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STW34N65M5

STMicroelectronics

STW34N65M5 by STMicroelectronics

STW34N65M5 by STMicroelectronics is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features 112A IDM and 0.11 ohm RDS(on), operating in ENHANCEMENT MODE at up to 150°C. The PLASTIC/EPOXY package with THROUGH-HOLE terminals ensures reliable performance in various power electronics designs.

Median Price

$6.805

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 512 parts In-Stock

1+ parts

$6.350

100+ parts

$4.642

1k+ parts

-

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512

$6.350

$4.642

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Mouser Electronics

USA . 335 parts In-Stock

1+ parts

$7.260

100+ parts

$4.120

1k+ parts

$2.940

10k+ parts

$2.930

335

$7.260

$4.120

$2.940

$2.930

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$3.486

100+ parts

-

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100

$3.486

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Bristol Electronics

USA . 150 parts In-Stock

1+ parts

$5.352

100+ parts

$2.515

1k+ parts

$2.408

10k+ parts

-

150

$5.352

$2.515

$2.408

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Digiode

USA . 1,860 parts In-Stock

1+ parts

$5.966

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1,860

$5.966

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Vyrian

USA . 7,293 parts In-Stock

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Chip Stock

USA . 5,800 parts In-Stock

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5,800

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Anansix

USA . 1,940 parts In-Stock

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1,940

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Pegasus Components GmbH

Germany . 300 parts In-Stock

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300

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ACDS - Activité Composants Distribution Service

France . 150 parts In-Stock

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Dan-Mar Components

USA . 150 parts In-Stock

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Electronics Depot

USA . 6 parts In-Stock

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6

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 601 parts In-Stock

1+ parts

$1.290

100+ parts

-

1k+ parts

$1.161

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601

$1.290

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$1.161

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MKK Technologies

India . 1,649 parts In-Stock

1+ parts

$2.425

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1,649

$2.425

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DigiPath Technology Company

USA . 1,649 parts In-Stock

1+ parts

$2.425

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1,649

$2.425

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Andel Nordic

Denmark . 4,661 parts In-Stock

1+ parts

$2.868

100+ parts

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$2.753

10k+ parts

$2.753

4,661

$2.868

-

$2.753

$2.753

Component Stockers USA

USA . 3,170 parts In-Stock

1+ parts

$3.180

100+ parts

$3.020

1k+ parts

$2.920

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3,170

$3.180

$3.020

$2.920

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Corphita

USA . 1,165 parts In-Stock

1+ parts

$5.652

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1,165

$5.652

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AZTECH Wire

Italy . 440 parts In-Stock

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$6.266

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440

$6.266

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Ampacity Inc.

Singapore . 156 parts In-Stock

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$11.750

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156

$11.750

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Microchip USA

USA . 6,053 parts In-Stock

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$18.284

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6,053

$18.284

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Lixinc

USA . 17,949 parts In-Stock

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Alle Elektronik GmbH

Germany . 8,993 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Kepictronics

USA . 4,800 parts In-Stock

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4,800

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A-Z Elektronik GmbH

Germany . 4,506 parts In-Stock

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4,506

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Parana Technologies

USA . 2,305 parts In-Stock

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$1.542

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2,305

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$1.542

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Overview

Looking for a high-quality Power Field Effect Transistor (FET) that offers exceptional performance and reliability? Look no further than the STW34N65M5 by STMicroelectronics. With its N-CHANNEL configuration and ENHANCEMENT MODE operation, this FET is ideal for SWITCHING applications. The single with built-in diode design ensures seamless integration, while the 650V minimum breakdown voltage provides superior protection. Trust STMicroelectronics to deliver cutting-edge technology with the STW34N65M5, offering unmatched value and benefits for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher efficiency, making them a superior choice for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit designs and protects the transistor from reverse currents, enhancing overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast response times and efficient power management.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltages safely, making it suitable for use in high-power circuits.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and efficient space utilization in electronic layouts.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide a secure connection and ease of soldering, ensuring reliable performance in various environments.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode offers precise control over the FET's conductivity, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 112 A

The high pulsed drain current rating allows this FET to handle surge currents effectively, making it suitable for demanding conditions.

Avalanche Energy Rating (EAS): 510 mJ

The high avalanche energy rating ensures the FET can withstand short-duration high-energy spikes, enhancing its durability.

No. of Terminals: 3

With three terminals, this FET offers flexibility in circuit design and allows for easy interfacing with other components.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides mechanical stability and efficient heat dissipation, ensuring reliable operation under high loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOSFET technology offers low ON resistance and high switching speeds, making this FET ideal for high-frequency applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, making it suitable for harsh environments.

Transistor Element Material: SILICON

Silicon is a commonly used material for FETs due to its high conductivity and temperature stability, ensuring reliable performance.

Maximum Drain Current (ID): 28 A

The high maximum drain current rating allows this FET to handle significant power loads, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.11 ohm

The low ON resistance minimizes power loss and heat generation, improving overall efficiency and performance.

Terminal Position: SINGLE

With a single terminal position, this FET is easy to integrate into circuit designs and offers straightforward connections for enhanced usability.

Technical Specifications

Power Field Effect Transistors (FET) STW34N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

510 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

28 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

112 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW34N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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