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STM802MDS6E

STMicroelectronics

STM802MDS6E by STMicroelectronics

STM802MDS6E by STMicroelectronics is a compact power management IC with a 5V nominal voltage, operating b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports applications in industrial environments. Ideal for efficient power supply management in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,785 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,785

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Vyrian

USA . 3,389 parts In-Stock

1+ parts

-

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1k+ parts

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3,389

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Anansix

USA . 2,235 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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2,235

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,051 parts In-Stock

1+ parts

$3.970

100+ parts

-

1k+ parts

$3.573

10k+ parts

-

1,051

$3.970

-

$3.573

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MKK Technologies

India . 804 parts In-Stock

1+ parts

$7.465

100+ parts

-

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-

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804

$7.465

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DigiPath Technology Company

USA . 804 parts In-Stock

1+ parts

$7.465

100+ parts

-

1k+ parts

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10k+ parts

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804

$7.465

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Corphita

USA . 2,408 parts In-Stock

1+ parts

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2,408

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Parana Technologies

USA . 2,072 parts In-Stock

1+ parts

-

100+ parts

$4.746

1k+ parts

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10k+ parts

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2,072

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$4.746

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Overview

Unlock unparalleled efficiency with the STM802MDS6E from STMicroelectronics, a leader in cutting-edge power management solutions. Designed for industrial applications, this compact and reliable IC ensures optimal performance within extreme temperature ranges, making it your go-to choice for robust designs. Enjoy enhanced energy savings, reduced space requirements, and the peace of mind that comes with STMicroelectronics' commitment to quality. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using a plastic/epoxy body material ensures durability and resistance to environmental factors, making this IC ideal for various applications.

Surface Mount: YES

Surface-mount technology allows for compact designs and enhances the manufacturability of the product.

Package Shape: SQUARE

The square package shape optimizes space efficiency, making it suitable for dense circuit layouts.

Nominal Supply Voltage (Vsup): 5 V

A 5 V nominal supply voltage is standard for many digital circuits, ensuring compatibility with common power sources.

Power Supplies (V): 5

The ability to support multiple power supplies at 5 V adds flexibility for various system configurations.

No. of Terminals: 8

With 8 terminals, this IC provides a balanced interface for connecting to other components while maintaining compactness.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style saves board space and allows for high-density applications, making it a great choice for modern electronics.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in various industrial environments.

Minimum Operating Temperature: -40 °C

The capability to operate down to -40 °C makes this IC suitable for harsh conditions, enhancing its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish reduces oxidation and enhances solderability, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position simplifies PCB design and assembly processes while maintaining effective heat dissipation.

Maximum Seated Height: 1.1 mm

A low seated height keeps the profile slim, contributing to compact electronic designs.

Width (mm): 3 mm

A width of 3 mm allows for efficient packing on the PCB, optimizing space usage in compact devices.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management IC, it provides critical functionality in power regulation and efficiency, crucial for modern applications.

Minimum Supply Voltage (Vsup): 1 V

Operational from 1 V allows for flexible power supply choices in diverse applications, enhancing versatility.

Length: 3 mm

A compact 3 mm length supports high-density designs and contributes to reducing the overall footprint of the device.

Nominal Threshold Voltage (V): +4.4V

A nominal threshold voltage of +4.4 V provides reliable operation for voltage-sensitive applications.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this IC is built to withstand rigorous operational conditions.

Maximum Supply Current (Isup): 0.06 mA

A low maximum supply current of 0.06 mA helps to minimize energy consumption, promoting energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and mechanical stability, suitable for automated assembly.

Terminal Pitch: 0.65 mm

A fine terminal pitch of 0.65 mm enables more compact layouts, which is beneficial for densely packed boards.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V offers a margin for flexibility in power supply specifications without compromising performance.

Technical Specifications

Power Management ICs STM802MDS6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTGE IS 4.4V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.4V

Width (mm):

3 mm

Trade Compliance

STM802MDS6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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