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STM819LDS6F

STMicroelectronics

STM819LDS6F by STMicroelectronics

STM819LDS6F from STMicroelectronics is a compact power management IC with a 5V nominal voltage, operating b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports applications in industrial power supply circuits. Its small outline design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,832 parts In-Stock

1+ parts

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4,832

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Anansix

USA . 2,522 parts In-Stock

1+ parts

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2,522

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Digiode

USA . 1,931 parts In-Stock

1+ parts

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1,931

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 121 parts In-Stock

1+ parts

$4.399

100+ parts

-

1k+ parts

$3.959

10k+ parts

-

121

$4.399

-

$3.959

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Microchip USA

USA . 394 parts In-Stock

1+ parts

$6.613

100+ parts

-

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394

$6.613

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MKK Technologies

India . 1,813 parts In-Stock

1+ parts

$8.273

100+ parts

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1,813

$8.273

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DigiPath Technology Company

USA . 1,813 parts In-Stock

1+ parts

$8.273

100+ parts

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1k+ parts

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1,813

$8.273

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AZTECH Wire

Italy . 1,107 parts In-Stock

1+ parts

$12.390

100+ parts

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1,107

$12.390

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Parana Technologies

USA . 2,032 parts In-Stock

1+ parts

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100+ parts

$5.260

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2,032

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$5.260

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Vigor

Singapore . 1,334 parts In-Stock

1+ parts

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1,334

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Corphita

USA . 986 parts In-Stock

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986

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Overview

Elevate your power management solutions with the STM819LDS6F from STMicroelectronics—a leader in innovation and quality. This compact, robust IC delivers reliable performance across a wide temperature range, making it ideal for industrial applications. Experience enhanced efficiency and longevity in your designs, backed by ST's unmatched expertise. Unlock new possibilities with this versatile component and enjoy peace of mind knowing you’re using a product built for excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for a compact design and easier integration into modern PCB layouts.

Package Shape: SQUARE

The square package shape optimizes space on PCBs and enhances thermal performance.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5V is common in many applications, ensuring compatibility and ease of integration.

Power Supplies (V): 5

Designed to operate at 5V, this IC supports common power supply configurations in consumer and industrial electronics.

No. of Terminals: 8

The 8-terminal configuration allows for versatile connectivity options while ensuring a compact footprint.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A small outline, thin profile package saves space on PCBs and facilitates easier handling and assembly.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is suitable for a variety of demanding environments.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this device ideal for harsh environments and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish ensures excellent conductivity and resistance to corrosion, enhancing reliability.

Terminal Position: DUAL

Dual terminal positioning aids in better performance and provides flexibility in PCB layout.

Maximum Seated Height: 1.1 mm

A low seated height of 1.1 mm enables dense packing of components in space-constrained designs.

Width: 3 mm

The compact width of 3 mm fits well into tight spaces, promoting design flexibility.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Categorizing this IC as a power supply support circuit indicates its specialized function in managing voltage and current efficiently.

Minimum Supply Voltage (Vsup): 1 V

A minimum supply voltage of 1V allows the IC to function in low-voltage applications, enhancing versatility.

Length: 3 mm

At a length of 3 mm, this IC's compact design supports space-saving measures in device design.

Nominal Threshold Voltage (V): +4.65V

A nominal threshold voltage of +4.65V ensures reliable switching behavior, making it a solid choice for precision applications.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, this product can withstand rigorous operational conditions.

Maximum Supply Current (Isup): 0.06 mA

0.06 mA maximum supply current ensures low power consumption, making it energy-efficient.

Terminal Form: GULL WING

The gull wing terminal form provides a reliable connection point, enhancing solderability and stability.

Terminal Pitch: 0.65 mm

0.65 mm terminal pitch allows for compact layout and efficient use of PCB real estate.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V supports a range of applications while ensuring safety margins for voltage spikes.

Technical Specifications

Power Management ICs STM819LDS6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTGE IS 4.65V; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.65V

Width (mm):

3 mm

Trade Compliance

STM819LDS6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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