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STGWT15H60F

STMicroelectronics

STGWT15H60F by STMicroelectronics

STGWT15H60F by STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max VCEsat of 2V, supports up to 600V collector-emitter voltage, and operates at temperatures from -55 °C to 175 °C. Ideal for high-performance switching in industrial systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,248 parts In-Stock

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7,248

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Digiode

USA . 3,079 parts In-Stock

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3,079

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Anansix

USA . 722 parts In-Stock

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722

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,067 parts In-Stock

1+ parts

$0.866

100+ parts

-

1k+ parts

$0.779

10k+ parts

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2,067

$0.866

-

$0.779

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MKK Technologies

India . 786 parts In-Stock

1+ parts

$1.628

100+ parts

-

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786

$1.628

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DigiPath Technology Company

USA . 786 parts In-Stock

1+ parts

$1.628

100+ parts

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786

$1.628

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AZTECH Wire

Italy . 1,189 parts In-Stock

1+ parts

$11.660

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1,189

$11.660

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Corphita

USA . 4,272 parts In-Stock

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4,272

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Parana Technologies

USA . 1,513 parts In-Stock

1+ parts

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100+ parts

$1.035

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1,513

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$1.035

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Overview

Elevate your power control solutions with the STGWT15H60F from STMicroelectronics, a leader in innovation and reliability. This high-performance N-channel IGBT ensures exceptional efficiency and robust durability, making it perfect for demanding applications like motor drives and renewable energy systems. With rapid switching times and outstanding thermal management, enjoy reduced energy costs and enhanced system performance that stand the test of time. Experience quality that powers progress!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package material offers excellent durability and protection against environmental factors, making this IGBT suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors provide higher efficiency and lower on-state resistance, which enhances performance in power control applications.

Configuration: SINGLE

A single configuration simplifies circuit design, making it easier to implement in various power control systems.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT ensures reliable performance in demanding power management tasks.

Maximum VCEsat: 2 V

A low VCEsat value signifies minimal voltage drop and lower power losses, contributing to higher efficiency during operation.

Package Shape: RECTANGULAR

Rectangular package shape allows easier mounting and integration into various circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure mounting and robust electrical connections, enhancing reliability in high-power applications.

Nominal Turn Off Time (toff): 225 ns

A quick turn-off time supports efficient switching operations, essential for high-frequency applications.

No. of Terminals: 3

With 3 terminals, this IGBT enables versatile connections, accommodating various circuit configurations.

Maximum Power Dissipation (Abs): 115 W

A high power dissipation capability ensures the device can handle substantial power loads without failure.

Package Style (Meter): FLANGE MOUNT

Flange mount design provides easy installation and effective heat dissipation, critical for maintaining operational stability.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature enhances reliability in demanding environments, making it suitable for industrial applications.

Maximum Collector-Emitter Voltage: 600 V

Support for high collector-emitter voltage enables the IGBT to be used in applications requiring high voltage management.

Transistor Element Material: SILICON

Silicon components ensure robust performance and stability in power control applications.

Maximum Gate-Emitter Voltage: 20 V

A high maximum gate-emitter voltage allows for better control and adaptability in different circuit situations.

Minimum Operating Temperature: -55 °C

Whithstanding low temperatures ensures reliable performance in harsh environments and extreme applications.

Maximum Collector Current (IC): 30 A

A high collector current rating enables handling significant loads, making this IGBT suitable for demanding power applications.

Maximum Gate-Emitter Threshold Voltage: 7 V

A moderate gate-emitter threshold voltage ensures adequate switching and operational efficiency.

Terminal Position: SINGLE

The single terminal position simplifies layout design, aiding in efficient circuit design.

Case Connection: COLLECTOR

Direct collector connection improves performance and reduces potential connection issues.

Nominal Turn On Time (ton): 34 ns

A low turn-on time ensures fast response for rapid switching applications, enhancing overall system performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWT15H60F attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

225 ns

Nominal Turn On Time (ton):

34 ns

Maximum VCEsat:

2 V

Trade Compliance

STGWT15H60F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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