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STM802LDS6F

STMicroelectronics

STM802LDS6F by STMicroelectronics

STM802LDS6F by STMicroelectronics is a compact power management IC with a 5V nominal voltage and operates b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports applications in industrial environments. Ideal for efficient power supply management, it ensures reliable performance in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,469 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,469

-

-

-

-

Vyrian

USA . 512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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512

-

-

-

-

Anansix

USA . 396 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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396

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,406 parts In-Stock

1+ parts

$20.511

100+ parts

-

1k+ parts

$18.460

10k+ parts

-

1,406

$20.511

-

$18.460

-

MKK Technologies

India . 1,047 parts In-Stock

1+ parts

$38.570

100+ parts

-

1k+ parts

-

10k+ parts

-

1,047

$38.570

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-

-

DigiPath Technology Company

USA . 1,047 parts In-Stock

1+ parts

$38.570

100+ parts

-

1k+ parts

-

10k+ parts

-

1,047

$38.570

-

-

-

Corphita

USA . 4,999 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,999

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-

-

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Parana Technologies

USA . 831 parts In-Stock

1+ parts

-

100+ parts

$24.524

1k+ parts

-

10k+ parts

-

831

-

$24.524

-

-

Overview

Elevate your power management solutions with the STM802LDS6F from STMicroelectronics, a trusted leader in innovation and quality. This compact IC delivers exceptional performance across a wide temperature range, ensuring reliability in demanding applications. With its robust design and space-saving profile, it effortlessly meets diverse industry needs while optimizing efficiency and reducing energy costs. Experience unparalleled value that drives productivity and enhances product reliability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental elements, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount technology allows for compact assembly and efficient manufacturing, saving space on the PCB.

Package Shape: SQUARE

The square package shape facilitates easy integration into tight spaces and a consistent footprint on the PCB.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5V is widely used, making it compatible with many electronic systems and reducing design complexity.

Power Supplies (V): 5

Designed to operate on a standard voltage level of 5V, it simplifies power supply considerations in circuit designs.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity, providing sufficient options for input/output configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A small outline, thin profile, and shrink pitch design contribute to space-saving on PCBs, which is critical for compact electronic devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is suitable for industrial applications where heat management is essential.

Minimum Operating Temperature: -40 °C

Suitable for extreme conditions, its ability to operate down to -40 °C ensures reliable performance in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance, enhancing the longevity and reliability of the connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB layout, improving assembly efficiency and reducing the risk of errors.

Maximum Seated Height: 1.1 mm

The low seated height is ideal for space-constrained applications, reducing overall product profile.

Width: 3 mm

A compact width of 3 mm is suitable for miniature electronic devices, enhancing design flexibility.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, it helps regulate power delivery, ensuring device stability and efficiency.

Minimum Supply Voltage (Vsup): 1 V

A minimum supply voltage of 1V enables the IC to work in low-power applications, making it energy efficient.

Length: 3 mm

A length of 3 mm contributes to the compact design, making it suitable for various applications where space is critical.

Nominal Threshold Voltage (V): +4.65V

The nominal threshold voltage ensures dependable performance in switching applications, making it effective for power management.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this IC is reliable for use in demanding environments requiring stability.

Maximum Supply Current (Isup): 0.06 mA

Low maximum supply current minimizes power consumption, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier mounting and soldering, improving assembly efficiency and reliability.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density layouts while maintaining accessibility for soldering.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides headroom for variations in the power supply, ensuring stable operation.

Technical Specifications

Power Management ICs STM802LDS6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTGE IS 4.65V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.65V

Width (mm):

3 mm

Trade Compliance

STM802LDS6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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