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STGWT60H60DLFB

STMicroelectronics

STGWT60H60DLFB by STMicroelectronics

STGWT60H60DLFB by STMicroelectronics is an N-CHANNEL IGBT with 600V VCEsat, 80A IC, and 375W power dissipation. Ideal for power control applications due to its single configuration with built-in diode and flange mount package style. Operating temperature ranges from -55 °C to 175°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,611 parts In-Stock

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Anansix

USA . 2,818 parts In-Stock

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Digiode

USA . 663 parts In-Stock

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663

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,213 parts In-Stock

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$1.375

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$1.238

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$1.375

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MKK Technologies

India . 392 parts In-Stock

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$2.586

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392

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DigiPath Technology Company

USA . 392 parts In-Stock

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$2.586

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392

$2.586

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AZTECH Wire

Italy . 1,072 parts In-Stock

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$10.630

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$10.630

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Corphita

USA . 2,995 parts In-Stock

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2,995

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Parana Technologies

USA . 2,294 parts In-Stock

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$1.644

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$1.644

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Perfect Parts

USA . 644 parts In-Stock

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Overview

Experience the next level of power control with the STGWT60H60DLFB Insulated Gate Bipolar Transistor from STMicroelectronics. Manufactured by a trusted industry leader, this N-CHANNEL transistor offers unparalleled performance and reliability for a variety of applications. With a maximum collector-emitter voltage of 600V and a maximum operating temperature of 175 °C, this transistor is designed to handle high-power tasks with ease. Whether you're working on industrial machinery or automotive systems, this single configuration transistor with a built-in diode provides the value and efficiency you need to succeed. Upgrade to the STGWT60H60DLFB and unleash the full potential of your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, making the product suitable for various industrial applications.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have higher mobility and lower on-resistance, resulting in better efficiency and performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for easier circuit design and helps in reducing component count.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring reliable and efficient operation.

Maximum VCEsat: 2 V

Low VCEsat minimizes power dissipation and improves overall efficiency of the device.

Package Shape: RECTANGULAR

Rectangular shape provides easy mounting and integration into different systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering during installation.

Maximum Power Dissipation (Abs): 375 W

High power dissipation capability allows for handling of large power loads without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount design offers easy installation and efficient heat dissipation.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures stable performance even in demanding environments.

Maximum Collector-Emitter Voltage: 600 V

High voltage rating enables the device to handle high voltage applications safely.

Transistor Element Material: SILICON

Silicon material offers good thermal conductivity and high temperature tolerance, enhancing the reliability of the transistor.

Maximum Gate-Emitter Voltage: 20 V

Sufficient gate-emitter voltage rating allows for effective gate control to switch the transistor on and off.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures reliable operation even in cold climates or industrial freezers.

Maximum Collector Current (IC): 80 A

High collector current rating enables the device to handle large current loads efficiently.

Maximum Gate-Emitter Threshold Voltage: 7 V

Optimal gate-emitter threshold voltage facilitates precise control over the switching characteristics of the transistor.

Terminal Position: SINGLE

Single terminal position simplifies connection and circuit design, making installation easier.

Case Connection: COLLECTOR

Collector case connection allows for efficient heat dissipation and improved thermal management.

Nominal Turn On Time (ton): 301 ns

Fast turn-on time ensures quick response and accurate switching operations in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWT60H60DLFB attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn On Time (ton):

301 ns

Maximum VCEsat:

2 V

Trade Compliance

STGWT60H60DLFB Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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