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STM802SM6F

STMicroelectronics

STM802SM6F by STMicroelectronics

STM802SM6F by STMicroelectronics is a versatile power management IC with a nominal voltage of 3.6V, operating from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports supply voltages from 1.1V to 5.5V, ideal for industrial applications. Its compact design ensures efficient space utilization in electronic devices.

Median Price

$2.570

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,923 parts In-Stock

1+ parts

$2.570

100+ parts

$1.570

1k+ parts

$1.390

10k+ parts

$1.260

4,923

$2.570

$1.570

$1.390

$1.260

DigiKey

USA . 3,340 parts In-Stock

1+ parts

$2.570

100+ parts

$1.567

1k+ parts

$1.386

10k+ parts

$1.300

3,340

$2.570

$1.567

$1.386

$1.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 498 parts In-Stock

1+ parts

$2.670

100+ parts

-

1k+ parts

-

10k+ parts

-

498

$2.670

-

-

-

Vyrian

USA . 1,210 parts In-Stock

1+ parts

$2.810

100+ parts

-

1k+ parts

-

10k+ parts

-

1,210

$2.810

-

-

-

Anansix

USA . 1,182 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,182

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,390 parts In-Stock

1+ parts

$2.370

100+ parts

-

1k+ parts

-

10k+ parts

-

2,390

$2.370

-

-

-

Corphita

USA . 1,435 parts In-Stock

1+ parts

$2.529

100+ parts

-

1k+ parts

-

10k+ parts

-

1,435

$2.529

-

-

-

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$8.577

100+ parts

$7.805

1k+ parts

$7.033

10k+ parts

-

50

$8.577

$7.805

$7.033

-

IDEA Electronic Components Group

UK . 1,834 parts In-Stock

1+ parts

$8.711

100+ parts

-

1k+ parts

$7.840

10k+ parts

-

1,834

$8.711

-

$7.840

-

Microchip USA

USA . 4,478 parts In-Stock

1+ parts

$13.663

100+ parts

-

1k+ parts

-

10k+ parts

-

4,478

$13.663

-

-

-

MKK Technologies

India . 2,129 parts In-Stock

1+ parts

$16.380

100+ parts

-

1k+ parts

-

10k+ parts

-

2,129

$16.380

-

-

-

DigiPath Technology Company

USA . 2,129 parts In-Stock

1+ parts

$16.380

100+ parts

-

1k+ parts

-

10k+ parts

-

2,129

$16.380

-

-

-

Perfect Parts

USA . 5,417 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,417

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,109 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,109

-

-

-

-

Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

iodParts Technologies Inc.

India . 4,896 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,896

-

-

-

-

Parana Technologies

USA . 1,736 parts In-Stock

1+ parts

-

100+ parts

$10.415

1k+ parts

-

10k+ parts

-

1,736

-

$10.415

-

-

Overview

Elevate your designs with the STM802SM6F from STMicroelectronics, a leader in power management solutions. This compact and reliable IC delivers exceptional efficiency and durability across a wide temperature range, making it ideal for industrial applications. With its robust construction and superior performance, you can trust that your systems will run smoothly and reliably. Maximize value and minimize downtime—choose STM802SM6F for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental stress, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact PCB designs, facilitating higher density layouts and ease of automated assembly.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCBs and aids in efficient layout configurations for power management applications.

Nominal Supply Voltage (Vsup): 3.6 V

A nominal supply voltage of 3.6V is ideal for many low-power digital devices, ensuring reliability in typical use cases.

Power Supplies (V): 3.3/5

Compatibility with both 3.3V and 5V power supplies enhances versatility, accommodating a broader range of applications.

No. of Terminals: 8

Eight terminals provide sufficient connectivity for various functionalities while maintaining compactness in design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves board space and is advantageous in designs where size is a critical factor.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is suitable for industrial applications where heat dissipation is a concern.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this chip ideal for harsh environments and outdoor applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and longevity, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning provides robust electrical connections and improved performance in circuit configurations.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm enables low-profile designs, making it suitable for space-constrained applications.

Width: 3.9 mm

A width of 3.9 mm helps maintain a compact footprint while providing stable connection points for performance.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit, this IC efficiently regulates power, ensuring optimal performance and energy savings.

Minimum Supply Voltage (Vsup): 1.1 V

With a minimum supply voltage of 1.1V, this IC is compatible with low-power devices, enhancing its application range.

Maximum Time At Peak Reflow Temperature: 40 s

A maximum time of 40 seconds at peak reflow temperature allows for safe soldering processes without compromising component integrity.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C is suited for various assembly processes, ensuring compatibility with modern manufacturing.

Length: 4.9 mm

A compact length of 4.9 mm complements the overall design efficiency, allowing more room for other components on the PCB.

Nominal Threshold Voltage (V): +2.925V

The nominal threshold voltage of +2.925V provides stable performance and effective regulation, beneficial for numerous electronic applications.

Temperature Grade: INDUSTRIAL

Rated as industrial grade, this IC ensures reliability and consistent performance in demanding environments.

Maximum Supply Current (Isup): 0.06 mA

With a maximum supply current of only 0.06 mA, this IC is exceptionally low power, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide solid mechanical and electrical connections for reliability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is suitable for automatic pick and place processes, streamlining assembly operations.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5V extends its usability in various applications, enhancing design flexibility.

Technical Specifications

Power Management ICs STM802SM6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.925V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.925V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM802SM6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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