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STR712FR1T6

STMicroelectronics

STR712FR1T6 by STMicroelectronics

STR712FR1T6 from STMicroelectronics is a 32-bit ARM7 microcontroller ideal for industrial applications. It features a max supply voltage of 3.6V, operates at temperatures from -40 °C to 85 °C, and includes multiple connectivity options like CAN and UART. With 64 terminals and integrated ADC channels, it supports complex control tasks efficiently.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Verical

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Vyrian

USA . 8,880 parts In-Stock

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Chip Stock

USA . 4,800 parts In-Stock

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Anansix

USA . 2,618 parts In-Stock

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Digiode

USA . 2,418 parts In-Stock

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R&J Components

USA . 25 parts In-Stock

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ComSIT Distribution GmbH

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ComSIT USA

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AZTECH Wire

Italy . 1,053 parts In-Stock

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$13.710

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Microchip USA

USA . 429 parts In-Stock

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$18.555

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IDEA Electronic Components Group

UK . 2,305 parts In-Stock

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$56.678

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$51.010

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MKK Technologies

India . 1,249 parts In-Stock

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DigiPath Technology Company

USA . 1,249 parts In-Stock

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Kepictronics

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Perfect Parts

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Parana Technologies

USA . 344 parts In-Stock

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Corphita

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Overview

Unlock the potential of your projects with the STR712FR1T6 microcontroller from STMicroelectronics, a trusted leader in innovative solutions. This versatile 32-bit ARM7 device delivers robust performance for industrial applications, ensuring reliability even in extreme conditions. With advanced connectivity options and integrated peripherals, it streamlines development while enhancing efficiency. Choose STR712FR1T6 for superior quality and unmatched support, empowering you to bring your ideas to life seamlessly!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material helps protect the microcontroller from environmental factors, ensuring long-lasting performance.

Surface Mount: YES

The surface mount design allows for compact PCB layouts, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Supports a wide range of applications with voltage requirements, ensuring compatibility with various systems.

Package Shape: SQUARE

The square package shape aids in efficient thermal management and easier layout design on PCBs.

Bit Size: 32

The 32-bit architecture allows for advanced processing capabilities and efficient handling of complex applications.

Power Supplies (V): 3.3

Operating at 3.3V is suitable for modern low-power applications, enhancing energy efficiency.

No. of Terminals: 64

A higher number of terminals facilitates greater I/O capabilities, making the microcontroller versatile for various tasks.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile design minimizes height requirements on PCBs, beneficial for compact applications.

Minimum Supply Voltage: 3 V

Lower voltage operation enhances flexibility in battery-powered designs, improving longevity.

Maximum Operating Temperature: 85 °C

The high temperature rating ensures reliable performance in industrial environments.

CPU Family: ARM7

The ARM7 CPU family is known for its performance and efficiency, making it ideal for embedded applications.

Minimum Operating Temperature: -40 °C

Capabilities to function in extreme temperatures allow for use in harsh environments, expanding application scope.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and provides excellent signal integrity.

ADC Channels: YES

Enabled ADC channels allow for real-time data acquisition, essential for sensor interfacing.

Terminal Position: QUAD

Quad terminal positioning facilitates easier routing on PCBs, improving design efficiency.

ROM Words: 32768

A significant amount of ROM supports larger applications and enables more complex functionality.

Maximum Seated Height: 1.6 mm

The low seated height is advantageous for low-profile applications, ensuring compatibility with various designs.

Width: 10 mm

A compact width allows for efficient use of space on PCBs, aiding in miniaturization efforts.

Data EEPROM Size: 16K

The sizeable EEPROM enables data storage for configuration settings and non-volatile information.

Peripherals: RTC, TIMER(5)

Integrated peripherals like an RTC and multiple timers enhance the microcontroller's functionality for complex tasks.

Maximum Clock Frequency: 16.5 MHz

A suitable clock frequency provides a balance between performance and power consumption.

Maximum Time At Peak Reflow Temperature: 30s

The reflow specification ensures compatibility with standard assembly processes, simplifying manufacturing.

Peak Reflow Temperature: 260 °C

This high reflow temperature rating allows for robust soldering processes, improving assembly reliability.

Length: 10 mm

A compact length ensures that it can fit into tight spaces on PCBs, enhancing design flexibility.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, it guarantees durability and reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enables efficient instruction processing, ideal for performance-sensitive applications.

RAM Bytes: 32768

A generous amount of RAM allows for better performance in applications requiring high data throughput.

Technology: CMOS

CMOS technology provides low power consumption and high integration capabilities, essential for modern applications.

Terminal Form: GULL WING

Gull-wing terminals facilitate easier soldering and better mechanical stability in mounted conditions.

Analog To Digital Converters: 4-Ch 12-Bit

The multi-channel ADC supports various sensor inputs, enhancing versatility for different applications.

Maximum Supply Current: 100 mA

Moderate supply current allows for compatibility with a wide range of power sources, improving design flexibility.

Nominal Supply Voltage: 3.3 V

Operating at 3.3 V is standard for many embedded systems, simplifying integration with existing designs.

PWM Channels: YES

The presence of PWM channels allows for control of motors and other devices, expanding the application range.

Connectivity: CAN, I2C(2), SMARTCARD, SPI(2), UART(4)

Multiple connectivity options ensure versatility in communication with various devices, supporting diverse application scenarios.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming, enhancing the product's lifecycle and adaptability.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for higher density layouts on PCBs, crucial for modern miniaturized electronics.

Moisture Sensitivity Level (MSL): 3

An MSL level of 3 indicates appropriate protection against moisture during storage and handling, ensuring quality.

Speed: 66 rpm

The speed rating contributes to the microcontroller's responsiveness, which is critical for real-time applications.

On Chip Program ROM Width: 32

The 32-bit ROM width enhances processing efficiency and capability, enabling more advanced applications.

No. of I/O Lines: 32

A substantial number of I/O lines allows for interfacing with numerous peripherals, increasing the device's versatility.

Technical Specifications

Microcontrollers STR712FR1T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

64

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

16K

Connectivity:

CAN, I2C(2), SMARTCARD, SPI(2), UART(4)

Peripherals:

RTC, TIMER(5)

Analog To Digital Convertors:

4-Ch 12-Bit

Trade Compliance

STR712FR1T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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