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STGWA60NC60WDR

STMicroelectronics

STGWA60NC60WDR by STMicroelectronics

STGWA60NC60WDR by STMicroelectronics is an N-CHANNEL IGBT with 600V max collector-emitter voltage, 130A max collector current, and 340W max power dissipation. Ideal for power control applications due to its single configuration with built-in diode and fast turn-off time of 343ns.

Median Price

$7.910

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 425 parts In-Stock

1+ parts

$7.910

100+ parts

$4.653

1k+ parts

$4.188

10k+ parts

-

425

$7.910

$4.653

$4.188

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,772 parts In-Stock

1+ parts

$8.902

100+ parts

-

1k+ parts

-

10k+ parts

-

1,772

$8.902

-

-

-

Vyrian

USA . 3,855 parts In-Stock

1+ parts

-

100+ parts

-

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3,855

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-

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Anansix

USA . 390 parts In-Stock

1+ parts

-

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390

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 420 parts In-Stock

1+ parts

$1.038

100+ parts

-

1k+ parts

$0.934

10k+ parts

-

420

$1.038

-

$0.934

-

MKK Technologies

India . 608 parts In-Stock

1+ parts

$1.951

100+ parts

-

1k+ parts

-

10k+ parts

-

608

$1.951

-

-

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DigiPath Technology Company

USA . 608 parts In-Stock

1+ parts

$1.951

100+ parts

-

1k+ parts

-

10k+ parts

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608

$1.951

-

-

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Ampacity Inc.

Singapore . 87 parts In-Stock

1+ parts

$7.960

100+ parts

-

1k+ parts

-

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87

$7.960

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-

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Corphita

USA . 961 parts In-Stock

1+ parts

$8.433

100+ parts

-

1k+ parts

-

10k+ parts

-

961

$8.433

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-

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Microchip USA

USA . 5,073 parts In-Stock

1+ parts

$22.316

100+ parts

-

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-

10k+ parts

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5,073

$22.316

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Parana Technologies

USA . 2,103 parts In-Stock

1+ parts

-

100+ parts

$1.241

1k+ parts

-

10k+ parts

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2,103

-

$1.241

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Overview

Unlock the power of efficient and reliable power control with the STGWA60NC60WDR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are perfect for a wide range of applications. With its N-channel configuration, built-in diode, and high collector current, this transistor offers unbeatable performance and durability. Whether you're in need of power control for industrial machinery or renewable energy systems, the STGWA60NC60WDR provides the value and benefits you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material helps in providing good insulation and protection for the transistor, making it durable and reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower ON-state resistance and higher efficiency, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can help in reducing component count, leading to cost savings.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT can efficiently handle high voltages and currents with minimal losses.

Maximum Power Dissipation (Abs): 340 W

With a high maximum power dissipation capability, this IGBT can handle large power loads without overheating, ensuring reliable performance.

Maximum Collector-Emitter Voltage: 600 V

The high collector-emitter voltage rating allows this IGBT to be used in a wide range of high-voltage applications.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage rating ensures proper gate control and protection, preventing damage to the IGBT during operation.

Maximum Collector Current (IC): 130 A

With a high collector current rating, this IGBT can handle large current loads, making it suitable for high-power applications.

Nominal Turn On Time (ton): 69 ns

The fast turn-on time ensures quick response and switching speed, which is essential for power control applications where timing is critical.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWA60NC60WDR attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

343 ns

Nominal Turn On Time (ton):

69 ns

Trade Compliance

STGWA60NC60WDR Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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