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STM707M6E

STMicroelectronics

STM707M6E by STMicroelectronics

STM707M6E by STMicroelectronics is a versatile power management IC with a nominal voltage of 5V and operates in temperatures from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports power supplies ranging from 1.2V to 5.5V. Ideal for industrial applications, it ensures reliable performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,279 parts In-Stock

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7,279

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Pegasus Components GmbH

Germany . 1,900 parts In-Stock

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1,900

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ComSIT Distribution GmbH

Germany . 1,900 parts In-Stock

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1,900

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ComSIT USA

USA . 1,900 parts In-Stock

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1,900

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Anansix

USA . 1,300 parts In-Stock

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1,300

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Digiode

USA . 250 parts In-Stock

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250

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EMSNET

USA . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 421 parts In-Stock

1+ parts

$3.500

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421

$3.500

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AZTECH Wire

Italy . 311 parts In-Stock

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$15.480

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311

$15.480

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IDEA Electronic Components Group

UK . 977 parts In-Stock

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$20.361

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$18.325

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977

$20.361

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$18.325

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Microchip USA

USA . 112 parts In-Stock

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$37.363

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112

$37.363

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MKK Technologies

India . 397 parts In-Stock

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$38.288

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397

$38.288

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DigiPath Technology Company

USA . 397 parts In-Stock

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$38.288

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397

$38.288

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A-Z Elektronik GmbH

Germany . 5,414 parts In-Stock

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Parana Technologies

USA . 2,068 parts In-Stock

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$24.345

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$24.345

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Vigor

Singapore . 2,015 parts In-Stock

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Kepictronics

USA . 1,900 parts In-Stock

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1,900

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Corphita

USA . 873 parts In-Stock

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873

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Overview

Elevate your power management solutions with the STM707M6E from STMicroelectronics. Renowned for their quality and innovation, STMicroelectronics ensures this robust IC excels in diverse applications, from industrial control to consumer electronics. With its compact design, exceptional thermal performance, and reliability in extreme conditions, the STM707M6E is engineered to enhance efficiency and longevity, delivering unmatched value and peace of mind for all your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs and enables automated assembly, enhancing manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into different PCB layouts, optimizing design flexibility.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5V is standard for many electronics, ensuring compatibility with a wide range of devices.

Power Supplies (V): 1.5/5

Versatility in operating with multiple supply voltages (1.5V and 5V) allows for broader application in different systems.

No. of Terminals: 8

Eight terminals provide essential connectivity options while maintaining a compact design, ideal for space-constrained applications.

Package Style (Meter): SMALL OUTLINE

Small outline packaging provides reduced footprint on PCBs, allowing for more compact designs.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this IC suitable for industrial environments and demanding applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is reliable for outdoor and extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish ensures excellent corrosion resistance and enhanced solderability for reliable performance.

Terminal Position: DUAL

Dual terminal positioning allows for flexible routing options in PCB design, improving layout efficiency.

Maximum Seated Height: 1.75 mm

A low maximum seated height supports compact assembly and helps maintain a sleek profile in designs.

Width: 3.9 mm

A narrow width facilitates placement in dense layouts, beneficial for miniaturized electronic devices.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

This product serves as a support circuit for power supply management, enhancing overall power efficiency in electronic designs.

Minimum Supply Voltage (Vsup): 1.2 V

With a minimum supply voltage of 1.2V, this IC can work efficiently in low-voltage systems, broadening its application range.

Length: 4.9 mm

A compact length allows for efficient use of space on PCBs, contributing to smaller overall device dimensions.

Nominal Threshold Voltage (V): +4.63V

The nominal threshold voltage ensures reliable switching behavior, enhancing the protection and performance of associated circuits.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature applications, this IC provides durability and reliability in harsh operating conditions.

Maximum Supply Current (Isup): 0.06 mA

Low maximum supply current helps minimize power consumption, improving energy efficiency in battery-operated devices.

Terminal Form: GULL WING

Gull-wing terminals allow for easier soldering and mounting, contributing to reliable mechanical and electrical connections.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch accommodates a wide range of PCB layouts, making it versatile for different applications.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle a supply voltage up to 5.5V provides some design headroom, enhancing flexibility for power supply configurations.

Technical Specifications

Power Management ICs STM707M6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.63V; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.63V

Width (mm):

3.9 mm

Trade Compliance

STM707M6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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