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STGWT28IH125DF

STMicroelectronics

STGWT28IH125DF by STMicroelectronics

STGWT28IH125DF from STMicroelectronics is a robust N-channel IGBT designed for high-efficiency applications. It features a max VCEsat of 2.5V, supports up to 375W power dissipation, and operates in extreme temps (-55 °C to 175 °C). Ideal for industrial motor control and power conversion.

Median Price

$2.251

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 600 parts In-Stock

1+ parts

$2.251

100+ parts

-

1k+ parts

$1.707

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-

600

$2.251

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$1.707

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Avnet

USA . 1,080 parts In-Stock

1+ parts

-

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1,080

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Verical

USA . 600 parts In-Stock

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600

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Distributors (In-Stock)

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Digiode

USA . 277 parts In-Stock

1+ parts

$1.535

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277

$1.535

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Anansix

USA . 2,502 parts In-Stock

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2,502

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Vyrian

USA . 2,013 parts In-Stock

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2,013

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,373 parts In-Stock

1+ parts

$0.795

100+ parts

-

1k+ parts

$0.715

10k+ parts

-

2,373

$0.795

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$0.715

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Corphita

USA . 1,882 parts In-Stock

1+ parts

$1.454

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1,882

$1.454

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MKK Technologies

India . 1,705 parts In-Stock

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$1.495

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1,705

$1.495

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DigiPath Technology Company

USA . 1,705 parts In-Stock

1+ parts

$1.495

100+ parts

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1,705

$1.495

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AZTECH Wire

Italy . 138 parts In-Stock

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$15.670

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138

$15.670

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Microchip USA

USA . 2,563 parts In-Stock

1+ parts

$18.794

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2,563

$18.794

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Parana Technologies

USA . 150 parts In-Stock

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$0.950

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150

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$0.950

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Overview

Unlock unparalleled efficiency and reliability with the STGWT28IH125DF from STMicroelectronics, a leader in semiconductor innovation. This N-channel IGBT delivers exceptional performance for demanding applications, thanks to its robust design and built-in diode feature. With superior thermal management and high voltage capabilities, it’s perfect for industrial drives, renewable energy systems, and automotive powertrains. Elevate your projects and ensure long-lasting performance with this trusted component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration allows for high-speed switching and low on-resistance, making it efficient for power conversion.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by eliminating the need for external components, improving reliability.

Maximum VCEsat: 2.5 V

A low VCEsat indicates reduced power losses during operation, allowing for higher efficiency in power applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy PCB layout, helping in compact designs which are ideal for space-constrained applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust mechanical support and are suitable for high-power applications, ensuring reliable connections.

Nominal Turn Off Time (toff): 322 ns

A fast turn-off time aids in high-frequency operation, making this IGBT a great choice for switching applications.

No. of Terminals: 3

The three-terminal design allows for versatile configurations and simplifies circuit integration.

Maximum Power Dissipation (Abs): 375 W

High power dissipation capability makes it suitable for demanding applications, ensuring stability under load.

Package Style (Meter): FLANGE MOUNT

Flange mount style enables better thermal management and mechanical stability, ideal for high-performance systems.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature ensures reliability in extreme environments, increasing the design's flexibility.

Maximum Collector-Emitter Voltage: 1250 V

High voltage rating allows it to be used in a wide range of applications, including industrial and automotive systems.

Transistor Element Material: SILICON

Silicon material provides good thermal conductivity and robustness, ensuring consistent performance.

Maximum Gate-Emitter Voltage: 20 V

This high gate-emitter voltage supports diverse driver configurations, enhancing versatility in application designs.

Minimum Operating Temperature: -55 °C

A wide operating temperature range allows this IGBT to function in extreme conditions, broadening its application scope.

Maximum Collector Current (IC): 60 A

Supporting high collector current enhances its use in power applications, ensuring efficient performance.

Maximum Gate-Emitter Threshold Voltage: 7 V

This threshold voltage ensures reliable switching under various operational states, reducing the likelihood of false triggering.

Terminal Position: SINGLE

A single terminal position simplifies the design layout, making it easier to integrate into existing circuits.

Case Connection: COLLECTOR

Having the collector case connection enhances thermal dissipation and current handling in high-power applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWT28IH125DF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1250 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

322 ns

Maximum VCEsat:

2.5 V

Trade Compliance

STGWT28IH125DF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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