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STGWT30H65FB

STMicroelectronics

STGWT30H65FB by STMicroelectronics

STGWT30H65FB by STMicroelectronics is an N-CHANNEL IGBT with 650V VCE, 60A IC, and 260W power dissipation. Ideal for POWER CONTROL applications due to its fast turn-off time of 223ns and low VCEsat of 2V. Package style is FLANGE MOUNT with THROUGH-HOLE terminals.

Median Price

$1.833

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 518 parts In-Stock

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$1.506

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518

$1.506

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Chip1Stop

Japan . 518 parts In-Stock

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$2.160

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518

$2.160

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DigiKey

USA . 464 parts In-Stock

1+ parts

$3.630

100+ parts

$2.003

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$1.645

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464

$3.630

$2.003

$1.645

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Future Electronics

Canada . 600 parts In-Stock

1+ parts

-

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$1.490

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$1.440

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$1.400

600

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$1.490

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$1.400

Verical

USA . 518 parts In-Stock

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518

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Digiode

USA . 3,187 parts In-Stock

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$1.415

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Vyrian

USA . 6,861 parts In-Stock

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Anansix

USA . 2,133 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,988 parts In-Stock

1+ parts

$0.616

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$0.555

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1,988

$0.616

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$0.555

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MKK Technologies

India . 1,546 parts In-Stock

1+ parts

$1.159

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1,546

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DigiPath Technology Company

USA . 1,546 parts In-Stock

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$1.159

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1,546

$1.159

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Corphita

USA . 2,288 parts In-Stock

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$1.340

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Component Stockers USA

USA . 1,527 parts In-Stock

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$1.500

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$1.500

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1,527

$1.500

$1.500

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Microchip USA

USA . 193 parts In-Stock

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$21.580

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193

$21.580

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Perfect Parts

USA . 963 parts In-Stock

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Parana Technologies

USA . 837 parts In-Stock

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$0.737

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837

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$0.737

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Overview

Unlock the power of precision with the STGWT30H65FB by STMicroelectronics. Designed with quality and reliability in mind, this insulated gate bipolar transistor offers unparalleled performance for power control applications. With a maximum collector-emitter voltage of 650V and a maximum operating temperature of 175 °C, this N-channel transistor is a game-changer in the industry. Say goodbye to inefficiencies and hello to optimized power management with the STGWT30H65FB. Elevate your projects with this high-performance component today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides insulation and protection, making the IGBT durable and reliable for various applications.

Maximum VCEsat: 2 V

Low VCEsat value indicates efficient power control and reduced power losses, making it an energy-efficient choice.

Maximum Power Dissipation (Abs): 260 W

High power dissipation capability allows the IGBT to handle heavy loads and high-power applications effectively.

Maximum Gate-Emitter Voltage: 20 V

Higher gate-emitter voltage allows for better control and switching performance, enhancing the overall efficiency of the device.

Maximum Collector Current (IC): 60 A

High collector current rating enables the IGBT to handle large amounts of current, making it suitable for power control applications.

Maximum Collector-Emitter Voltage: 650 V

High collector-emitter voltage rating ensures the IGBT can withstand voltage spikes and surges, enhancing its reliability in high-voltage circuits.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWT30H65FB attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

223 ns

Nominal Turn On Time (ton):

51.1 ns

Maximum VCEsat:

2 V

Trade Compliance

STGWT30H65FB Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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