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STGW80H65FB-4

STMicroelectronics

STGW80H65FB-4 by STMicroelectronics

STGW80H65FB-4 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max VCEsat of 2V, supports up to 120A collector current, and operates in temperatures from -55 °C to 175 °C. Its robust design includes a built-in diode and Kelvin sensor for enhanced performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,819 parts In-Stock

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3,819

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Vyrian

USA . 2,030 parts In-Stock

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2,030

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Anansix

USA . 622 parts In-Stock

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622

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 649 parts In-Stock

1+ parts

$0.328

100+ parts

-

1k+ parts

$0.295

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649

$0.328

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$0.295

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MKK Technologies

India . 2,174 parts In-Stock

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$0.616

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2,174

$0.616

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DigiPath Technology Company

USA . 2,174 parts In-Stock

1+ parts

$0.616

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2,174

$0.616

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AZTECH Wire

Italy . 685 parts In-Stock

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$20.350

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685

$20.350

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QUARKTWIN TECHNOLOGY LTD

USA . 8,887 parts In-Stock

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8,887

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Corphita

USA . 4,919 parts In-Stock

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4,919

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Parana Technologies

USA . 352 parts In-Stock

1+ parts

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$0.392

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352

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$0.392

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Overview

Unlock unparalleled performance with the STGW80H65FB-4 from STMicroelectronics, a leader in innovation and reliability. This exceptional N-channel IGBT delivers superior power control for diverse applications, ensuring efficiency and durability in demanding environments. With its robust design and built-in diode, it excels in thermal management and switching speed, making it the ideal choice for industries that prioritize quality and performance. Choose STMicroelectronics for unmatched value and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package material provides excellent insulation and durability, making this IGBT suitable for various demanding applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally offer higher efficiency, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND KELVIN SENSOR

This configuration allows for effective switching operations and simplifies circuit designs, enhancing ease of use in power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT excels in high-power switching applications, ensuring optimal performance.

Maximum VCEsat: 2 V

A low saturation voltage ensures greater efficiency and lower power losses during operation, making it suitable for energy-sensitive applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier mounting options and better thermal management, contributing to overall system reliability.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections, ensuring reliability in demanding environments.

Nominal Turn Off Time (toff): 448 ns

A nominal turn-off time of 448 ns enables quick switching, which is crucial for high-performance applications requiring rapid response.

No. of Terminals: 4

Having four terminals allows for more connectivity options and flexibility in circuit design.

Maximum Power Dissipation (Abs): 469 W

With a high power dissipation capability of 469 W, this IGBT can handle substantial power loads, ensuring durability under high stresses.

Package Style (Meter): FLANGE MOUNT

Flange mount style aids in better thermal management and heat dissipation, prolonging the device's lifespan in high-temperature environments.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature of 175 °C allows the IGBT to function effectively in extreme conditions, ideal for industrial applications.

Maximum Collector-Emitter Voltage: 650 V

The 650 V rating enables this IGBT to be used in various high-voltage applications, expanding its range of potential uses.

Transistor Element Material: SILICON

Silicon material enhances thermal conductivity and reliability, ensuring consistent performance over time.

Maximum Gate-Emitter Voltage: 20 V

A maximum voltage of 20 V for the gate-emitter allows consistent and reliable control over the IGBT switching, enhancing its performance.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this IGBT is suitable for use in harsh environmental conditions, ensuring versatility.

Maximum Collector Current (IC): 120 A

A collector current rating of 120 A allows for handling significant current loads, making it ideal for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 7 V

The 7 V gate-emitter threshold assures stable operation in various control conditions, ensuring reliability in circuit designs.

Terminal Position: SINGLE

Single terminal positioning simplifies the integration into circuits, providing ease in design and assembly.

Nominal Turn On Time (ton): 104 ns

A quick turn-on time of 104 ns enhances switching efficiency, essential for applications requiring fast response times.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW80H65FB-4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

448 ns

Nominal Turn On Time (ton):

104 ns

Maximum VCEsat:

2 V

Trade Compliance

STGW80H65FB-4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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