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STR711FR0H6

STMicroelectronics

STR711FR0H6 by STMicroelectronics

STR711FR0H6 from STMicroelectronics is a 32-bit ARM7 microcontroller ideal for industrial applications. It operates at 3.0-3.6V, features 64 terminals, and supports ADC and PWM channels. With a max clock frequency of 16.5 MHz, it ensures efficient performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,097 parts In-Stock

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7,097

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Digiode

USA . 3,242 parts In-Stock

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3,242

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Anansix

USA . 428 parts In-Stock

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428

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Distributors (Availability)

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AZTECH Wire

Italy . 454 parts In-Stock

1+ parts

$9.780

100+ parts

-

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454

$9.780

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Microchip USA

USA . 370 parts In-Stock

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$9.864

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370

$9.864

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IDEA Electronic Components Group

UK . 1,299 parts In-Stock

1+ parts

$42.122

100+ parts

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$37.910

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1,299

$42.122

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$37.910

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MKK Technologies

India . 1,772 parts In-Stock

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$79.208

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1,772

$79.208

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DigiPath Technology Company

USA . 1,772 parts In-Stock

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$79.208

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1,772

$79.208

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QUARKTWIN TECHNOLOGY LTD

USA . 29,255 parts In-Stock

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Parana Technologies

USA . 863 parts In-Stock

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$50.364

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863

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$50.364

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Corphita

USA . 202 parts In-Stock

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Overview

Elevate your projects with the STR711FR0H6 microcontroller from STMicroelectronics, a trusted leader in innovative technology. This advanced 32-bit ARM7 solution offers exceptional performance and reliability for industrial applications, ensuring optimal efficiency in even the harshest environments. With its compact design and low power consumption, the STR711FR0H6 delivers outstanding value, enabling seamless integration and powerful functionality for your next big idea!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures robustness and longevity, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs, making it ideal for modern high-density PCB layouts.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V is optimal for power-sensitive applications, ensuring energy efficiency.

Package Shape: SQUARE

The square package shape aids in efficient space utilization on the PCB.

Bit Size: 32

As a 32-bit microcontroller, it provides significant processing capabilities and supports advanced applications.

Power Supplies (V): 3.3

Operating at 3.3V, this microcontroller is compatible with a wide range of power supplies and devices.

No. of Terminals: 64

With 64 terminals, it offers extensive connectivity options for complex project requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style allows for efficient thermal dissipation and reduced signal integrity issues.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3V extends the usability in various power scenarios.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes this microcontroller suitable for industrial applications.

CPU Family: ARM7

The ARM7 CPU family offers a reliable architecture with wide support for software development.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme low temperatures, this microcontroller is suitable for harsh environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This terminal finish enhances solderability and improves overall reliability in connections.

ADC Channels: YES

Integrated ADC channels allow for analog signal processing, critical for sensor integration.

Terminal Position: BOTTOM

Bottom terminal positioning is advantageous for efficient heat dissipation and compact PCB designs.

ROM Words: 65536

The substantial ROM capacity enables advanced programmability for more complex applications.

Maximum Seated Height: 1.7 mm

A low seated height ensures efficient space usage in tight design constraints.

Width: 8 mm

A compact width facilitates integration into small form factor devices.

Maximum Clock Frequency: 16.5 MHz

A clock frequency of 16.5 MHz provides adequate processing speed for most applications.

Maximum Time At Peak Reflow Temperature: 30 s

This specification allows for compatibility with standard soldering processes, ensuring reliable assembly.

Peak Reflow Temperature: 260 °C

This temperature rating supports various solder materials, enhancing versatility in manufacturing.

Length: 8 mm

This compact length helps fit the microcontroller into a variety of design layouts.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability and durability in various conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it is optimized for efficiency, making it effective for resource-constrained applications.

RAM Bytes: 16384

The generous RAM size allows for efficient data handling, suitable for complex applications.

Technology: CMOS

CMOS technology provides low power consumption, making it ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form ensures reliable connections and is suitable for large-scale production systems.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA makes it suitable for a wide variety of peripherals.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V aligns with many modern digital components.

PWM Channels: YES

Integration of PWM channels permits precise control in applications such as motor control and LED dimming.

ROM Programmability: FLASH

The availability of flash ROM allows for easy updates and modifications, enhancing flexibility in design.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch strikes a balance between density and manufacturability.

Moisture Sensitivity Level (MSL): 3

A MSL rating of 3 indicates a moderate risk of moisture absorption, ensuring careful handling during assembly.

Speed: 66 rpm

At 66 rpm, this microcontroller can handle tasks requiring moderate speed, suitable for a range of applications.

No. of I/O Lines: 30

With 30 I/O lines, it offers ample connectivity for interfacing with various components.

Technical Specifications

Microcontrollers STR711FR0H6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Peripheral IC Type:

Trade Compliance

STR711FR0H6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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