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STM706RDS6E

STMicroelectronics

STM706RDS6E by STMicroelectronics

STM706RDS6E by STMicroelectronics is a compact power management IC with a nominal voltage of 3V and operates b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports supply voltages from 1.2V to 5.5V, ideal for industrial applications. Its thin profile design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,858 parts In-Stock

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4,858

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Anansix

USA . 2,484 parts In-Stock

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2,484

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Digiode

USA . 1,621 parts In-Stock

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1,621

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Distributors (Availability)

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$4.189

100+ parts

$3.812

1k+ parts

$3.435

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-

100

$4.189

$3.812

$3.435

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IDEA Electronic Components Group

UK . 1,509 parts In-Stock

1+ parts

$7.717

100+ parts

-

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$6.945

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-

1,509

$7.717

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$6.945

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MKK Technologies

India . 1,736 parts In-Stock

1+ parts

$14.511

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-

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1,736

$14.511

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DigiPath Technology Company

USA . 1,736 parts In-Stock

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$14.511

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1,736

$14.511

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AZTECH Wire

Italy . 398 parts In-Stock

1+ parts

$16.390

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398

$16.390

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Component Stockers USA

USA . 389 parts In-Stock

1+ parts

$99.990

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389

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 21,674 parts In-Stock

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21,674

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A-Z Elektronik GmbH

Germany . 4,865 parts In-Stock

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4,865

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Microchip USA

USA . 3,405 parts In-Stock

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3,405

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Vigor

Singapore . 3,346 parts In-Stock

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3,346

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Parana Technologies

USA . 1,052 parts In-Stock

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$9.227

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1,052

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$9.227

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Corphita

USA . 439 parts In-Stock

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439

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Overview

Elevate your designs with the STM706RDS6E from STMicroelectronics, a trusted leader in power management solutions. This sleek, compact IC ensures reliable performance across a wide temperature range, making it perfect for industrial applications. Enjoy the benefits of enhanced energy efficiency and superior thermal management, all backed by ST's renowned quality and innovation. Transform your projects with unmatched reliability and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making it suitable for various applications in power management.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic systems.

Package Shape: SQUARE

A square shape facilitates symmetrical mounting and space-efficient designs in PCBs.

Nominal Supply Voltage (Vsup): 3 V

The nominal supply voltage is optimal for a wide range of low-voltage applications, ensuring efficient performance.

Power Supplies (V): 3/5

Supports power supply levels of 3V and 5V, providing flexibility for different system requirements.

No. of Terminals: 8

Eight terminals allow for various connections, facilitating greater functionality in power management applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline with a thin profile and shrink pitch enables higher density layouts, ideal for compact designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can perform reliably in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures functionality in extreme conditions, making it suitable for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish enhances conductivity and improves soldering reliability, ensuring a robust connection.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB design and easier integration into complex layouts.

Maximum Seated Height: 1.1 mm

A low seated height allows for slimmer designs and is ideal for space-constrained applications.

Width: 3 mm, Length: 3 mm

Compact dimensions make it easy to incorporate into various electronic devices without taking up excessive space.

Nominal Threshold Voltage (V): +2.63V

The threshold voltage ensures efficient switching characteristics, enhancing circuit performance and reliability.

Temperature Grade: INDUSTRIAL

Rated for industrial applications, this IC offers reliability in challenging environments, suitable for long-term operation.

Maximum Supply Current (Isup): 0.06 mA

Low supply current maximizes energy efficiency, making it an excellent choice for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and better mechanical strength on PCBs, enhancing reliability.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for compact layouts, beneficial for high-density circuit designs.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a wide range of supply voltages, allowing versatility for different applications and enhancing design flexibility.

Minimum Supply Voltage (Vsup): 1.2 V

The low minimum supply voltage broadens the range of compatible applications, making it versatile for modern electronic devices.

Technical Specifications

Power Management ICs STM706RDS6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.63V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.63V

Width (mm):

3 mm

Trade Compliance

STM706RDS6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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