Loading...

STM802RM6E

STMicroelectronics

STM802RM6E by STMicroelectronics

STM802RM6E by STMicroelectronics is a versatile power management IC with a nominal voltage of 3.6V, operating from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports supply voltages from 1.1V to 5.5V, ideal for industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,950

-

-

-

-

Digiode

USA . 1,140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,140

-

-

-

-

Anansix

USA . 808 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

808

-

-

-

-

EMSNET

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

LWI Electronics Inc

India . 36 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

36

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 209 parts In-Stock

1+ parts

$2.325

100+ parts

-

1k+ parts

-

10k+ parts

-

209

$2.325

-

-

-

Ampacity Inc.

Singapore . 1,224 parts In-Stock

1+ parts

$6.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,224

$6.500

-

-

-

IDEA Electronic Components Group

UK . 1,743 parts In-Stock

1+ parts

$12.175

100+ parts

-

1k+ parts

$10.958

10k+ parts

-

1,743

$12.175

-

$10.958

-

AZTECH Wire

Italy . 1,192 parts In-Stock

1+ parts

$16.340

100+ parts

-

1k+ parts

-

10k+ parts

-

1,192

$16.340

-

-

-

MKK Technologies

India . 220 parts In-Stock

1+ parts

$22.895

100+ parts

-

1k+ parts

-

10k+ parts

-

220

$22.895

-

-

-

DigiPath Technology Company

USA . 220 parts In-Stock

1+ parts

$22.895

100+ parts

-

1k+ parts

-

10k+ parts

-

220

$22.895

-

-

-

A-Z Elektronik GmbH

Germany . 6,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,615

-

-

-

-

Corphita

USA . 4,715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,715

-

-

-

-

Vigor

Singapore . 2,345 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,345

-

-

-

-

Parana Technologies

USA . 2,012 parts In-Stock

1+ parts

-

100+ parts

$14.557

1k+ parts

-

10k+ parts

-

2,012

-

$14.557

-

-

Kepictronics

USA . 1,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,900

-

-

-

-

Overview

Unlock the potential of your designs with the STM802RM6E from STMicroelectronics, a trusted leader in power management solutions. This compact and efficient IC is engineered for reliability across varied applications, ensuring seamless performance even in extreme conditions. With its exceptional temperature range and low power consumption, it’s perfect for industrial and consumer electronics. Elevate your projects with unparalleled quality and innovation that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material offers excellent durability and protection for the IC, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern PCB layouts, providing flexibility for designers.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient use of board space and can improve thermal performance.

Nominal Supply Voltage (Vsup): 3.6 V

Operating at a nominal supply voltage of 3.6 V ensures compatibility with many common applications, providing stable performance.

Power Supplies (V): 3/5

Supporting both 3V and 5V power supplies makes this IC versatile for use in a range of electronic devices.

No. of Terminals: 8

With 8 terminals, this IC provides sufficient connectivity for various applications while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space usage on the PCB while facilitating efficient soldering processes.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C enhances reliability in demanding applications, contributing to overall system longevity.

Minimum Operating Temperature: -40 °C

Operating in extreme low temperatures down to -40 °C makes this IC suitable for industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finishing provides excellent corrosion resistance and ensures reliable connections, improving overall product reliability.

Terminal Position: DUAL

Dual terminal position aids in better routing on the circuit board and optimizes connection placement for improved performance.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm allows for compatibility with low-profile designs, making it suitable for space-constrained applications.

Width: 3.9 mm

The compact width of 3.9 mm makes it a great choice for high-density PCB layouts, enabling space-efficient designs.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, this IC is essential for effectively managing power distribution in various electronic applications.

Minimum Supply Voltage (Vsup): 1.1 V

The low minimum supply voltage of 1.1 V allows it to function effectively in battery-operated devices, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum reflow temperature time of 40 seconds ensures that the IC can withstand the soldering process while maintaining performance integrity.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C allows for robust soldering connections to the PCB, crucial for high-quality assembly.

Length: 4.9 mm

The compact length of 4.9 mm contributes to a smaller footprint on the PCB, making it suitable for portable and miniaturized devices.

Nominal Threshold Voltage (V): +2.625V

A nominal threshold voltage of +2.625V helps ensure proper operation in digital circuits, providing consistent control and performance.

Temperature Grade: INDUSTRIAL

Rated for industrial applications, this IC is built to withstand harsher conditions, ensuring reliability and durability in tough environments.

Maximum Supply Current (Isup): 0.06 mA

With a maximum supply current of 0.06 mA, this IC is highly efficient, making it ideal for low-power applications.

Terminal Form: GULL WING

Gull wing terminal form accommodates easy soldering and repair, enhancing manufacturability and serviceability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm supports reliable wiring without sacrificing board space, making it suitable for tight layouts.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V allows compatibility with a wide range of power sources, giving flexibility in design choices.

Technical Specifications

Power Management ICs STM802RM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.625V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.625V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM802RM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19