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STR750FV2T7

STMicroelectronics

STR750FV2T7 by STMicroelectronics

STR750FV2T7 by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 3.6V and operates in industrial temperatures from -40 °C to 85°C. It features 16 ADC channels, DMA support, and connectivity options like CAN and USB. Ideal for embedded applications requiring robust performance and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,276 parts In-Stock

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5,276

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Digiode

USA . 4,714 parts In-Stock

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4,714

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Anansix

USA . 1,878 parts In-Stock

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1,878

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 864 parts In-Stock

1+ parts

$15.600

100+ parts

-

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864

$15.600

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IDEA Electronic Components Group

UK . 681 parts In-Stock

1+ parts

$30.271

100+ parts

-

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$27.244

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-

681

$30.271

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$27.244

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MKK Technologies

India . 32 parts In-Stock

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$56.922

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32

$56.922

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DigiPath Technology Company

USA . 32 parts In-Stock

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$56.922

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32

$56.922

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QUARKTWIN TECHNOLOGY LTD

USA . 28,710 parts In-Stock

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28,710

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Microchip USA

USA . 4,331 parts In-Stock

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Corphita

USA . 3,443 parts In-Stock

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3,443

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Parana Technologies

USA . 278 parts In-Stock

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$36.193

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278

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$36.193

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Overview

Elevate your projects with the STR750FV2T7 microcontroller from STMicroelectronics, a trusted leader in semiconductor innovation. Designed for versatility and reliability, this high-performance 32-bit MCU excels in demanding applications across industrial automation, automotive systems, and IoT devices. Its robust features ensure seamless connectivity and exceptional processing power, empowering you to achieve remarkable efficiency and scalability while reducing time-to-market. Experience unparalleled quality and support with STMicroelectronics—where cutting-edge technology meets customer satisfaction!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material choice ensures durability and reliable performance in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into small PCBs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with low-power applications.

Package Shape: SQUARE

A square package shape can facilitate efficient space utilization on PCB layouts.

Bit Size: 32

A 32-bit architecture supports a wider range of applications, allowing for complex computations.

No. of Terminals: 100

With 100 terminals, this microcontroller offers extensive connectivity options for peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack style makes it suitable for applications requiring low-profile components.

Minimum Supply Voltage: 3 V

A low minimum supply voltage enables operation in battery-powered devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in demanding industrial environments.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C makes it ideal for harsh conditions.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and resistance to oxidation.

ADC Channels: YES

Integrated ADC channels allow for easy interfacing with analog sensors.

DMA Channels: YES

Direct memory access channels improve data throughput and reduce CPU load.

Terminal Position: QUAD

Quad terminal position enhances electrical performance and simplifies layout.

ROM Words: 262144

Ample ROM capacity for storing complex programs and firmware.

Maximum Seated Height: 1.6 mm

Low profile design contributes to space-efficient PCB layouts.

Width: 14 mm

Compact width enhances compatibility with dense PCB designs.

Peripherals: DMA(4), TIMER(6)

A variety of peripherals increase functionality and application versatility.

Maximum Clock Frequency: 60 MHz

A high clock frequency supports performance-intensive applications.

Length: 14 mm

Compact length aids in fitting into tight spaces on modern PCBs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability under extreme conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency for embedded applications.

RAM Bytes: 16384

Sufficient RAM for data handling and processing in complex applications.

Technology: CMOS

CMOS technology provides lower power consumption compared to other technologies.

Terminal Form: GULL WING

Gull wing terminals enhance soldering stability and reliability.

Analog To Digital Convertors: 16-Ch 10-Bit

Multiple ADCs allow simultaneous data acquisition from multiple sensors.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for many modern digital circuits, enhancing compatibility.

PWM Channels: YES

Integrated PWM channels support motor control and other analog applications.

Connectivity: CAN, I2C, LIN, SSP(2), UART(3), USB

Versatile connectivity options enable integration into various systems and applications.

ROM Programmability: FLASH

Flash memory allows for reprogramming and easy updates of firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables higher density connections on PCBs.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity, suitable for many manufacturing processes.

Speed: 48 rpm

Suitable for applications requiring moderate operational speeds.

On Chip Program ROM Width: 8

8-bit program ROM width enhances instruction processing efficiency.

No. of I/O Lines: 72

A large number of I/O lines enables complex interfacing with external devices.

Technical Specifications

Microcontrollers STR750FV2T7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, LIN, SSP(2), UART(3), USB

Peripherals:

DMA(4), TIMER(6)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STR750FV2T7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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