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STM708RDS6E

STMicroelectronics

STM708RDS6E by STMicroelectronics

STM708RDS6E by STMicroelectronics is a compact power management IC with a nominal voltage of 3V and operates b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports voltages from 1.2V to 5.5V, ideal for industrial applications. Its thin profile design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,927 parts In-Stock

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4,927

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Digiode

USA . 3,902 parts In-Stock

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3,902

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Anansix

USA . 168 parts In-Stock

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168

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,112 parts In-Stock

1+ parts

$9.617

100+ parts

-

1k+ parts

$8.655

10k+ parts

-

1,112

$9.617

-

$8.655

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$17.753

100+ parts

$16.155

1k+ parts

$14.557

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-

1,000

$17.753

$16.155

$14.557

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MKK Technologies

India . 1,709 parts In-Stock

1+ parts

$18.084

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-

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1,709

$18.084

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DigiPath Technology Company

USA . 1,709 parts In-Stock

1+ parts

$18.084

100+ parts

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1,709

$18.084

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AZTECH Wire

Italy . 664 parts In-Stock

1+ parts

$19.810

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664

$19.810

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Microchip USA

USA . 155 parts In-Stock

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$20.145

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155

$20.145

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Component Stockers USA

USA . 401 parts In-Stock

1+ parts

$99.990

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401

$99.990

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Vigor

Singapore . 2,417 parts In-Stock

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2,417

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Parana Technologies

USA . 1,795 parts In-Stock

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$11.498

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1,795

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$11.498

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Corphita

USA . 1,130 parts In-Stock

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Overview

Unlock the potential of your designs with the STM708RDS6E from STMicroelectronics—your trusted partner in cutting-edge power management solutions. Perfectly engineered for reliability, this compact IC enhances efficiency across diverse applications, from industrial sensors to portable devices. With superior thermal performance and robust construction, it ensures longevity and optimal operation, empowering you to deliver exceptional products that stand out in today’s competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the body material ensures durability and protection against environmental factors, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient use of PCB space, which is essential for modern electronics.

Package Shape: SQUARE

The square package shape optimizes space efficiency on the PCB and helps in easy integration into various layouts.

Nominal Supply Voltage (Vsup): 3 V

With a nominal supply voltage of 3V, this IC is optimal for low-voltage applications, enhancing energy efficiency.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies offers versatility, making it suitable for a range of devices.

No. of Terminals: 8

Eight terminals provide sufficient connectivity options while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style ensures a low-profile design, contributing to space efficiency in tight spaces within electronic devices.

Maximum Operating Temperature: 85 °C

Operating at up to 85 °C makes this IC reliable for use in environments with higher thermal demands.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C ensures that this product is suitable for industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of high-quality nickel palladium gold finish enhances solderability and improves the longevity of the connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible design layouts, facilitating easier circuit board design.

Maximum Seated Height: 1.1 mm

A low seated height supports compact PCB designs and is ideal for thin-profile electronic devices.

Width: 3 mm

At only 3 mm wide, this IC is ideal for space-constrained applications such as portable devices.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit makes this IC crucial in regulating and managing power effectively.

Minimum Supply Voltage (Vsup): 1.2 V

The low minimum supply voltage enhances versatility in various low-power applications.

Length: 3 mm

With a compact length of 3 mm, this IC is ideal for mobile and other space-sensitive applications.

Nominal Threshold Voltage (V): +2.63V

A nominal threshold voltage of +2.63V ensures reliable operation in digital circuits, optimizing performance.

Temperature Grade: INDUSTRIAL

An industrial temperature grade allows for reliable performance in harsh environments, meeting demanding specifications.

Maximum Supply Current (Isup): 0.06 mA

The low current consumption of 0.06 mA translates to energy efficiency, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics and mechanical stability, ensuring robust electrical connections.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density designs while facilitating easy assembly during manufacturing.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to support up to 5.5V supply voltage further enhances its versatility for a wide range of applications.

Technical Specifications

Power Management ICs STM708RDS6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.63V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.63V

Width (mm):

3 mm

Trade Compliance

STM708RDS6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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