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STM795RM6E

STMicroelectronics

STM795RM6E by STMicroelectronics

STM795RM6E by STMicroelectronics is a versatile power management IC with a nominal voltage of 3.6V, operating b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports power supplies of 3/5V. Ideal for industrial applications, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,671 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,671

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Vyrian

USA . 3,290 parts In-Stock

1+ parts

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3,290

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Anansix

USA . 1,674 parts In-Stock

1+ parts

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1,674

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,793 parts In-Stock

1+ parts

$2.118

100+ parts

-

1k+ parts

$1.906

10k+ parts

-

1,793

$2.118

-

$1.906

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MKK Technologies

India . 2,219 parts In-Stock

1+ parts

$3.982

100+ parts

-

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2,219

$3.982

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DigiPath Technology Company

USA . 2,219 parts In-Stock

1+ parts

$3.982

100+ parts

-

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2,219

$3.982

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Ampacity Inc.

Singapore . 951 parts In-Stock

1+ parts

$4.500

100+ parts

-

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10k+ parts

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951

$4.500

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AZTECH Wire

Italy . 969 parts In-Stock

1+ parts

$10.170

100+ parts

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969

$10.170

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Microchip USA

USA . 258 parts In-Stock

1+ parts

$10.264

100+ parts

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258

$10.264

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Kepictronics

USA . 8,000 parts In-Stock

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8,000

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Corphita

USA . 3,355 parts In-Stock

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3,355

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Vigor

Singapore . 2,488 parts In-Stock

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2,488

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Parana Technologies

USA . 1,480 parts In-Stock

1+ parts

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$2.532

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1,480

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$2.532

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Assy Fe

Spain . 6 parts In-Stock

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6

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Overview

Elevate your designs with the STM795RM6E from STMicroelectronics, a trusted leader in power management solutions. This compact, robust IC ensures reliable performance across diverse applications, from industrial automation to consumer electronics. With superior thermal stability and efficiency, it minimizes energy loss, driving down operational costs. Experience exceptional quality and innovation that enhances your projects while meeting stringent demands, making the STM795RM6E the smart choice for modern engineers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for smaller PCB designs and higher assembly efficiency, reducing overall system size.

Package Shape: RECTANGULAR

Rectangular package shape optimizes space on the PCB and allows for easier integration with other components.

Nominal Supply Voltage (Vsup): 3.6 V

A nominal supply voltage of 3.6 V provides a reliable power level for a variety of electronics, ensuring consistent performance.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, making it versatile for use in different applications.

No. of Terminals: 8

Eight terminals provide sufficient connectivity options for various functions, enhancing versatility in design.

Package Style (Meter): SMALL OUTLINE

Small outline package style reduces footprint, allowing for compact circuit designs critical in space-constrained applications.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in warmer environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to function in temperatures as low as -40 °C makes this IC ideal for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent solderability and protection against oxidation, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB layout options, accommodating various design requirements.

Maximum Seated Height: 1.75 mm

A low seated height promotes compact designs and enables higher density packing of components on the PCB.

Width (mm): 3.9 mm

A width of 3.9 mm aids in compact design, beneficial for modern electronic devices with limited space.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply support, ensuring optimized power management in various applications.

Minimum Supply Voltage (Vsup): 1.1 V

A minimum supply voltage of 1.1 V allows the IC to operate in low-power applications, ideal for battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 40

A tolerance of up to 40 seconds at peak reflow temp ensures compatibility with standard soldering processes, enhancing manufacturability.

Peak Reflow Temperature °C: 260

Withstands peak reflow temperatures of 260 °C, confirming compatibility with modern surface mount soldering techniques.

Length: 4.9 mm

A length of 4.9 mm contributes to its small form factor, essential for today's compact electronic designs.

Nominal Threshold Voltage (V): +2.625V

A nominal threshold voltage of +2.625V enables precise voltage regulation, enhancing the overall efficiency of power supply systems.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grade, ensuring robust performance in demanding environments and applications.

Maximum Supply Current (Isup): 0.06 mA

Low maximum supply current of 0.06 mA enhances energy efficiency, making it suitable for low-power applications.

Terminal Form: GULL WING

Gull wing terminals allow for easier soldering and mechanical stability during assembly, ensuring reliable connections.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides ease of PCB layout and design flexibility, fitting well within standard practices.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V allows compatibility with a wide range of power supply sources, enhancing versatility.

Technical Specifications

Power Management ICs STM795RM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.625V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.625V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM795RM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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