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STM802LM6F

STMicroelectronics

STM802LM6F by STMicroelectronics

STM802LM6F by STMicroelectronics is a compact power management IC with a nominal voltage of 5V and operates in temperatures from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports industrial applications. Ideal for efficient power supply management, it ensures reliability in various electronic devices.

Median Price

$2.650

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,500 parts In-Stock

1+ parts

$2.650

100+ parts

$1.620

1k+ parts

$1.434

10k+ parts

$1.360

2,500

$2.650

$1.620

$1.434

$1.360

Mouser Electronics

USA . 2,250 parts In-Stock

1+ parts

$2.650

100+ parts

$1.630

1k+ parts

$1.340

10k+ parts

$1.250

2,250

$2.650

$1.630

$1.340

$1.250

Avnet

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,761 parts In-Stock

1+ parts

$2.366

100+ parts

-

1k+ parts

-

10k+ parts

-

4,761

$2.366

-

-

-

Vyrian

USA . 208 parts In-Stock

1+ parts

$2.490

100+ parts

-

1k+ parts

-

10k+ parts

-

208

$2.490

-

-

-

Anansix

USA . 2,458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,458

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 226 parts In-Stock

1+ parts

$1.423

100+ parts

-

1k+ parts

$1.281

10k+ parts

-

226

$1.423

-

$1.281

-

Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$1.560

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

$1.560

-

-

-

Corphita

USA . 1,220 parts In-Stock

1+ parts

$2.241

100+ parts

-

1k+ parts

-

10k+ parts

-

1,220

$2.241

-

-

-

MKK Technologies

India . 1,677 parts In-Stock

1+ parts

$2.676

100+ parts

-

1k+ parts

-

10k+ parts

-

1,677

$2.676

-

-

-

DigiPath Technology Company

USA . 1,677 parts In-Stock

1+ parts

$2.676

100+ parts

-

1k+ parts

-

10k+ parts

-

1,677

$2.676

-

-

-

RC Electronics

USA . 41,821 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

41,821

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 21,013 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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21,013

-

-

-

-

Perfect Parts

USA . 9,885 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

-

9,885

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,061 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,061

-

-

-

-

iodParts Technologies Inc.

India . 4,896 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,896

-

-

-

-

Microchip USA

USA . 4,441 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

-

4,441

-

-

-

-

Metaverse IC Inc.

Canada . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Parana Technologies

USA . 1,328 parts In-Stock

1+ parts

-

100+ parts

$1.702

1k+ parts

-

10k+ parts

-

1,328

-

$1.702

-

-

Overview

Elevate your designs with the STM802LM6F from STMicroelectronics, a leader in power management solutions. This compact, reliable IC ensures exceptional performance across a wide temperature range, making it ideal for industrial applications. With unmatched quality and efficiency, it minimizes energy consumption while maximizing reliability. Trust in STMicroelectronics for cutting-edge technology that delivers value, benefits, and peace of mind in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as a package body material offers durability and reliability, making it suitable for various applications in power management.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space, facilitating easier assembly and integration into modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape is a standard form factor that ensures compatibility with a wide range of PCB designs.

Nominal Supply Voltage (Vsup): 5 V

Designed to operate at a nominal supply voltage of 5V, this IC easily integrates into systems with commonly used power supply levels.

Power Supplies (V): 5

The ability to handle a power supply of 5V simplifies the design requirements, especially for portable and low-power applications.

No. of Terminals: 8

With 8 terminals, the IC supports various functionalities while remaining compact, making it suitable for space-constrained applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for efficient use of space on PCBs, contributing to the miniaturization of electronic devices.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliability in a wide range of environmental conditions, making it ideal for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is suitable for use in harsh environments and cold climates.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and ensures a reliable electrical connection, boosting the overall performance of the IC.

Terminal Position: DUAL

Dual terminal position simplifies PCB layout and integration, providing flexibility in design.

Maximum Seated Height: 1.75 mm

The low seated height of just 1.75 mm contributes to slim profile designs, which are essential for portable devices.

Width (mm): 3.9 mm

At only 3.9 mm wide, the compact width supports space-efficient designs, helping engineers create smaller devices.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, this IC is specifically designed for efficient power distribution, optimizing energy use in electronic systems.

Minimum Supply Voltage (Vsup): 1 V

Operating at a minimum of 1V allows for versatility in powering low-voltage devices, catering to diverse applications.

Maximum Time At Peak Reflow Temperature (s): 40

The 40-second maximum time at peak reflow temperature indicates robustness during soldering processes, ensuring quality manufacturing.

Peak Reflow Temperature °C: 260

The ability to withstand a peak reflow temperature of 260 °C helps ensure reliability during assembly without compromising performance.

Length: 4.9 mm

With a length of 4.9 mm, this IC is compact enough to fit easily into modern, space-constrained circuit designs.

Nominal Threshold Voltage (V): +4.65V

A nominal threshold voltage of +4.65V is well-suited for regulated power applications, ensuring effective operation in power management roles.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures long-term reliability and performance in demanding environments.

Maximum Supply Current (Isup): 0.06 mA

A maximum supply current of only 0.06 mA indicates minimal power consumption, ideal for energy-efficient applications.

Terminal Form: GULL WING

The gull-wing style terminals offer advantages in hand soldering and automated assembly processes, improving production efficiency.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch offers compatibility with various PCB layouts, enabling greater design flexibility.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this IC can accommodate slight variations in power supply, enhancing operational reliability.

Technical Specifications

Power Management ICs STM802LM6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTGE IS 4.65V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.65V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM802LM6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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