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TPS2051BDGNG4

Texas Instruments

TPS2051BDGNG4 by Texas Instruments

TPS2051BDGNG4 by Texas Instruments is a Power Management IC with 8 terminals, Vsup range of 2.7V to 5.5V, and operating temperature from -40°C to 85°C. It is used in industrial applications for power supply support circuits due to its small outline package and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 26,670 parts In-Stock

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26,670

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Vyrian

USA . 5,920 parts In-Stock

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5,920

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Digiode

USA . 1,787 parts In-Stock

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1,787

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Semtec, LLC

USA . 313 parts In-Stock

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313

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 895 parts In-Stock

1+ parts

$1.500

100+ parts

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895

$1.500

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$1.506

100+ parts

$1.431

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$1.431

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100

$1.506

$1.431

$1.431

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Ampacity Inc.

Singapore . 928 parts In-Stock

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$6.500

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928

$6.500

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Semicontronic

India . 532 parts In-Stock

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$6.500

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$6.338

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$6.305

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532

$6.500

$6.338

$6.305

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Corohmni

South Africa . 272 parts In-Stock

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$6.635

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272

$6.635

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AZTECH Wire

Italy . 567 parts In-Stock

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$6.923

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567

$6.923

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Parana Technologies

USA . 593 parts In-Stock

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$19.544

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$19.546

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593

$19.544

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$19.546

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DigiPath Technology Company

USA . 379 parts In-Stock

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$21.521

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379

$21.521

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ChromeModa Solutions

Germany . 3,896 parts In-Stock

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$21.960

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$18.007

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$21.960

$18.007

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IDEA Electronic Components Group

UK . 1,094 parts In-Stock

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$21.960

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$20.862

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$19.764

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1,094

$21.960

$20.862

$19.764

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Continental Prestige Electronics

USA . 5,520 parts In-Stock

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Microchip USA

USA . 4,188 parts In-Stock

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Corphita

USA . 2,337 parts In-Stock

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Argo Parts USA

USA . 757 parts In-Stock

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757

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Perfect Parts

USA . 233 parts In-Stock

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233

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Elevate your power management solutions with the TPS2051BDGNG4 by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability for a wide range of applications. From industrial to automotive, this small outline, heat sink design delivers optimal performance in any environment. Experience peace of mind knowing that your power supply support circuit is in good hands with Texas Instruments. Upgrade to the TPS2051BDGNG4 today and unlock a world of possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, ideal for portable and consumer electronic devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving space and simplifying manufacturing processes.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a nominal supply voltage of 3.3 V provides compatibility with a wide range of electronic systems and components.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments, ensuring reliable performance.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

The use of multiple terminal finishes enhances conductivity and corrosion resistance, improving the overall longevity and durability of the product.

Width (mm): 3 mm

With a compact width of 3 mm, this power management IC can fit into tight spaces and allow for dense circuit board layouts.

Minimum Supply Voltage (Vsup): 2.7 V

Having a minimum supply voltage of 2.7 V ensures compatibility with low-power systems while maintaining efficient operation.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this power management IC meets the rigorous environmental and performance standards required in industrial settings.

Terminal Form: GULL WING

The gull wing terminal form provides excellent solderability and mechanical strength, ensuring secure connections in demanding operating conditions.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5 V, this power management IC can handle higher voltage inputs, offering flexibility in system design.

Technical Specifications

Power Management ICs TPS2051BDGNG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Current (Isup):

.07 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

TPS2051BDGNG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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