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STM708RAM6F

STMicroelectronics

STM708RAM6F by STMicroelectronics

STM708RAM6F by STMicroelectronics is a compact power management IC with a nominal voltage of 3V and operates b/w -40 °C to 85°C. It features an 8-terminal gull-wing package and supports supply voltages from 1.2V to 5.5V, ideal for industrial applications. Its small outline design ensures efficient space utilization in electronic devices.

Median Price

$0.320

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,500

-

-

-

-

Future Electronics

Canada . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.320

5,000

-

-

-

$0.320

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,894 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,894

-

-

-

-

Digiode

USA . 4,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,331

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-

-

-

Anansix

USA . 1,378 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,378

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,747 parts In-Stock

1+ parts

$0.285

100+ parts

-

1k+ parts

-

10k+ parts

-

3,747

$0.285

-

-

-

Vigor

Singapore . 10,000 parts In-Stock

1+ parts

$0.480

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

$0.480

-

-

-

Microchip USA

USA . 3,788 parts In-Stock

1+ parts

$6.012

100+ parts

-

1k+ parts

-

10k+ parts

-

3,788

$6.012

-

-

-

IDEA Electronic Components Group

UK . 1,259 parts In-Stock

1+ parts

$11.007

100+ parts

-

1k+ parts

$9.906

10k+ parts

-

1,259

$11.007

-

$9.906

-

AZTECH Wire

Italy . 503 parts In-Stock

1+ parts

$12.370

100+ parts

-

1k+ parts

-

10k+ parts

-

503

$12.370

-

-

-

MKK Technologies

India . 1,456 parts In-Stock

1+ parts

$20.698

100+ parts

-

1k+ parts

-

10k+ parts

-

1,456

$20.698

-

-

-

DigiPath Technology Company

USA . 1,456 parts In-Stock

1+ parts

$20.698

100+ parts

-

1k+ parts

-

10k+ parts

-

1,456

$20.698

-

-

-

Corphita

USA . 3,670 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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3,670

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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-

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Perfect Parts

USA . 2,800 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,800

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-

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Parana Technologies

USA . 137 parts In-Stock

1+ parts

-

100+ parts

$13.160

1k+ parts

-

10k+ parts

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137

-

$13.160

-

-

Overview

Unlock the potential of your designs with the STM708RAM6F power management IC from STMicroelectronics, a trusted leader in semiconductor innovation. Exceptional reliability and efficiency are at the core of this compact powerhouse, ideal for industrial applications. With its robust temperature range and low supply current, it ensures optimal performance while minimizing energy consumption. Elevate your projects with proven quality and unmatched support from STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a robust and durable package, making the IC suitable for a variety of environmental conditions.

Surface Mount: YES

Surface mount capability allows for easier integration into modern PCB designs, saving space and improving manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact footprint, ideal for applications where space is at a premium.

Nominal Supply Voltage (Vsup): 3 V

A nominal supply voltage of 3V makes this IC versatile for many common electronic applications, ensuring compatibility with various systems.

Power Supplies (V): 1.5/5

Supporting a wide range of power supply voltages (1.5V to 5V) enhances flexibility in design and compatibility with different components.

No. of Terminals: 8

With 8 terminals, this IC offers a good balance between complexity and functionality, making it suitable for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained designs, allowing for more efficient board layouts.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable operation in a variety of industrial and commercial environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is suitable for harsh environments and extreme temperature applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finishes help ensure excellent solderability and corrosion resistance, enhancing the longevity of the IC.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB design options, making it easier to route traces as needed.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm contributes to a low-profile design, further aiding in compact applications.

Width: 3.9 mm

The narrow width of 3.9 mm makes it an excellent choice for tight spaces on PCBs.

Other IC Type: POWER SUPPLY MANAGEMENT CIRCUIT

Designed specifically for power supply management, this IC is ideal for applications requiring efficient power control.

Minimum Supply Voltage (Vsup): 1.2 V

A minimum supply voltage of 1.2V allows for low-power applications, enhancing efficiency in battery-operated devices.

Maximum Time At Peak Reflow Temperature: 30 s

This specification ensures compatibility with standard soldering processes, facilitating easier and more reliable assembly.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature enables compatibility with lead-free soldering processes, making it suitable for environmentally friendly designs.

Length: 4.9 mm

A compact length of 4.9 mm allows for flexible placement on a PCB without compromising functionality.

Nominal Threshold Voltage: +4.38V

A precise nominal threshold voltage enhances the IC's performance in voltage regulation applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade assures robust performance in demanding applications, making it suitable for various industrial settings.

Maximum Supply Current (Isup): 0.06 mA

A low maximum supply current makes this IC energy-efficient, fitting perfectly into battery-powered or power-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability, reducing the risk of mechanical stress failure during operation.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many designs, ensuring compatibility with common PCB layouts.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V ensures that this IC can handle variations in power supply while delivering reliable performance.

Technical Specifications

Power Management ICs STM708RAM6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.63V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.38V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

STM708RAM6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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