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STM802MDS6F

STMicroelectronics

STM802MDS6F by STMicroelectronics

STM802MDS6F from STMicroelectronics is a compact power management IC with a 5V nominal voltage, operating b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports applications in industrial environments. Ideal for efficient power supply management in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,022 parts In-Stock

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3,022

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Anansix

USA . 2,845 parts In-Stock

1+ parts

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2,845

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Digiode

USA . 1,507 parts In-Stock

1+ parts

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1,507

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,163 parts In-Stock

1+ parts

$10.707

100+ parts

-

1k+ parts

$9.636

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2,163

$10.707

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$9.636

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MKK Technologies

India . 1,794 parts In-Stock

1+ parts

$20.134

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1,794

$20.134

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DigiPath Technology Company

USA . 1,794 parts In-Stock

1+ parts

$20.134

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1,794

$20.134

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Corphita

USA . 4,252 parts In-Stock

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4,252

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Parana Technologies

USA . 1,025 parts In-Stock

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100+ parts

$12.802

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1,025

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$12.802

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Overview

Unlock superior performance with the STM802MDS6F from STMicroelectronics, a trusted leader in power management solutions. This compact and efficient IC is designed for reliability across industrial applications, delivering exceptional voltage stability in demanding environments. With its robust thermal range and secure surface mount capabilities, it minimizes space without compromising quality. Elevate your projects with a power supply management circuit that promises efficiency and peace of mind!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robustness and reliability in various operating environments.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern PCBs, saving space.

Package Shape: SQUARE

The square shape provides uniform thermal distribution and efficient layout options for circuit design.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5V makes this IC suitable for a wide range of standard applications.

Power Supplies (V): 5

With 5V power supply compatibility, it easily integrates into existing designs without additional adjustments.

No. of Terminals: 8

Having 8 terminals offers sufficient connectivity for various functionalities while maintaining compact size.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile facilitate high-density packaging and optimal space utilization.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in a variety of industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC can function effectively in extreme weather conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish on terminals enhances connectivity and resistance to corrosion.

Terminal Position: DUAL

Dual terminal positioning allows for versatile PCB layouts and better design flexibility.

Maximum Seated Height: 1.1 mm

A maximum seated height of 1.1 mm helps in low-profile designs, perfectly suited for compact applications.

Width (mm): 3 mm

A width of just 3 mm contributes to the compactness ideal for space-constrained applications.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, this IC is crucial for efficient power distribution and control in electronic devices.

Minimum Supply Voltage (Vsup): 1 V

The capability to operate at a minimum supply voltage of 1V allows for flexibility in low-voltage applications.

Length: 3 mm

Measuring 3 mm in length, this design is ideal for compact electronic applications where space is limited.

Nominal Threshold Voltage (V): +4.4V

A nominal threshold voltage of +4.4V ensures reliable operation in power-sensitive applications.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grade, making it suitable for demanding environments often seen in industrial settings.

Maximum Supply Current (Isup): 0.06 mA

With a low maximum supply current, this IC is energy-efficient, making it ideal for battery-powered applications.

Terminal Form: GULL WING

The gull wing terminal design enhances soldering reliability and connection strength during assembly.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for denser layouts which are essential in modern compact electronic designs.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this IC offers flexibility for slightly higher voltage applications without compromising safety.

Technical Specifications

Power Management ICs STM802MDS6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTGE IS 4.4V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.4V

Width (mm):

3 mm

Trade Compliance

STM802MDS6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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