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ADM690AARMZ-REEL

Analog Devices

ADM690AARMZ-REEL by Analog Devices

ADM690AARMZ-REEL by Analog Devices is a Power Management IC with 1 function. It has a small outline, thin profile package style and operates at temperatures ranging from -40 to 85 °C. It is commonly used in power supply management circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,922 parts In-Stock

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4,922

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VNN

France . 4,055 parts In-Stock

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4,055

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Digiode

USA . 342 parts In-Stock

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342

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Ampacity Inc.

Singapore . 1,305 parts In-Stock

1+ parts

$1.500

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$1.500

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Vigor

Singapore . 1,202 parts In-Stock

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$2.270

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One Stop Electronics

USA . 782 parts In-Stock

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$5.500

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782

$5.500

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AZTECH Wire

Italy . 232 parts In-Stock

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$17.303

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Parana Technologies

USA . 4,839 parts In-Stock

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$20.266

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$18.847

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4,839

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IDEA Electronic Components Group

UK . 1,798 parts In-Stock

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$21.791

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$20.701

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DigiPath Technology Company

USA . 4,839 parts In-Stock

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$33.994

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$32.634

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$32.634

4,839

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$32.634

Corphita

USA . 595 parts In-Stock

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595

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Discover the ADM690AARMZ-REEL, a high-quality Power Management IC from Analog Devices that offers exceptional value for customers. With its compact rectangular shape and small outline, this IC is perfect for a range of applications in power supply management circuits. Experience the advantages of Analog Devices' renowned manufacturing expertise as you enjoy the benefits of this product's precise performance and reliable functionality. Trust in the ADM690AARMZ-REEL to deliver optimal power management solutions, with its wide operating temperature range and durable plastic/epoxy package material. Upgrade your power management capabilities today with this cutting-edge offering from Analog Devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material ensures excellent durability and resistance to physical damage, making this product a reliable choice for various applications.

Surface Mount: YES

The surface mount capability of this power management IC simplifies PCB assembly and enhances space efficiency, making it suitable for compact electronic devices.

No. of Functions: 1

As a single-function device, this power management IC offers a straightforward and focused solution, ensuring simplicity and ease of integration into designs.

Package Shape: RECTANGULAR

The rectangular package shape provides versatility in mounting options and allows for efficient use of board space, making it an ideal choice for compact systems.

Nominal Supply Voltage (Vsup): 5 V

With a 5 V nominal supply voltage, this power management IC is compatible with a wide range of systems and can provide stable power to numerous components.

No. of Terminals: 8

The availability of 8 terminals offers flexibility in connecting and controlling various peripheral devices, allowing for versatile power management capabilities.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style enable space-saving integration and effective thermal management, making it suitable for size-constrained applications.

Maximum Operating Temperature: 85 °C

The ability to operate at a maximum temperature of 85°C ensures reliable performance in demanding environments, enhancing the product's durability and suitability for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this power management IC can function reliably even in extreme cold environments, expanding its usability in various settings.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers excellent solderability and corrosion resistance, ensuring reliable connections and an extended lifespan for the product.

Terminal Position: DUAL

The dual terminal position provides flexibility in PCB layout and allows for efficient routing of connections, enhancing ease of use and design integration.

Maximum Seated Height: 1.1 mm

With a maximum seated height of 1.1 mm, this power management IC can be easily incorporated into low-profile designs, facilitating space-constrained applications.

Width (mm): 3 mm

The compact width of 3 mm contributes to the overall space efficiency of the device, allowing for easy integration into various electronic systems.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

This power management IC serves as a power supply management circuit, providing comprehensive control and regulation capabilities for efficient and reliable power delivery.

Minimum Supply Voltage (Vsup): 1 V

With a minimum supply voltage of 1 V, this power management IC offers flexibility in power input requirements, accommodating a wide range of system configurations.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand a maximum time of 30 seconds at peak reflow temperature allows for reliable soldering during the manufacturing process, ensuring consistent and robust connections.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures efficient solder melting and joining, guaranteeing reliable and durable connections between the power management IC and the PCB.

Length: 3 mm

The short length of 3 mm contributes to the overall compactness of the design, enabling easy integration into space-constrained electronic systems.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this power management IC meets the rigorous demands of industrial applications, ensuring reliable operation and longevity under harsh conditions.

No. of Channels: 3

With three channels available, this power management IC can concurrently handle multiple power sources and efficiently distribute power to various components, increasing system reliability and flexibility.

Technology: CMOS

Based on CMOS technology, this power management IC offers low power consumption, high noise immunity, and fast switching capabilities, making it an energy-efficient and reliable choice.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and provides enhanced mechanical strength, ensuring secure connections and improved durability.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this power management IC supports high-density PCB layouts, enabling compact and space-efficient designs.

Moisture Sensitivity Level (MSL): 1

Having a moisture sensitivity level of 1, this power management IC can be stored and used safely, minimizing the risk of moisture-related damage during manufacturing and handling processes.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5 V, this power management IC can handle higher voltage inputs, providing versatility and compatibility with various power sources.

Technical Specifications

Power Management ICs ADM690AARMZ-REEL attributes and parameters. Explore more Power Management ICs devices from Analog Devices

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

ADM690AARMZ-REEL Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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