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STGW60H65F

STMicroelectronics

STGW60H65F by STMicroelectronics

STGW60H65F by STMicroelectronics is an N-CHANNEL IGBT with 650V VCE, 120A IC, and 360W Ptot. It's used for POWER CONTROL applications due to its fast turn-off time of 265ns and high operating temperature of 150 °C. The transistor comes in a RECTANGULAR package with THROUGH-HOLE terminals.

Median Price

$4.766

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,200 parts In-Stock

1+ parts

$3.942

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1,200

$3.942

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Chip1Stop

Japan . 1,200 parts In-Stock

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$5.590

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1,200

$5.590

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Verical

USA . 1,200 parts In-Stock

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1,200

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Distributors (In-Stock)

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Digiode

USA . 1,434 parts In-Stock

1+ parts

$3.703

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1,434

$3.703

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Vyrian

USA . 2,985 parts In-Stock

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2,985

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Anansix

USA . 2,397 parts In-Stock

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2,397

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R&J Components

USA . 550 parts In-Stock

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550

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,812 parts In-Stock

1+ parts

$1.420

100+ parts

-

1k+ parts

$1.278

10k+ parts

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1,812

$1.420

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$1.278

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Advanced Electronics

New Zealand . 750 parts In-Stock

1+ parts

$1.941

100+ parts

$1.766

1k+ parts

$1.592

10k+ parts

-

750

$1.941

$1.766

$1.592

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MKK Technologies

India . 639 parts In-Stock

1+ parts

$2.671

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639

$2.671

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DigiPath Technology Company

USA . 639 parts In-Stock

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$2.671

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639

$2.671

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Corphita

USA . 4,934 parts In-Stock

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$3.508

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4,934

$3.508

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AZTECH Wire

Italy . 1,221 parts In-Stock

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$10.210

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$10.210

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A-Z Elektronik GmbH

Germany . 6,588 parts In-Stock

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Perfect Parts

USA . 1,216 parts In-Stock

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Parana Technologies

USA . 435 parts In-Stock

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$1.698

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435

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Assy Fe

Spain . 120 parts In-Stock

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Overview

Looking for a reliable solution for power control applications? Look no further than the STGW60H65F from STMicroelectronics! This insulated gate bipolar transistor offers high-quality performance and durability, thanks to its N-CHANNEL configuration and SILICON element material. With a maximum collector-emitter voltage of 650V and a nominal turn-off time of 265ns, this transistor is perfect for a wide range of power control applications. Trust STMicroelectronics for top-of-the-line products that deliver exceptional value and benefits to our customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the IGBT lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses compared to P-channel IGBTs, making them more efficient for power control applications.

Configuration: SINGLE

Single configuration IGBTs are simpler to use and offer a straightforward solution for power control.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring reliable performance and efficient operation.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and installation in various electronic systems.

Nominal Turn Off Time (toff): 265 ns

Fast turn-off time of 265ns helps in reducing switching losses and improves overall efficiency of the IGBT.

No. of Terminals: 3

Three terminals provide essential connections for effective power control and integration into circuits.

Maximum Power Dissipation (Abs): 360 W

High maximum power dissipation of 360W allows for handling of high power levels and ensures reliability under heavy loads.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers convenient mounting options and secure installation in electronic systems.

Maximum Operating Temperature: 150 °C

High maximum operating temperature of 150 °C ensures stable performance even in demanding environments.

Maximum Collector-Emitter Voltage: 650 V

With a high maximum collector-emitter voltage of 650V, the IGBT can handle high voltage applications with ease.

Transistor Element Material: SILICON

Silicon material provides good thermal conductivity and electrical properties, ensuring reliable and efficient operation of the IGBT.

Maximum Gate-Emitter Voltage: 20 V

Low maximum gate-emitter voltage of 20V ensures compatibility with standard control signals and ease of use in various circuits.

Maximum Collector Current (IC): 120 A

High maximum collector current of 120A enables the IGBT to handle large current flows, making it suitable for high-power applications.

Terminal Position: SINGLE

Single terminal position simplifies the connection and integration of the IGBT into electronic circuits, reducing complexity.

Nominal Turn On Time (ton): 96 ns

Fast turn-on time of 96ns facilitates quick switching operations and helps in improving overall system efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW60H65F attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

265 ns

Nominal Turn On Time (ton):

96 ns

Trade Compliance

STGW60H65F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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