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STGW50H65DFB2-4

STMicroelectronics

STGW50H65DFB2-4 by STMicroelectronics

STGW50H65DFB2-4 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control. It features a max VCEsat of 2V, supports up to 86A collector current, and operates at temperatures from -55 °C to 175 °C. Ideal for high-performance applications in industrial and automotive sectors.

Median Price

$3.959

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 600 parts In-Stock

1+ parts

$3.959

100+ parts

$3.148

1k+ parts

$2.773

10k+ parts

-

600

$3.959

$3.148

$2.773

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Mouser Electronics

USA . 564 parts In-Stock

1+ parts

$5.300

100+ parts

$2.260

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-

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564

$5.300

$2.260

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Avnet

USA . 600 parts In-Stock

1+ parts

-

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600

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Verical

USA . 600 parts In-Stock

1+ parts

-

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600

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Future Electronics

Canada . 270 parts In-Stock

1+ parts

-

100+ parts

$2.290

1k+ parts

$2.210

10k+ parts

$2.170

270

-

$2.290

$2.210

$2.170

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 720 parts In-Stock

1+ parts

$3.676

100+ parts

-

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720

$3.676

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Vyrian

USA . 8,902 parts In-Stock

1+ parts

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8,902

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Anansix

USA . 2,033 parts In-Stock

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2,033

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 667 parts In-Stock

1+ parts

$1.348

100+ parts

-

1k+ parts

$1.213

10k+ parts

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667

$1.348

-

$1.213

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MKK Technologies

India . 250 parts In-Stock

1+ parts

$2.534

100+ parts

-

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250

$2.534

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DigiPath Technology Company

USA . 250 parts In-Stock

1+ parts

$2.534

100+ parts

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250

$2.534

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Corphita

USA . 598 parts In-Stock

1+ parts

$3.483

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598

$3.483

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Microchip USA

USA . 8,307 parts In-Stock

1+ parts

$16.184

100+ parts

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8,307

$16.184

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Parana Technologies

USA . 880 parts In-Stock

1+ parts

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100+ parts

$1.612

1k+ parts

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10k+ parts

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880

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$1.612

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Overview

Elevate your power control solutions with the STGW50H65DFB2-4 IGBT from STMicroelectronics. Renowned for their innovation and reliability, STMicroelectronics delivers a robust component designed to enhance efficiency in demanding applications. With its exceptional thermal performance and compact design, this N-channel IGBT excels in industrial drives, renewable energy systems, and automotive technologies, providing unmatched value and durability. Trust STMicroelectronics for quality that powers progress!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides excellent mechanical strength and durability, making it suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically offer higher efficiency and better performance in power applications, making them ideal for power control.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode enhances the reliability and efficiency of the device, facilitating easy integration into power circuits.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is suitable for a range of industrial and automotive uses.

Maximum VCEsat: 2 V

A low VCEsat ensures minimal conduction losses, which enhances the overall efficiency of power circuits.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization on PCBs and simplifies the assembly process.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical strength and ease of soldering, making installation straightforward.

Nominal Turn Off Time (toff): 247 ns

A fast turn-off time allows for increased switching frequencies, improving the performance in high-speed applications.

Number of Terminals: 4

Four terminals provide necessary connections for efficient operation and integration into circuit designs.

Maximum Power Dissipation (Abs): 272 W

High power dissipation capability ensures that this IGBT can handle demanding applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for better heat dissipation and provides secure mounting options in various applications.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature expands application possibilities into more demanding environments.

Maximum Collector-Emitter Voltage: 650 V

A high voltage rating allows the device to be used in various high-voltage power applications safely.

Transistor Element Material: SILICON

Silicon is a well-established material in power electronics, providing reliability and proven performance.

Maximum Gate-Emitter Voltage: 20 V

A high gate-emitter voltage tolerance enables compatible connections with a wide range of drive circuits.

Minimum Operating Temperature: -55 °C

The extended operating temperature range makes this IGBT suitable for diverse and extreme environments.

Maximum Collector Current (IC): 86 A

High collector current capacity allows this IGBT to drive substantial loads efficiently.

Maximum Gate-Emitter Threshold Voltage: 7 V

This threshold voltage reduces the risk of false triggering, enhancing the reliability of the device.

Terminal Position: SINGLE

Single terminal position simplifies board layout and makes circuit design more efficient.

Case Connection: COLLECTOR

Direct collector connection optimizes power handling and heat dissipation.

Nominal Turn On Time (ton): 34 ns

A low turn-on time allows for rapid switching applications, enhancing overall system responsiveness.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW50H65DFB2-4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

247 ns

Nominal Turn On Time (ton):

34 ns

Maximum VCEsat:

2 V

Trade Compliance

STGW50H65DFB2-4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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