parana Technologies

USA . 493 parts In-Stock

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$1.671

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Overview

Elevate your projects with the STW30NF20 from STMicroelectronics, a trusted leader in semiconductor innovation. This robust power FET combines reliability and efficiency, making it ideal for demanding switching applications. With excellent performance capabilities and built-in diode functionality, it ensures seamless operation while delivering exceptional power handling. Experience enhanced durability and efficiency; transform your designs with STMicroelectronics' commitment to quality and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better performance and efficiency in switching applications, making this product ideal for high-speed operations.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode provides additional protection against voltage spikes, enhancing the reliability of the device in real-world applications.

Transistor Application: SWITCHING

Designed for switching applications, this FET excels in efficient transitioning between on and off states, making it perfect for power management.

Minimum DS Breakdown Voltage: 200 V

A minimum breakdown voltage of 200 V ensures this FET can handle higher voltage applications without failure, increasing its versatility.

Package Shape: RECTANGULAR

The rectangular package shape aids in compact circuit designs while maintaining stability and heatsinking capabilities.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connection and ease of soldering, which is beneficial for prototyping and assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for efficient control of electrical conduction, suitable for applications that require precise control.

Maximum Pulsed Drain Current (IDM): 120 A

With a maximum pulsed drain current of 120 A, this FET can manage high-load conditions, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 140 mJ

A high avalanche energy rating allows this FET to withstand brief over-voltage conditions without damage, increasing its resilience.

Maximum Drain Current (Abs) (ID): 30 A

This FET safely supports 30 A continuous drain current, making it ideal for various power handling applications without overheating.

No. of Terminals: 3

Three terminals simplify circuit integration and make it easier to connect within standard designs.

Maximum Power Dissipation (Abs): 125 W

A power dissipation capability of 125 W ensures efficient thermal management, allowing for sustained operation in high-power applications.

Package Style (Meter): FLANGE MOUNT

The flange mount style facilitates secure mounting, enhancing thermal performance and mechanical stability in various setups.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and lower power consumption, making this FET suitable for battery-operated devices.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C provides flexibility in extreme environments, ensuring functionality in various applications.

Transistor Element Material: SILICON

Silicon as the element material guarantees good electrical properties and is well-established in the industry, ensuring reliability.

Terminal Finish: TIN

The tin terminal finish enhances solderability and corrosion resistance, ensuring lasting performance in electrical connections.

Maximum Drain Current (ID): 30 A

This specification confirms high current carrying capability, which is essential for applications demanding significant power management.

Maximum Drain-Source On Resistance: 0.075 ohm

A low drain-source on resistance of 0.075 ohm minimizes power losses during operation, enhancing overall efficiency.

Terminal Position: SINGLE

The single terminal position allows for straightforward implementation in designs with limited space or simple circuit layouts.

Technical Specifications

Power Field Effect Transistors (FET) STW30NF20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

140 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

120 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW30NF20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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