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STGWA30H65DFB

STMicroelectronics

STGWA30H65DFB by STMicroelectronics

STGWA30H65DFB from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control. It features a max VCEsat of 2V, supports up to 60A collector current, and operates in temperatures from -55 °C to 175 °C. Ideal for high-performance applications, it ensures reliable operation with built-in diode support.

Median Price

$4.170

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Avnet

USA . 540 parts In-Stock

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TME

Poland . 2 parts In-Stock

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$4.170

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$2.980

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Vyrian

USA . 5,551 parts In-Stock

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Anansix

USA . 2,298 parts In-Stock

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Digiode

USA . 696 parts In-Stock

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IDEA Electronic Components Group

UK . 119 parts In-Stock

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$1.067

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$0.960

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MKK Technologies

India . 2,272 parts In-Stock

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$2.007

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DigiPath Technology Company

USA . 2,272 parts In-Stock

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$2.007

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Microchip USA

USA . 9,220 parts In-Stock

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$15.619

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$15.619

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AZTECH Wire

Italy . 433 parts In-Stock

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$16.260

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QUARKTWIN TECHNOLOGY LTD

USA . 22,261 parts In-Stock

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Corphita

USA . 2,148 parts In-Stock

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Parana Technologies

USA . 1,925 parts In-Stock

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$1.276

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Eastek

USA . 540 parts In-Stock

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GreenTree Electronics

Israel . 540 parts In-Stock

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Overview

Elevate your power control solutions with the STGWA30H65DFB IGBT from STMicroelectronics—where reliability meets innovation. Designed for high performance, this robust N-channel transistor excels in demanding applications, offering exceptional durability and thermal stability. With a built-in diode and impressive efficiency, it seamlessly handles power management tasks, delivering unmatched value and peace of mind for engineers seeking quality and performance in every project. Choose STMicroelectronics for cutting-edge technology that truly empowers your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental conditions, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel configurations typically provide better performance in terms of speed and efficiency in power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves reliability by reducing the number of components needed.

Transistor Application: POWER CONTROL

Designed specifically for power control, ensuring efficient management of high voltage and current.

Maximum VCEsat: 2 V

A low VCEsat indicates reduced power loss during operation, enhancing overall efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes space efficiency on circuit boards, allowing for compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide solid mechanical strength and ease of handling during assembly.

Nominal Turn Off Time (toff): 223 ns

A nominal turn-off time of 223 ns allows for faster switching, improving the performance of high-frequency applications.

No. of Terminals: 3

Three terminals enable versatile connections, suitable for various integration and circuit designs.

Maximum Power Dissipation (Abs): 260 W

High power dissipation capability makes it suitable for demanding applications requiring substantial power handling.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides enhanced stability and heat dissipation, improving longevity under load.

Maximum Operating Temperature: 175 °C

High operating temperature tolerance allows for reliable performance in environments with extreme conditions.

Maximum Collector-Emitter Voltage: 650 V

A high voltage rating enables the use of this IGBT in high-voltage applications, ensuring its versatility.

Transistor Element Material: SILICON

Silicon is widely used in semiconductor technology, ensuring proven performance and reliability.

Maximum Gate-Emitter Voltage: 20 V

This voltage rating allows for compatibility with a wide range of control circuitry, simplifying design integration.

Minimum Operating Temperature: -55 °C

The ability to operate in low temperatures expands potential applications in harsh environments.

Maximum Collector Current (IC): 60 A

With a maximum collector current of 60 A, this IGBT can handle substantial loads, making it suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 7 V

A moderate threshold voltage enables efficient drive requirements, minimizing power loss during operation.

Terminal Position: SINGLE

A single terminal position streamlines installation and reduces complexity in circuit layout.

Nominal Turn On Time (ton): 62.8 ns

Fast turn-on capability enhances the responsiveness of power control applications, ensuring optimal performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWA30H65DFB attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

223 ns

Nominal Turn On Time (ton):

62.8 ns

Maximum VCEsat:

2 V

Trade Compliance

STGWA30H65DFB Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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