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STM802RM6F

STMicroelectronics

STM802RM6F by STMicroelectronics

STM802RM6F by STMicroelectronics is a compact power management IC designed for industrial applications, operating b/w -40 °C to 85 °C. It supports supply voltages from 1.1V to 5.5V and features an 8-terminal gull-wing package. Ideal for efficient power supply management in various devices, it ensures reliability with a max current of just 0.06mA.

Median Price

$2.365

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 353 parts In-Stock

1+ parts

$1.840

100+ parts

$1.097

1k+ parts

$0.963

10k+ parts

$0.899

353

$1.840

$1.097

$0.963

$0.899

Mouser Electronics

USA . 1,046 parts In-Stock

1+ parts

$2.890

100+ parts

$1.430

1k+ parts

$1.010

10k+ parts

$0.868

1,046

$2.890

$1.430

$1.010

$0.868

Avnet

USA . 65,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

65,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 163 parts In-Stock

1+ parts

$2.670

100+ parts

-

1k+ parts

-

10k+ parts

-

163

$2.670

-

-

-

Vyrian

USA . 4,327 parts In-Stock

1+ parts

$2.810

100+ parts

-

1k+ parts

-

10k+ parts

-

4,327

$2.810

-

-

-

Anansix

USA . 2,008 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,008

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 754 parts In-Stock

1+ parts

$1.988

100+ parts

-

1k+ parts

$1.789

10k+ parts

-

754

$1.988

-

$1.789

-

Vigor

Singapore . 2,390 parts In-Stock

1+ parts

$2.370

100+ parts

-

1k+ parts

-

10k+ parts

-

2,390

$2.370

-

-

-

Corphita

USA . 847 parts In-Stock

1+ parts

$2.529

100+ parts

-

1k+ parts

-

10k+ parts

-

847

$2.529

-

-

-

Component Stockers USA

USA . 1,777 parts In-Stock

1+ parts

$3.690

100+ parts

$2.720

1k+ parts

$1.980

10k+ parts

-

1,777

$3.690

$2.720

$1.980

-

MKK Technologies

India . 1,998 parts In-Stock

1+ parts

$3.739

100+ parts

-

1k+ parts

-

10k+ parts

-

1,998

$3.739

-

-

-

DigiPath Technology Company

USA . 1,998 parts In-Stock

1+ parts

$3.739

100+ parts

-

1k+ parts

-

10k+ parts

-

1,998

$3.739

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$16.398

100+ parts

$14.922

1k+ parts

$13.446

10k+ parts

-

2,500

$16.398

$14.922

$13.446

-

QUARKTWIN TECHNOLOGY LTD

USA . 28,794 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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28,794

-

-

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Microchip USA

USA . 8,039 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,039

-

-

-

-

Perfect Parts

USA . 3,868 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

-

3,868

-

-

-

-

Parana Technologies

USA . 1,847 parts In-Stock

1+ parts

-

100+ parts

$2.377

1k+ parts

-

10k+ parts

-

1,847

-

$2.377

-

-

Overview

Unlock the power of efficient energy management with the STM802RM6F from STMicroelectronics! Renowned for their commitment to quality and innovation, STMicroelectronics delivers a reliable solution perfect for industrial applications. This compact Power Management IC ensures optimal performance across varying temperatures, enhancing your designs' longevity and efficiency. Elevate your projects with the superior reliability and versatility this product offers—where precision meets value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and resistance to environmental factors, ensuring a long-lasting product.

Surface Mount: YES

Surface mount compatibility allows for easier integration into compact electronic designs, making it suitable for modern applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, providing efficiency in design.

Nominal Supply Voltage (Vsup): 3.6 V

A nominal supply voltage of 3.6V ensures compatibility with a wide range of power management applications.

Power Supplies (V): 3/5

Supporting multiple power supply voltages enhances versatility across different circuit designs.

No. of Terminals: 8

Eight terminals allow for sufficient connectivity options, facilitating various application needs.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables the use of this IC in space-constrained applications.

Maximum Operating Temperature: 85 °C

This high operating temperature range makes the IC suitable for use in demanding environments, ensuring reliability.

Minimum Operating Temperature: -40 °C

An extended low-temperature range increases the reliability and application in extreme temperature environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish enhances solderability and ensures reliable electrical contacts over time.

Terminal Position: DUAL

Dual terminal positioning optimizes PCB layout options, allowing for flexible design configurations.

Maximum Seated Height: 1.75 mm

A low seated height allows for compact assembly and fits into tighter spaces within a system.

Width: 3.9 mm

A narrow width aids in maximizing the available PCB space, which is critical in compact electronics.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, this IC is critical for efficiently managing power consumption in devices.

Minimum Supply Voltage (Vsup): 1.1 V

Support for a low minimum supply voltage allows for effective operation in low-power devices.

Maximum Time At Peak Reflow Temperature (s): 40

This specification ensures that the IC can withstand the reflow soldering process without damage.

Peak Reflow Temperature (°C): 260

A high peak reflow temperature tolerance allows for compatibility with a broad range of assembly processes.

Length: 4.9 mm

Compact length supports space-efficient designs, catering to the needs of modern electronic applications.

Nominal Threshold Voltage (V): +2.625V

A specific nominal threshold voltage optimizes performance in power management functions.

Temperature Grade: INDUSTRIAL

Industrial grade ensures high reliability and performance stability in demanding applications.

Maximum Supply Current (Isup): 0.06 mA

Low maximum supply current results in power efficiency, allowing for extended battery life in portable devices.

Terminal Form: GULL WING

The gull wing terminal form simplifies the assembly process and provides good mechanical strength.

Terminal Pitch: 1.27 mm

A standard terminal pitch aids in compatibility with existing PCB layouts and simplifies the design process.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V ensures the IC can handle a wide range of applications while maintaining performance.

Technical Specifications

Power Management ICs STM802RM6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.625V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.625V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM802RM6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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